|By PR Newswire||
|February 25, 2013 04:15 PM EST||
MILPITAS, Calif., Feb. 25, 2013 /PRNewswire/ -- At the SPIE Advanced Lithography conference, KLA-Tencor Corporation (NASDAQ: KLAC) announced its SpectraShape™ 9000 optical critical dimension (CD) metrology system and BDR300™ backside defect inspection and review module. The SpectraShape 9000 is a new metrology system capable of monitoring the shapes of three-dimensional transistors, memory cells and other key structures that enable high-performance memory and microprocessor chips. The BDR300 inspects and reviews the back side of the wafer for defects that can cause patterning problems on the wafer's front side. The two new systems are designed to enable volume production of integrated circuits at sub-20nm design rules.
"In this era of highly extended 193nm immersion lithography, our customers are innovating on several fronts to deal with process tolerances in lithography and etch that have become remarkably tight," said Brian Trafas, Ph.D., chief marketing officer at KLA-Tencor. "The two products we have launched today tackle two key process control issues in this area: scanner focus-related defects and failure or underperformance of finFETs, vertically stacked NANDs, and other three-dimensional structures, caused by small deviations in shape. The BDR300 and SpectraShape 9000 are designed to help our customers navigate the monumental challenges they are facing today in lithography and etch."
The new SpectraShape 9000 introduces a laser-driven plasma light source and several other significant advances that enable leading-edge dimensional metrology capability for a broad range of materials and structures. The SpectraShape 9000 features higher sensitivity and throughput than its predecessor in order to accommodate the industry's need for tighter process control at sub-20nm nodes—a need to measure more sites per wafer on an increasing number of layers. It also supports innovative metrology targets designed for multiple-patterning lithography.
The new BDR300 back-side inspection and review module for the CIRCL™ cluster tool features a dramatic improvement in defect sensitivity over that of its predecessor, allowing fabs to find and classify sub-micron back-side defects, which can agglomerate and affect yield at advanced nodes. The CIRCL cluster is now available as a stand-alone back-side inspection and review system, a configuration designed to support an increasing industry requirement to inspect the back sides of wafers before wafers enter the scanner. Clean wafer back sides reduce the probability of contaminating the scanner chuck and affecting subsequent product.
Multiple SpectraShape 9000 shape metrology systems have been installed at leading logic and memory chip manufacturers, where they are replacing existing CD/shape metrology tools for new technology development and ramp or fulfilling requirements for additional metrology capacity. The first CIRCL tools containing the BDR300 module have also been installed and are being used for proactive scanner monitoring as well as traditional after-develop defect inspection. To maintain the high performance and productivity demanded by leading-edge production, the SpectraShape and CIRCL tools are backed by KLA-Tencor's global, comprehensive service network.
More information on the SpectraShape 9000 system can be found on the SpectraShape product web page. For more information on the BDR300 module or the CIRCL system, please visit the CIRCL product web page.
KLA-Tencor Corporation, a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor, LED and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for more than 35 years. Headquartered in Milpitas, Calif., KLA-Tencor has dedicated customer operations and service centers around the world. Additional information may be found at www.kla-tencor.com (KLAC-P).
Forward Looking Statements:
Statements in this press release other than historical facts, such as statements regarding the SpectraShape 9000's, CIRCL's or BDR300's expected performance, trends in the semiconductor industry and the anticipated challenges associated with them, expected uses of the SpectraShape 9000, CIRCL or BDR300 by KLA-Tencor's customers, expected compatibility of the SpectraShape 9000, CIRCL or BDR300 with other KLA-Tencor tools, and the anticipated cost, operational and other benefits realizable by users of the SpectraShape 9000, CIRCL or BDR300 tools, are forward-looking statements, and are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations, and involve a number of risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including delays in the adoption of new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unanticipated technological challenges or limitations that affect the implementation, performance or use of KLA-Tencor's products.
SOURCE KLA-Tencor Corporation
The APN DevOps Competency highlights APN Partners who demonstrate deep capabilities delivering continuous integration, continuous delivery, and configuration management. They help customers transform their business to be more efficient and agile by leveraging the AWS platform and DevOps principles.
Oct. 8, 2015 07:30 PM EDT Reads: 211
The Internet of Things (IoT) is growing rapidly by extending current technologies, products and networks. By 2020, Cisco estimates there will be 50 billion connected devices. Gartner has forecast revenues of over $300 billion, just to IoT suppliers. Now is the time to figure out how you’ll make money – not just create innovative products. With hundreds of new products and companies jumping into the IoT fray every month, there’s no shortage of innovation. Despite this, McKinsey/VisionMobile data...
Oct. 8, 2015 07:30 PM EDT Reads: 162
The buzz continues for cloud, data analytics and the Internet of Things (IoT) and their collective impact across all industries. But a new conversation is emerging - how do companies use industry disruption and technology enablers to lead in markets undergoing change, uncertainty and ambiguity? Organizations of all sizes need to evolve and transform, often under massive pressure, as industry lines blur and merge and traditional business models are assaulted and turned upside down. In this new da...
