Welcome!

News Feed Item

STATS ChipPAC's Advanced eWLB Provides a Versatile Integration Platform for the 2.5D and 3D Technology Evolution

eWLB Packaging Options Expanded to Include Interposer Technology, Flip Chip Interconnect and Complex 3D System-in-Package Configurations

SINGAPORE -- 6 NOVEMBER 2012, UNITED STATES -- (Marketwire) -- 11/05/12 -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today announced that its expanded packaging options for advanced embedded Wafer Level Ball Grid Array (eWLB) technology provide a versatile platform for the semiconductor industry's technology evolution from single or multi-die 2D package designs to 2.5D interposers and 3D System-in-Package (SiP) configurations.

The advancement of silicon scaling to 14 nanometer (nm) in support of higher performance, higher bandwidth and lower power consumption in portable and mobile devices is pushing the boundaries of emerging packaging technologies to smaller fan-out packaging designs with finer line/spacing as well as improved electrical performance and passive embedded technology capabilities. With its continuous innovation and extensive manufacturing experience in eWLB technology, STATS ChipPAC has established a flexible integration platform for 2.5D and 3D packaging at a lower overall cost with proven solutions that overcome manufacturing challenges pertaining to design, material compatibility and manufacturability in the industry today.

"We have taken the robust capabilities of eWLB and developed a solid integration platform for proven and successful 2.5D and 3D packaging integration. With our advanced eWLB technology we are able to provide our customers with the flexibility to integrate semiconductor die from diverse semiconductor processes and different silicon nodes into a cost effective interposer solution. We have also extended our eWLB capabilities into high-end flip chip Ball Grid Array (fcBGA) packaging to address future technical challenges in flip chip assembly as advanced technology nodes move below 28nm," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

Interposers are used to connect one active die to another in a 2.5D package configuration, enabling very dense interconnection with more effective heat dissipation, improved processing speed and the flexibility to integrate die from different manufacturing sources. While STATS ChipPAC continues to be in the forefront of the development and commercialisation of Through Silicon Via (TSV) as a 2.5D and 3D integration technology, the Company has in parallel developed new eWLB based interposers to support high density interconnection and routing of multiple dies in a proven, low-warpage packaging structure. The simplified materials supply chain and lower overall cost available with an eWLB based interposer provide a strong technology platform and path for customers to transition their devices to more advanced 2.5D and 3D packages.

With the inherent performance and cost advantages of eWLB, STATS ChipPAC is also effectively addressing some of the challenges in high end flip chip applications that require much finer bump pitches, higher input/output (I/O) densities and the elimination of stress on extreme low-k or ultra low-k (ELK/ULK) dielectric structures at advanced silicon wafer nodes. eWLB's fan-out packaging approach with its inherently lower stress, larger pad pitch, and redistribution layer (RDL) allows higher integration and routing density in less metal layers in an fcBGA substrate. The fine line width and spacing capabilities of eWLB provides more flexibility in the package routing design and offers superior electrical performance, enabling the number of layers in the organic substrate of a standard fcBGA device to be reduced.

"We are leveraging our eWLB technology to drive substrate simplification and cost reduction while achieving tighter line/spaces in a range of 2.5D to 3D configurations that deliver product advantages to our customers in terms of higher performance, higher frequencies, higher bandwidth and thinner package profiles. With eWLB we have the flexibility to embed multiple active and passive components in the same wafer level package with a vertical 3D interconnection that can be achieved without the use of TSV," said Dr. Han.

STATS ChipPAC's eWLB PoP solutions are available in either a single or double-sided configuration and provide a flexible integration platform for stacking a wide range of memory packages on top with a final stacked package height below 1.0mm. The number of interconnections between memory and processor can be up to 1024. The double-sided eWLB PoP technology features a flexible redistribution layer that can accommodate multiple active or passive devices in complex 3D SiP structures which enable very thin profiles, increased performance and superior warpage control.

STATS ChipPAC will be presenting the latest advancements in eWLB packaging and test at the International Wafer Level Packaging Conference that is being held from November 5th to 8th, 2012 in San Jose, California.

Forward-Looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual events or results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, the timing and impact of the expected closure of the Thailand Plant as well as the estimated associated cost for the closure; the amount of the business interruption insurance claim due to flooding of the Thailand Plant; the ability to shift production to other manufacturing locations, shortages in supply of key components and disruption in supply chain; general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices in 10 different countries. STATS ChipPAC is listed on the SGX-ST. Further information is available at www.statschippac.com. Information contained in this website does not constitute a part of this release.

Add to Digg Bookmark with del.icio.us Add to Newsvine

Investor Relations Contact:
Tham Kah Locke
Vice President of Corporate Finance
Tel: (65) 6824 7788
Fax: (65) 6720 7826
email: Email Contact

Media Contact:
Lisa Lavin
Deputy Director of Marketing Communications
Tel: (208) 867-9859
email: Email Contact

More Stories By Marketwired .

Copyright © 2009 Marketwired. All rights reserved. All the news releases provided by Marketwired are copyrighted. Any forms of copying other than an individual user's personal reference without express written permission is prohibited. Further distribution of these materials is strictly forbidden, including but not limited to, posting, emailing, faxing, archiving in a public database, redistributing via a computer network or in a printed form.

