Welcome!

News Feed Item

Jumpstart and explore sensor fusion applications with new Sensor Hub BoosterPack from Texas Instruments

Seven on-board motion and environmental sensors enable applications ranging from GPS tracking, home and building automation, and portable consumer electronics

SAN JOSE, Calif., April 23, 2013 /PRNewswire/ -- Expanding its low-cost microcontroller (MCU) development ecosystem with sensor fusion technology, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced the Sensor Hub BoosterPack for the Tiva™ C Series TM4C123G LaunchPad at DESIGN West 2013. This new Sensor Hub BoosterPack (BOOSTXL-SENSHUB) is a cost-effective, plug-in daughter card that allows ARM® Cortex™-M4 MCU developers to create products with up to seven types of motion and environmental sensing capabilities. This easy-to-use BoosterPack and accompanying TivaWare™ software enables measurement of pressure, humidity, ambient and infrared (IR) light along with temperature and motion (including acceleration, orientation and compass). Developers can use the BOOSTXL-SENSHUB board to create many sensor fusion applications, including global positioning system (GPS) tracking, home and building automation, portable consumer electronics, games and many more applications.

The BOOSTXL-SENSHUB BoosterPack can leverage the advanced processing, floating-point and communication capabilities of TI's Tiva C Series TM4C123GH6 ARM Cortex-M4 MCU for enhanced sensor accuracy. TI's TivaWare software, provided with the LaunchPad kit, includes an easy-to-use Sensor Driver Library, providing developers with a sensor fusion API and several example applications that demonstrate how each of the sensors operate individually or in collaboration. The 'Air Mouse' is an example of a sensor fusion application that can be used to kick start design ideas and innovation for other multi-sensor applications. The BOOSTXL-SENSHUB can also be bundled with TI's connectivity solutions, enabling developers to "cut the cords" and create wireless sensing applications. 

Similarly, TivaWare software also includes the Peripheral Driver Library to configure and operate the on-chip peripherals with a set of example applications. These applications demonstrate the capabilities of the Tiva TM4C123GH6 MCU, as well as provide a starting point for users to develop the final application for use on the Tiva C Series LaunchPad and BOOSTXL-SENSHUB BoosterPack

Features and benefits of the BOOSTXL-SENSHUB kit:

  • Hardware compatible with existing MSP430™ (MSP-EXP430G2) and C2000™ (LAUNCHXL-F28027) LaunchPads, allowing developers to evaluate sensor functionalities on TI-developed MCU platforms.
  • Optional RF extension module (EM) adaptor enables Bluetooth®, ZigBee®, Wi-Fi and 6LoWPAN connectivity for wireless and remote sensing applications.
  • TI's TMP006 contactless IR temperature sensor provides accurate temperature measurements for the object it sees.
  • Includes BoosterPack XL connection standard with two pairs of 10-pin headers for LaunchPad interface and additional Tiva C Series-based expansion signals.
  • Variety of tool chains supported, including TI's Code Composer Studio v.6, so developers can design in the most integrated development environment (IDE) with which they are most comfortable.

Pricing and availability
Developers can immediately order the TI Sensor Hub BoosterPack (BOOSTXL-SENSHUB) for USD $49.99 from TI's eStore or authorized distributors. For a limited time only, an exclusive bundle for the Tiva C Series TM4C123G LaunchPad and Sensor Hub BoosterPack is available for the promotional price of USD $49.99 (regular price: USD $59.99) on the eStore only.

Find out more about TI's Tiva ARM MCUs, LaunchPad ecosystem and software:

TI's broad portfolio of microcontrollers (MCUs) and software
Leading the industry in MCUs for low-power, real-time control, safety and connectivity, TI continues its 20+ years of microcontroller innovation to offer the broadest microcontroller portfolio in the industry: Ultra-low-power MSP MCUs, real-time control C2000™ MCUs,  Tiva™ ARM® MCUs and Hercules™ Safety ARM MCUs. Designers can accelerate time to market by tapping into TI's tools, software, wireless connectivity solutions, extensive Design Network offerings and technical support.

About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors.  By employing the world's brightest minds, TI creates innovations that shape the future of technology.  TI is helping more than 100,000 customers transform the future, today.  Learn more at www.ti.com.

Trademarks
Tiva, TivaWare, MSP430, C2000 and Hercules are trademarks of Texas Instruments Incorporated.  All registered trademarks and other trademarks belong to their respective owners.

