Welcome!

News Feed Item

Semiconductor Market Updates: Networking Equipment Market Slows in Second Half of 2012, Intel Dominates Mid-End Wafers, 3DIC Material Market to Reach $2B in 2017

FARMINGTON, Conn., Nov. 19, 2012 /PRNewswire-iReach/ -- In the networking IC market, growth continues to be driven by infrastructure markets supporting the growing volume of data and users on the Internet. Meanwhile, according to new research from Yole Developpement, the equipment and materials business will quadruple over the next five years in the 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and flip-chip wafer segments.

(Photo: http://photos.prnewswire.com/prnh/20121119/CG16190)

Global Information Inc (GII) highlights new market research from our premium partner publishers that will benefit executives involved in the global market for semiconductor materials and manufacturing.

2012 Networking Market Tracker

The overall networking equipment market has slowed in the second half of 2012 with many customers decelerating and reducing spending on hardware. Most of the large equipment OEMs are predicting that fourth quarter revenues will remain flat sequentially from the third quarter, due to exposure to Europe where service providers have cut spending and increasing competition from lower cost domestic equipment makers in China.

The networking IC market consists of products that are used in network equipment including network switches, routers, modems, adapters, cards, line cards, cable infrastructure, DSLAM, and other central office equipment. This market is driven by continued high growth in the infrastructure markets supporting the growing volume of data and users on the Internet.

Capital expenditures for data centers are expected to be up double digits this year, so next year there could be a slowdown. However, this market continues to advance at a pace not seen in other traditional segments. Some OEM customers that serve this market include Cisco Systems, F5 Networks, Juniper Networks, Hewlett Packard, and Huawei. Cisco has the lions share, but the other network equipment providers are steadily gaining momentum in the market.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/data237351-2012-networking-market-tracker.html

Equipment & Materials for 3DIC & Wafer-Level-Packaging

The global material market is expected to grow from approximately $590 million this year to over $2 billion by 2017 at a compound annual growth rate of 24%. Growth in the global market for 3DIC and wafer-level-packaging will be driven mainly by the expansion of 2,5D interposers and 3D TSV& WLP platforms. However, Yole Developpement forecasts a a slight decrease  in 2012 due to the fact that high-volume production in 3D TSV, FO WLP, and 3D WLP has not yet begun.

This report includes an Excel database with detailed activity of over 375 small, medium and large equipment and material suppliers ranging from front-end, back-end assembly, PCB, LCD, and solar divisions.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/yd194054-equipment-materials-3dic-wafer-level-packaging.html

Wafer Packaging Fabs Database 2012

Stay informed on global wafer-scale packaging activity of 275 middle-end factories with this new database from Yole Developpement.  This unique tool provides a global overview of "who is doing what" in this emerging ecosystem. The database provide details concerning each fab location by fab function, customers, JV, capacities by wafer size, and more.

Major companies cited in the database include: Amkor, Analog Devices, ASE, ASTRI, Avago, Bosch, BEA-LETI, China WLCSP, ChipBond, ChipMOS. EPCOS-TDK, Epson Electronics, Fairchild, Flip Chip international, Flip Chip Millennium, Fraunhofer, Freescale, Fujikura, Fujitsu Integrated Microtechnology, Global

Foundries, IBM, IMEC, Infineon, INTEL, ITRI, JCET, Maxim IC, NANIUM, NEPES, NXP, OptoPAC, PTI, Renesas, Rohm, Samsung, SMIC, SK Hynix, Sony, SPIL, STATS ChipPAC, STMicroelectronics, Teramikros, Texas Instrument, Tezzaron, Toshiba, TriQuint, TSMC, UMC Global, and Xintec.

An Executive Summary for this report and free sample pages from the full document are available at http://www.giiresearch.com/report/yd206538-wafer-packaging-fab-database.html

About Global Information Inc. Global Information (GII) (http://www.giiresearch.com) is an information service company partnering with over 300 research companies around the world. Global Information has been in the business of distributing technical and market research for more than 25 years. Expanded from its original headquarters in Japan, Global Information now has offices in Korea, Taiwan, Singapore, Europe and the United States.

Media Contact:

Jeremy Palaia Global Information, Inc., 1-860-674-8796, [email protected]

News distributed by PR Newswire iReach: https://ireach.prnewswire.com

SOURCE Global Information, Inc.