Latest Stories
With the proliferation of both SQL and NoSQL databases, organizations can now target specific fit-for-purpose database tools for their different application needs regarding scalability, ease of use, ACID support, etc. Platform as a Service offerings make this even easier now, enabling developers to roll out their own database infrastructure in minutes with minimal management overhead. However, this same amount of flexibility also comes with the challenges of picking the right tool, on the right ...
More and more companies are looking to microservices as an architectural pattern for breaking apart applications into more manageable pieces so that agile teams can deliver new features quicker and more effectively. What this pattern has done more than anything to date is spark organizational transformations, setting the foundation for future application development. In practice, however, there are a number of considerations to make that go beyond simply “build, ship, and run,” which changes ho...
SYS-CON Events announced today that AppNeta, the leader in performance insight for business-critical web applications, will exhibit and present at SYS-CON's @DevOpsSummit at Cloud Expo New York, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. AppNeta is the only application performance monitoring (APM) company to provide solutions for all applications – applications you develop internally, business-critical SaaS applications you use and the networks that deli...
Father business cycles and digital consumers are forcing enterprises to respond faster to customer needs and competitive demands. Successful integration of DevOps and Agile development will be key for business success in today’s digital economy. In his session at DevOps Summit, Pradeep Prabhu, Co-Founder & CEO of Cloudmunch, covered the critical practices that enterprises should consider to seamlessly integrate Agile and DevOps processes, barriers to implementing this in the enterprise, and pr...
Eighty percent of a data scientist’s time is spent gathering and cleaning up data, and 80% of all data is unstructured and almost never analyzed. Cognitive computing, in combination with Big Data, is changing the equation by creating data reservoirs and using natural language processing to enable analysis of unstructured data sources. This is impacting every aspect of the analytics profession from how data is mined (and by whom) to how it is delivered. This is not some futuristic vision: it's ha...
Let’s face it, embracing new storage technologies, capabilities and upgrading to new hardware often adds complexity and increases costs. In his session at 18th Cloud Expo, Seth Oxenhorn, Vice President of Business Development & Alliances at FalconStor, will discuss how a truly heterogeneous software-defined storage approach can add value to legacy platforms and heterogeneous environments. The result reduces complexity, significantly lowers cost, and provides IT organizations with improved effi...
With the Apple Watch making its way onto wrists all over the world, it’s only a matter of time before it becomes a staple in the workplace. In fact, Forrester reported that 68 percent of technology and business decision-makers characterize wearables as a top priority for 2015. Recognizing their business value early on, FinancialForce.com was the first to bring ERP to wearables, helping streamline communication across front and back office functions. In his session at @ThingsExpo, Kevin Roberts...
Data-as-a-Service is the complete package for the transformation of raw data into meaningful data assets and the delivery of those data assets. In her session at 18th Cloud Expo, Lakshmi Randall, an industry expert, analyst and strategist, will address: What is DaaS (Data-as-a-Service)? Challenges addressed by DaaS Vendors that are enabling DaaS Architecture options for DaaS
One of the bewildering things about DevOps is integrating the massive toolchain including the dozens of new tools that seem to crop up every year. Part of DevOps is Continuous Delivery and having a complex toolchain can add additional integration and setup to your developer environment. In his session at @DevOpsSummit at 18th Cloud Expo, Miko Matsumura, Chief Marketing Officer of Gradle Inc., will discuss which tools to use in a developer stack, how to provision the toolchain to minimize onboa...
Cognitive Computing is becoming the foundation for a new generation of solutions that have the potential to transform business. Unlike traditional approaches to building solutions, a cognitive computing approach allows the data to help determine the way applications are designed. This contrasts with conventional software development that begins with defining logic based on the current way a business operates. In her session at 18th Cloud Expo, Judith S. Hurwitz, President and CEO of Hurwitz & ...
It's easy to assume that your app will run on a fast and reliable network. The reality for your app's users, though, is often a slow, unreliable network with spotty coverage. What happens when the network doesn't work, or when the device is in airplane mode? You get unhappy, frustrated users. An offline-first app is an app that works, without error, when there is no network connection.
The principles behind DevOps are not new - for decades people have been automating system administration and decreasing the time to deploy apps and perform other management tasks. However, only recently did we see the tools and the will necessary to share the benefits and power of automation with a wider circle of people. In his session at DevOps Summit, Bernard Sanders, Chief Technology Officer at CloudBolt Software, explored the latest tools including Puppet, Chef, Docker, and CMPs needed to...
The cloud promises new levels of agility and cost-savings for Big Data, data warehousing and analytics. But it’s challenging to understand all the options – from IaaS and PaaS to newer services like HaaS (Hadoop as a Service) and BDaaS (Big Data as a Service). In her session at @BigDataExpo at @ThingsExpo, Hannah Smalltree, a director at Cazena, will provide an educational overview of emerging “as-a-service” options for Big Data in the cloud. This is critical background for IT and data profes...
SYS-CON Events announced today that Men & Mice, the leading global provider of DNS, DHCP and IP address management overlay solutions, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. The Men & Mice Suite overlay solution is already known for its powerful application in heterogeneous operating environments, enabling enterprises to scale without fuss. Building on a solid range of diverse platform support,...
Advances in technology and ubiquitous connectivity have made the utilization of a dispersed workforce more common. Whether that remote team is located across the street or country, management styles/ approaches will have to be adjusted to accommodate this new dynamic. In his session at 17th Cloud Expo, Sagi Brody, Chief Technology Officer at Webair Internet Development Inc., focused on the challenges of managing remote teams, providing real-world examples that demonstrate what works and what do...