SOURCE Texas Instruments Incorporated

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today that Ryobi Systems will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Ryobi Systems Co., Ltd., as an information service company, specialized in business support for local governments and medical industry. We are challenging to achive the precision farming with AI. For more information, visit http:...
Amazon is pursuing new markets and disrupting industries at an incredible pace. Almost every industry seems to be in its crosshairs. Companies and industries that once thought they were safe are now worried about being “Amazoned.”. The new watch word should be “Be afraid. Be very afraid.” In his session 21st Cloud Expo, Chris Kocher, a co-founder of Grey Heron, will address questions such as: What new areas is Amazon disrupting? How are they doing this? Where are they likely to go? What are th...
As you move to the cloud, your network should be efficient, secure, and easy to manage. An enterprise adopting a hybrid or public cloud needs systems and tools that provide: Agility: ability to deliver applications and services faster, even in complex hybrid environments Easier manageability: enable reliable connectivity with complete oversight as the data center network evolves Greater efficiency: eliminate wasted effort while reducing errors and optimize asset utilization Security: imple...
High-velocity engineering teams are applying not only continuous delivery processes, but also lessons in experimentation from established leaders like Amazon, Netflix, and Facebook. These companies have made experimentation a foundation for their release processes, allowing them to try out major feature releases and redesigns within smaller groups before making them broadly available. In his session at 21st Cloud Expo, Brian Lucas, Senior Staff Engineer at Optimizely, will discuss how by using...
The next XaaS is CICDaaS. Why? Because CICD saves developers a huge amount of time. CD is an especially great option for projects that require multiple and frequent contributions to be integrated. But… securing CICD best practices is an emerging, essential, yet little understood practice for DevOps teams and their Cloud Service Providers. The only way to get CICD to work in a highly secure environment takes collaboration, patience and persistence. Building CICD in the cloud requires rigorous ar...
In this strange new world where more and more power is drawn from business technology, companies are effectively straddling two paths on the road to innovation and transformation into digital enterprises. The first path is the heritage trail – with “legacy” technology forming the background. Here, extant technologies are transformed by core IT teams to provide more API-driven approaches. Legacy systems can restrict companies that are transitioning into digital enterprises. To truly become a lead...
Companies are harnessing data in ways we once associated with science fiction. Analysts have access to a plethora of visualization and reporting tools, but considering the vast amount of data businesses collect and limitations of CPUs, end users are forced to design their structures and systems with limitations. Until now. As the cloud toolkit to analyze data has evolved, GPUs have stepped in to massively parallel SQL, visualization and machine learning.
DevOps at Cloud Expo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 21st Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to w...
SYS-CON Events announced today that Daiya Industry will exhibit at the Japanese Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Ruby Development Inc. builds new services in short period of time and provides a continuous support of those services based on Ruby on Rails. For more information, please visit https://github.com/RubyDevInc.
When it comes to cloud computing, the ability to turn massive amounts of compute cores on and off on demand sounds attractive to IT staff, who need to manage peaks and valleys in user activity. With cloud bursting, the majority of the data can stay on premises while tapping into compute from public cloud providers, reducing risk and minimizing need to move large files. In his session at 18th Cloud Expo, Scott Jeschonek, Director of Product Management at Avere Systems, discussed the IT and busine...
As businesses evolve, they need technology that is simple to help them succeed today and flexible enough to help them build for tomorrow. Chrome is fit for the workplace of the future — providing a secure, consistent user experience across a range of devices that can be used anywhere. In her session at 21st Cloud Expo, Vidya Nagarajan, a Senior Product Manager at Google, will take a look at various options as to how ChromeOS can be leveraged to interact with people on the devices, and formats th...
First generation hyperconverged solutions have taken the data center by storm, rapidly proliferating in pockets everywhere to provide further consolidation of floor space and workloads. These first generation solutions are not without challenges, however. In his session at 21st Cloud Expo, Wes Talbert, a Principal Architect and results-driven enterprise sales leader at NetApp, will discuss how the HCI solution of tomorrow will integrate with the public cloud to deliver a quality hybrid cloud e...
Is advanced scheduling in Kubernetes achievable? Yes, however, how do you properly accommodate every real-life scenario that a Kubernetes user might encounter? How do you leverage advanced scheduling techniques to shape and describe each scenario in easy-to-use rules and configurations? In his session at @DevOpsSummit at 21st Cloud Expo, Oleg Chunikhin, CTO at Kublr, will answer these questions and demonstrate techniques for implementing advanced scheduling. For example, using spot instances ...
SYS-CON Events announced today that Yuasa System will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Yuasa System is introducing a multi-purpose endurance testing system for flexible displays, OLED devices, flexible substrates, flat cables, and films in smartphones, wearables, automobiles, and healthcare.
SYS-CON Events announced today that Taica will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Taica manufacturers Alpha-GEL brand silicone components and materials, which maintain outstanding performance over a wide temperature range -40C to +200C. For more information, visit http://www.taica.co.jp/english/.