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today that Enzu, a leading provider of cloud hosting solutions, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Enzu’s mission is to be the leading provider of enterprise cloud solutions worldwide. Enzu enables online businesses to use its IT infrastructure to their competitive advantage. By offering a suite of proven hosting and management services, Enzu wants companies to foc...
The IoT is changing the way enterprises conduct business. In his session at @ThingsExpo, Eric Hoffman, Vice President at EastBanc Technologies, discuss how businesses can gain an edge over competitors by empowering consumers to take control through IoT. We'll cite examples such as a Washington, D.C.-based sports club that leveraged IoT and the cloud to develop a comprehensive booking system. He'll also highlight how IoT can revitalize and restore outdated business models, making them profitable...
SoftLayer operates a global cloud infrastructure platform built for Internet scale. With a global footprint of data centers and network points of presence, SoftLayer provides infrastructure as a service to leading-edge customers ranging from Web startups to global enterprises. SoftLayer's modular architecture, full-featured API, and sophisticated automation provide unparalleled performance and control. Its flexible unified platform seamlessly spans physical and virtual devices linked via a world...
SYS-CON Events announced today that Super Micro Computer, Inc., a global leader in Embedded and IoT solutions, will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Supermicro (NASDAQ: SMCI), the leading innovator in high-performance, high-efficiency server technology, is a premier provider of advanced server Building Block Solutions® for Data Center, Cloud Computing, Enterprise IT, Hadoop/Big Data, HPC and ...
As cloud and storage projections continue to rise, the number of organizations moving to the cloud is escalating and it is clear cloud storage is here to stay. However, is it secure? Data is the lifeblood for government entities, countries, cloud service providers and enterprises alike and losing or exposing that data can have disastrous results. There are new concepts for data storage on the horizon that will deliver secure solutions for storing and moving sensitive data around the world. ...
SYS-CON Events announced today that BMC Software has been named "Siver Sponsor" of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2015 at the Javits Center in New York, New York. BMC is a global leader in innovative software solutions that help businesses transform into digital enterprises for the ultimate competitive advantage. BMC Digital Enterprise Management is a set of innovative IT solutions designed to make digital business fast, seamless, and optimized from mainframe to mo...
In his keynote at 18th Cloud Expo, Andrew Keys, Co-Founder of ConsenSys Enterprise, will provide an overview of the evolution of the Internet and the Database and the future of their combination – the Blockchain. Andrew Keys is Co-Founder of ConsenSys Enterprise. He comes to ConsenSys Enterprise with capital markets, technology and entrepreneurial experience. Previously, he worked for UBS investment bank in equities analysis. Later, he was responsible for the creation and distribution of life ...
With major technology companies and startups seriously embracing IoT strategies, now is the perfect time to attend @ThingsExpo 2016 in New York and Silicon Valley. Learn what is going on, contribute to the discussions, and ensure that your enterprise is as "IoT-Ready" as it can be! Internet of @ThingsExpo, taking place Nov 3-5, 2015, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 17th Cloud Expo and will feature technical sessions from a rock star conference faculty ...
SYS-CON Events announced today that AppNeta, the leader in performance insight for business-critical web applications, will exhibit and present at SYS-CON's @DevOpsSummit at Cloud Expo New York, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. AppNeta is the only application performance monitoring (APM) company to provide solutions for all applications – applications you develop internally, business-critical SaaS applications you use and the networks that deli...
Customer experience has become a competitive differentiator for companies, and it’s imperative that brands seamlessly connect the customer journey across all platforms. With the continued explosion of IoT, join us for a look at how to build a winning digital foundation in the connected era – today and in the future. In his session at @ThingsExpo, Chris Nguyen, Group Product Marketing Manager at Adobe, will discuss how to successfully leverage mobile, rapidly deploy content, capture real-time d...
SYS-CON Events announced today that ContentMX, the marketing technology and services company with a singular mission to increase engagement and drive more conversations for enterprise, channel and SMB technology marketers, has been named “Sponsor & Exhibitor Lounge Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York. “CloudExpo is a great opportunity to start a conversation with new prospects, but what happens after the...
IoT generates lots of temporal data. But how do you unlock its value? How do you coordinate the diverse moving parts that must come together when developing your IoT product? What are the key challenges addressed by Data as a Service? How does cloud computing underlie and connect the notions of Digital and DevOps What is the impact of the API economy? What is the business imperative for Cognitive Computing? Get all these questions and hundreds more like them answered at the 18th Cloud Expo...
SYS-CON Events announced today the How to Create Angular 2 Clients for the Cloud Workshop, being held June 7, 2016, in conjunction with 18th Cloud Expo | @ThingsExpo, at the Javits Center in New York, NY. Angular 2 is a complete re-write of the popular framework AngularJS. Programming in Angular 2 is greatly simplified. Now it’s a component-based well-performing framework. The immersive one-day workshop led by Yakov Fain, a Java Champion and a co-founder of the IT consultancy Farata Systems and...
SYS-CON Events announced today that Isomorphic Software will exhibit at SYS-CON's [email protected] at Cloud Expo New York, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. Isomorphic Software provides the SmartClient HTML5/AJAX platform, the most advanced technology for building rich, high-productivity enterprise web applications for any device. SmartClient couples the industry’s broadest, deepest UI component set with a java server framework to deliver an end-...
The cloud market growth today is largely in public clouds. While there is a lot of spend in IT departments in virtualization, these aren’t yet translating into a true “cloud” experience within the enterprise. What is stopping the growth of the “private cloud” market? In his general session at 18th Cloud Expo, Nara Rajagopalan, CEO of Accelerite, will explore the challenges in deploying, managing, and getting adoption for a private cloud within an enterprise. What are the key differences betwee...