Oct. 8, 2015 07:30 PM EDT Reads: 233
As-a-service models offer huge opportunities, but also complicate security. It may seem that the easiest way to migrate to a new architectural model is to let others, experts in their field, do the work. This has given rise to many as-a-service models throughout the industry and across the entire technology stack, from software to infrastructure. While this has unlocked huge opportunities to accelerate the deployment of new capabilities or increase economic efficiencies within an organization, i...
Oct. 8, 2015 07:15 PM EDT Reads: 228
There are so many tools and techniques for data analytics that even for a data scientist the choices, possible systems, and even the types of data can be daunting. In his session at @ThingsExpo, Chris Harrold, Global CTO for Big Data Solutions for EMC Corporation, will show how to perform a simple, but meaningful analysis of social sentiment data using freely available tools that take only minutes to download and install. Participants will get the download information, scripts, and complete en...
Oct. 8, 2015 07:15 PM EDT Reads: 251
Containers are changing the security landscape for software development and deployment. As with any security solutions, security approaches that work for developers, operations personnel and security professionals is a requirement. In his session at @DevOpsSummit, Kevin Gilpin, CTO and Co-Founder of Conjur, will discuss various security considerations for container-based infrastructure and related DevOps workflows.
Oct. 8, 2015 07:15 PM EDT Reads: 187
Today’s connected world is moving from devices towards things, what this means is that by using increasingly low cost sensors embedded in devices we can create many new use cases. These span across use cases in cities, vehicles, home, offices, factories, retail environments, worksites, health, logistics, and health. These use cases rely on ubiquitous connectivity and generate massive amounts of data at scale. These technologies enable new business opportunities, ways to optimize and automate, al...
Oct. 8, 2015 07:15 PM EDT Reads: 131
Containers are revolutionizing the way we deploy and maintain our infrastructures, but monitoring and troubleshooting in a containerized environment can still be painful and impractical. Understanding even basic resource usage is difficult - let alone tracking network connections or malicious activity. In his session at DevOps Summit, Gianluca Borello, Sr. Software Engineer at Sysdig, will cover the current state of the art for container monitoring and visibility, including pros / cons and li...
Oct. 8, 2015 07:00 PM EDT Reads: 177
Chris Van Tuin, Chief Technologist for the Western US at Red Hat, has over 20 years of experience in IT and Software. Since joining Red Hat in 2005, he has been architecting solutions for strategic customers and partners with a focus on emerging technologies including IaaS, PaaS, and DevOps. He started his career at Intel in IT and Managed Hosting followed by leadership roles in services and sales engineering at Loudcloud and Linux startups.
Oct. 8, 2015 07:00 PM EDT Reads: 155
The IoT market is on track to hit $7.1 trillion in 2020. The reality is that only a handful of companies are ready for this massive demand. There are a lot of barriers, paint points, traps, and hidden roadblocks. How can we deal with these issues and challenges? The paradigm has changed. Old-style ad-hoc trial-and-error ways will certainly lead you to the dead end. What is mandatory is an overarching and adaptive approach to effectively handle the rapid changes and exponential growth.
Oct. 8, 2015 07:00 PM EDT
IT data is typically silo'd by the various tools in place. Unifying all the log, metric and event data in one analytics platform stops finger pointing and provides the end-to-end correlation. Logs, metrics and custom event data can be joined to tell the holistic story of your software and operations. For example, users can correlate code deploys to system performance to application error codes.
Oct. 8, 2015 06:45 PM EDT Reads: 201
Between the compelling mockups and specs produced by analysts, and resulting applications built by developers, there exists a gulf where projects fail, costs spiral, and applications disappoint. Methodologies like Agile attempt to address this with intensified communication, with partial success but many limitations. In his session at DevOps Summit, Charles Kendrick, CTO and Chief Architect at Isomorphic Software, will present a revolutionary model enabled by new technologies. Learn how busine...
Oct. 8, 2015 06:45 PM EDT Reads: 253
Manufacturing has widely adopted standardized and automated processes to create designs, build them, and maintain them through their life cycle. However, many modern manufacturing systems go beyond mechanized workflows to introduce empowered workers, flexible collaboration, and rapid iteration. Such behaviors also characterize open source software development and are at the heart of DevOps culture, processes, and tooling.
Oct. 8, 2015 06:00 PM EDT Reads: 1,069
DevOps is gaining traction in the federal government – and for good reasons. Heightened user expectations are pushing IT organizations to accelerate application development and support more innovation. At the same time, budgetary constraints require that agencies find ways to decrease the cost of developing, maintaining, and running applications. IT now faces a daunting task: do more and react faster than ever before – all with fewer resources.
Oct. 8, 2015 06:00 PM EDT Reads: 377