Welcome!

News Feed Item

KLA-Tencor Announces Two Additions to Litho/Etch Process Control Portfolio

New metrology and inspection tools facilitate advanced patterning techniques for manufacturing sub-20nm memory and microprocessor chips

MILPITAS, Calif., Feb. 25, 2013 /PRNewswire/ -- At the SPIE Advanced Lithography conference, KLA-Tencor Corporation (NASDAQ: KLAC) announced its SpectraShape 9000 optical critical dimension (CD) metrology system and BDR300 backside defect inspection and review module. The SpectraShape 9000 is a new metrology system capable of monitoring the shapes of three-dimensional transistors, memory cells and other key structures that enable high-performance memory and microprocessor chips. The BDR300 inspects and reviews the back side of the wafer for defects that can cause patterning problems on the wafer's front side. The two new systems are designed to enable volume production of integrated circuits at sub-20nm design rules.

"In this era of highly extended 193nm immersion lithography, our customers are innovating on several fronts to deal with process tolerances in lithography and etch that have become remarkably tight," said Brian Trafas, Ph.D., chief marketing officer at KLA-Tencor. "The two products we have launched today tackle two key process control issues in this area: scanner focus-related defects and failure or underperformance of finFETs, vertically stacked NANDs, and other three-dimensional structures, caused by small deviations in shape. The BDR300 and SpectraShape 9000 are designed to help our customers navigate the monumental challenges they are facing today in lithography and etch."

The new SpectraShape 9000 introduces a laser-driven plasma light source and several other significant advances that enable leading-edge dimensional metrology capability for a broad range of materials and structures. The SpectraShape 9000 features higher sensitivity and throughput than its predecessor in order to accommodate the industry's need for tighter process control at sub-20nm nodes—a need to measure more sites per wafer on an increasing number of layers. It also supports innovative metrology targets designed for multiple-patterning lithography.

The new BDR300 back-side inspection and review module for the CIRCL cluster tool features a dramatic improvement in defect sensitivity over that of its predecessor, allowing fabs to find and classify sub-micron back-side defects, which can agglomerate and affect yield at advanced nodes. The CIRCL cluster is now available as a stand-alone back-side inspection and review system, a configuration designed to support an increasing industry requirement to inspect the back sides of wafers before wafers enter the scanner. Clean wafer back sides reduce the probability of contaminating the scanner chuck and affecting subsequent product.

Multiple SpectraShape 9000 shape metrology systems have been installed at leading logic and memory chip manufacturers, where they are replacing existing CD/shape metrology tools for new technology development and ramp or fulfilling requirements for additional metrology capacity. The first CIRCL tools containing the BDR300 module have also been installed and are being used for proactive scanner monitoring as well as traditional after-develop defect inspection. To maintain the high performance and productivity demanded by leading-edge production, the SpectraShape and CIRCL tools are backed by KLA-Tencor's global, comprehensive service network.

More information on the SpectraShape 9000 system can be found on the SpectraShape product web page. For more information on the BDR300 module or the CIRCL system, please visit the CIRCL product web page.

About KLA-Tencor:
KLA-Tencor Corporation, a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor, LED and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for more than 35 years. Headquartered in Milpitas, Calif., KLA-Tencor has dedicated customer operations and service centers around the world. Additional information may be found at www.kla-tencor.com (KLAC-P).

Forward Looking Statements:
Statements in this press release other than historical facts, such as statements regarding the SpectraShape 9000's, CIRCL's or BDR300's expected performance, trends in the semiconductor industry and the anticipated challenges associated with them, expected uses of the SpectraShape 9000, CIRCL or BDR300 by KLA-Tencor's customers, expected compatibility of the SpectraShape 9000, CIRCL or BDR300 with other KLA-Tencor tools, and the anticipated cost, operational and other benefits realizable by users of the SpectraShape 9000, CIRCL or BDR300 tools, are forward-looking statements, and are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations, and involve a number of risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including delays in the adoption of new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unanticipated technological challenges or limitations that affect the implementation, performance or use of KLA-Tencor's products.

