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STATS ChipPAC Recognised for Patent Innovations for the Third Consecutive Year by IEEE

SINGAPORE--22 JANUARY 2014, UNITED STATES -- (Marketwired) -- 01/21/14 -- STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company") (SGX-ST: STATSChP) (SGX: S24), a leading provider of advanced semiconductor packaging and test services, announced today that it has been ranked for the third consecutive year among the world's top 20 semiconductor manufacturing companies in the 2013 Patent Power Scorecard published by IEEE Spectrum, the flagship magazine of the Institute of Electrical and Electronics Engineers (IEEE), the world's largest professional association for the advancement of technology, and 1790 Analytics, an Intellectual Property (IP) evaluation firm.

STATS ChipPAC is the only Outsourced Semiconductor Assembly and Test (OSAT) service provider ranked among the top 20 companies in the Semiconductor Manufacturing category. The Patent Power Scorecards are based on quantitative benchmarking of the patent portfolios of more than 5,000 leading commercial enterprises, academic institutions, nonprofit organisations and government agencies worldwide. The benchmarking process takes into account not only the size of an organisation's patent portfolio, but also the quality of that portfolio in terms of growth, impact, originality and general applicability.

"Today's consumers want more powerful yet increasingly smaller electronic devices. Semiconductor packaging technology is a driving force in achieving smaller, faster, multi-functional devices. With consistent investments in research and development and focus on technology innovation, we are enabling our customers to overcome increasingly complex performance and form factor challenges in order to deliver industry leading products," said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer, STATS ChipPAC.

STATS ChipPAC has been granted more than 1,000 patents by the U.S. Patent and Trademark Office (USPTO), more than any other company in the global OSAT industry. With over 60% of its IP in wafer level packaging, flip chip interconnect and 2.5D/3D integration, STATS ChipPAC offers its customers a competitive advantage with innovative packaging solutions that provide significant performance, size and cost advantages.

Dr. Han summarised, "We have developed a continuous path of innovative and cost effective advanced packaging solutions that provide numerous advantages to customers in the mobile communications market as well as new and evolving markets such as cloud computing and wearable devices. Our strong patent portfolio and culture of innovation are key factors why STATS ChipPAC is the go-to OSAT provider that our customers can rely on for a comprehensive portfolio of advanced packaging and test solutions."

Forward-looking Statements
Certain statements in this release are forward-looking statements that involve a number of risks and uncertainties that could cause actual results to differ materially from those described in this release. Factors that could cause actual results to differ include, but are not limited to, general business and economic conditions and the state of the semiconductor industry; prevailing market conditions; demand for end-use applications products such as communications equipment, consumer and multi-applications and personal computers; decisions by customers to discontinue outsourcing of test and packaging services; level of competition; our reliance on a small group of principal customers; our continued success in technological innovations; pricing pressures, including declines in average selling prices; intellectual property rights disputes and litigation; our ability to control operating expenses; our substantial level of indebtedness and access to credit markets; potential impairment charges; availability of financing; changes in our product mix; our capacity utilisation; delays in acquiring or installing new equipment; limitations imposed by our financing arrangements which may limit our ability to maintain and grow our business; returns from research and development investments; changes in customer order patterns; customer credit risks; disruption of our operations; shortages in supply of key components and disruption in supply chain; inability to consolidate our Malaysia operations into our China operations and uncertainty as to whether such plan will achieve the expected objectives and results; loss of key management or other personnel; defects or malfunctions in our testing equipment or packages; rescheduling or cancelling of customer orders; adverse tax and other financial consequences if the taxing authorities do not agree with our interpretation of the applicable tax laws; classification of our Company as a passive foreign investment company; our ability to develop and protect our intellectual property; changes in environmental laws and regulations; exchange rate fluctuations; regulatory approvals for further investments in our subsidiaries; majority ownership by Temasek Holdings (Private) Limited ("Temasek") that may result in conflicting interests with Temasek and our affiliates; unsuccessful acquisitions and investments in other companies and businesses; labour union problems in South Korea; uncertainties of conducting business in China and changes in laws, currency policy and political instability in other countries in Asia; natural calamities and disasters, including outbreaks of epidemics and communicable diseases; the continued trading and listing of our ordinary shares on the Singapore Exchange Securities Trading Limited ("SGX-ST"). You should not unduly rely on such statements. We do not intend, and do not assume any obligation, to update any forward-looking statements to reflect subsequent events or circumstances.

About STATS ChipPAC Ltd.
STATS ChipPAC Ltd. (SGX-ST Code: S24) is a leading service provider of semiconductor packaging design, assembly, test and distribution solutions in diverse end market applications including communications, digital consumer and computing. With global headquarters in Singapore, STATS ChipPAC has design, research and development, manufacturing or customer support offices throughout Asia, the United States and Europe. STATS ChipPAC is listed on the SGX-ST. Further information is available at Information contained in this website does not constitute a part of this release.

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