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Invensas Shows New xFD-Based Customer Products with Etron Technology at CES, Las Vegas

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), will display its latest xFDTM products solutions at CES Las Vegas, Jan. 7 - 10, 2014, including cloud server module solutions featuring advanced Registered Dual Inline Memory Modules (R-DIMMs) in collaboration with semiconductor manufacturer, Etron Technology, Inc., and memory module provider, ADATA Technology.

“Invensas xFD technology plays a vital role in minimizing manufacturing cost, while enhancing electrical and thermal performance versus conventional technology,” said Dr. James Sung, president of Etron Technology. “We see significant pull from semiconductor users with Invensas xFD technology.”

xFD technology connects multiple memory chips in a face-down shingle-stack configuration using ultra-short wirebonds. The solution significantly reduces the cost of server and datacenter operation by providing superior data access performance with significantly lower cooling costs and power usage.

“We are delighted to be at CES with Etron and ADATA,” said Simon McElrea, president of Invensas Corporation. “Semiconductor packaging, or Interconnectology as we call it at Invensas, is growing to become a vital and highly valuable element of the mobile and cloud storage landscape. Our intellectual property and technology solutions continue to gain traction with key customers and supply chain partners in this exciting space.”

Invensas will display the products with Etron Technology, Inc. in Etron’s Booth #35116 LVCC, South Hall 4, Las Vegas, NV, on Jan. 7 - 10, 2014. More details and additional Invensas xFD solutions can be found at www.invensas.com.

Safe Harbor Statement

This document contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to Invensas’s participation at CES Las Vegas and the characteristics, features, benefits and market adoption of Invensas’s intellectual property and technology, including xFD. Material factors that may cause results to differ from the statements made include the plans or operations relating to the businesses of Tessera Technologies, Inc. (the “Company”); market or industry conditions; changes in patent laws, regulation or enforcement, or other factors that might affect the Company's ability to protect or realize the value of its intellectual property; the expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; initiation, delays, setbacks or losses relating to the Company's intellectual property or intellectual property litigations, or invalidation or limitation of key patents; the timing and results, which are not predictable and may vary in any individual proceeding, of any ICC ruling or award, including in the Amkor arbitration; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to use technologies covered by the Company's patents; the expiration of the Company's patents; the Company's ability to successfully complete and integrate acquisitions of businesses; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company's businesses; failure of the Company's products to achieve technological feasibility or profitability; failure to successfully commercialize the Company's products; changes in demand for the products of the Company's customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company's technologies and products; and the reliance on a limited number of suppliers for the components used in the manufacture of DOC products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. The Company's filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2012, and its Quarterly Report on Form 10-Q for the quarter ended Sept. 30, 2013, include more information about factors that could affect the Company's financial results. The Company assumes no obligation to update information contained in this press release. Although this release may remain available on the Company's website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.

About Etron Technology, Inc.

Etron Technology, Inc. (Taiwan GTSM: 5351) is a world-class fabless integrated circuits design and product company founded in 1991 and specializing in semiconductor memories and system chips. In Taiwan’s “National Sub-micron Project” from the early 1990s, Etron participated in architecting, pioneering, and developing Taiwan’s first 8-inch sub-micron wafer, thus establishing a solid foundation for the fabless, foundry, SRAM, and DRAM industries which have transformed Taiwan into a major semiconductor powerhouse. As a publicly traded company headquartered in Taiwan and focused on bridging the Asia-Pacific and the global markets, Etron is producing a variety of IC products, including buffer memories, USB3.0 host controllers and flash memory controllers, USB power delivery controllers, gesture control ICs, and others.www.etron.com

About Invensas

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA - News), is a global leader in semiconductor interconnect solutions and intellectual property. Invensas innovates in areas such as mobile computing and communications, memory and data storage, and 3-D Integrated Circuit (3DIC) technologies. Headquartered in San Jose, California, Invensas licenses these solutions to Original Equipment Makers, Original Design Manufacturers, and Integrated Device Manufactures and delivers the products to market through collaborative engineering partnerships and strategic business alliances. Learn more at www.interconnectology.com or www.invensas.com, or contact Invensas PR at +1 408 324 5105.

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