SOURCE KLA-Tencor Corporation

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
Is advanced scheduling in Kubernetes achievable? Yes, however, how do you properly accommodate every real-life scenario that a Kubernetes user might encounter? How do you leverage advanced scheduling techniques to shape and describe each scenario in easy-to-use rules and configurations? In his session at @DevOpsSummit at 21st Cloud Expo, Oleg Chunikhin, CTO at Kublr, will answer these questions and demonstrate techniques for implementing advanced scheduling. For example, using spot instances ...
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend 21st Cloud Expo October 31 - November 2, 2017, at the Santa Clara Convention Center, CA, and June 12-14, 2018, at the Javits Center in New York City, NY, and learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.
SYS-CON Events announced today that Yuasa System will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Yuasa System is introducing a multi-purpose endurance testing system for flexible displays, OLED devices, flexible substrates, flat cables, and films in smartphones, wearables, automobiles, and healthcare.
SYS-CON Events announced today that CAST Software will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. CAST was founded more than 25 years ago to make the invisible visible. Built around the idea that even the best analytics on the market still leave blind spots for technical teams looking to deliver better software and prevent outages, CAST provides the software intelligence that matter ...
SYS-CON Events announced today that Daiya Industry will exhibit at the Japanese Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Ruby Development Inc. builds new services in short period of time and provides a continuous support of those services based on Ruby on Rails. For more information, please visit https://github.com/RubyDevInc.
When it comes to cloud computing, the ability to turn massive amounts of compute cores on and off on demand sounds attractive to IT staff, who need to manage peaks and valleys in user activity. With cloud bursting, the majority of the data can stay on premises while tapping into compute from public cloud providers, reducing risk and minimizing need to move large files. In his session at 18th Cloud Expo, Scott Jeschonek, Director of Product Management at Avere Systems, discussed the IT and busine...
SYS-CON Events announced today that Evatronix will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Evatronix SA offers comprehensive solutions in the design and implementation of electronic systems, in CAD / CAM deployment, and also is a designer and manufacturer of advanced 3D scanners for professional applications.
As businesses evolve, they need technology that is simple to help them succeed today and flexible enough to help them build for tomorrow. Chrome is fit for the workplace of the future — providing a secure, consistent user experience across a range of devices that can be used anywhere. In her session at 21st Cloud Expo, Vidya Nagarajan, a Senior Product Manager at Google, will take a look at various options as to how ChromeOS can be leveraged to interact with people on the devices, and formats th...
First generation hyperconverged solutions have taken the data center by storm, rapidly proliferating in pockets everywhere to provide further consolidation of floor space and workloads. These first generation solutions are not without challenges, however. In his session at 21st Cloud Expo, Wes Talbert, a Principal Architect and results-driven enterprise sales leader at NetApp, will discuss how the HCI solution of tomorrow will integrate with the public cloud to deliver a quality hybrid cloud e...
DevOps at Cloud Expo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 21st Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to w...
DevOps is under attack because developers don’t want to mess with infrastructure. They will happily own their code into production, but want to use platforms instead of raw automation. That’s changing the landscape that we understand as DevOps with both architecture concepts (CloudNative) and process redefinition (SRE). Rob Hirschfeld’s recent work in Kubernetes operations has led to the conclusion that containers and related platforms have changed the way we should be thinking about DevOps and...
SYS-CON Events announced today that Taica will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Taica manufacturers Alpha-GEL brand silicone components and materials, which maintain outstanding performance over a wide temperature range -40C to +200C. For more information, visit http://www.taica.co.jp/english/.
When it comes to cloud computing, the ability to turn massive amounts of compute cores on and off on demand sounds attractive to IT staff, who need to manage peaks and valleys in user activity. With cloud bursting, the majority of the data can stay on premises while tapping into compute from public cloud providers, reducing risk and minimizing need to move large files. In his session at 18th Cloud Expo, Scott Jeschonek, Director of Product Management at Avere Systems, discussed the IT and busine...
SYS-CON Events announced today that SourceForge has been named “Media Sponsor” of SYS-CON's 21st International Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. SourceForge is the largest, most trusted destination for Open Source Software development, collaboration, discovery and download on the web serving over 32 million viewers, 150 million downloads and over 460,000 active development projects each and every month.
Enterprises have taken advantage of IoT to achieve important revenue and cost advantages. What is less apparent is how incumbent enterprises operating at scale have, following success with IoT, built analytic, operations management and software development capabilities – ranging from autonomous vehicles to manageable robotics installations. They have embraced these capabilities as if they were Silicon Valley startups. As a result, many firms employ new business models that place enormous impor...