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Research and Markets: Design Analysis Ericsson Report - W-CDMA/HSPA+ DUW 30 01 Digital Baseband Unit

Research and Markets (http://www.researchandmarkets.com/research/42g7rh/design_analysis) has announced the addition of EJL Wireless Research's new report "Design Analysis Ericsson W-CDMA/HSPA+ DUW 30 01 Digital Baseband Unit" to their offering.

This report covers the design analysis of an Ericsson W-CDMA/HSPA+ baseband digital unit. This unit is part of the RBS610x/6201/6301/6601 base station platform for Ericsson W-CDMA. The unit was manufactured in Q2 2011.

Component and semiconductor suppliers mentioned in this report include: Analog Devices, Bourns, Broadcom, Coilcraft, Epson-Toyocom, ETAL Fairchild Semiconductor, Freescale Semiconductor, Hynix, Infineon Technologies, Integrated Device Technology, Lantiq, lattice Semiconductor, LSI Logic, Maxim Integrated Products, Micron Technology, National Semiconductor, Nihon Denpa Kogyo, Nippon Chemi-Con, NXP Semiconductors, ON Semiconductor, PMC-Sierra, Panasonic, Pulse Engineering, Rakon, Sanyo Electric, Semtech, Spansion, STMicroelectronics, TDK-Epcos, Texas Instruments, Vishay Semiconductors & Xilinx.

Features:

- Complete Part Number/Marking

- Component Manufacturer Identification

- Function Component Description

- Package Type

Total Tables: 8

Total Exhibits: 39

Important Note: There is NO component pricing contained within the report.

Key Topics Covered:

EXECUTIVE SUMMARY

Active/Passive Component Summary

CHAPTER 1: ERICSSON RBS6000 BTS SYSTEM

Overview of RBS6101/6102/6201/6202/6301/6601 Product Offering

CHAPTER 2: DUW MECHANICAL ANALYSIS

Mechanical Analysis

CHAPTER 3: BASEBAND PROCESSING BOARD SUBSYSTEM

Semiconductor Heat Sinks

CHAPTER 4: BOARD PROCESSOR AND RF/IF INTERFACE BOARD SUBSYSTEM

Semiconductor Heat Sinks

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

For more information visit http://www.researchandmarkets.com/research/42g7rh/design_analysis

Source: EJL Wireless Research

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