Click here to close now.




















Welcome!

News Feed Item

Thinfilm Acquires Kovio Technology, Opens Silicon Valley NFC Innovation Center

Thin Film Electronics ASA ("Thinfilm") (OSE: THIN.OL), leader in commercializing printed electronics, announced today that it has completed acquisition of Kovio technology, intellectual property, and manufacturing assets, and has opened the Thinfilm NFC Innovation Center in the heart of Silicon Valley.

"Adding NFC to our printed electronic memory and sensor platform will allow the seamless exchange of information between Thinfilm's Smart Labels and NFC-enabled phones and tablets," explains Davor Sutija, Thinfilm CEO. "Kovio technology is the only industry-supported NFC interface in printed electronics. We're launching the Thinfilm NFC Innovation Center with a strong NFC team, significantly expanded intellectual property, and pilot manufacturing."

"The acquisition of Kovio technology is an astute strategic move by Thinfilm. Kovio has impressive capability, NFC products and IP that will accelerate Thinfilm's product roadmap, in addition to giving Thinfilm a substantial presence in Silicon Valley," says Raghu Das, CEO, IDTechEx.

Internet of Things-redefining a megatrend

Gartner cites "Internet of Things" as one of the top 10 strategic trends of this decade. Analysts and companies alike are predicting markets in the trillions of dollars by 2020-Gartner $1.9 trillion, IDC $8.9 trillion, Cisco $19 trillion. Industry giants such as Intel, IBM, Cisco, Qualcomm and NXP are placing major bets on IoT, and the San Jose Mercury News calls IoT a technological transformation "as profound as the Industrial Revolution," in which "Silicon Valley companies that make the circuits are expected to profit enormously."

Yet most applications of IoT focus on fixed infrastructure, where the sensor is a static node at the edge of the network and data is routed to a central server.

Low-cost, disposable sensor labels-able to autonomously collect information to later be read by NFC phones and tablets-offer a fundamentally different approach. With over 400 million NFC-enabled smart phones already deployed, a number projected to grow to 1 billion by 2015, linking ubiquitous sensors on Thinfilm Smart Labels with the mobile platform creates a fluid and agile alternative to traditional data infrastructures. It is this agile network that will truly launch the Internet of Everything.

Thinfilm Sensor Labels

Thinfilm uses printing to manufacture simple integrated electronics at a fraction of the cost of conventional electronics, in highly scalable processes compatible with high-volume, low-cost markets. Thinfilm has integrated sensing, data storage, and display in a label format. Addition of a printed NFC interface will allow Thinfilm's Sensor Labels to link sensor data to apps on mobile devices and/or cloud-based analytics.

Future applications could include.

  • Temperature exposure of perishable goods, such as food and pharmaceuticals can be verified without heavy infrastructure
  • Disposable medical tests can be distributed to remote clinics and homes, with results communicated to medical records through the mobile device
  • Humidity can be detected in the walls of new construction, to monitor for leaks in pipes
  • Soldiers and pilots can be tested for 'readiness' based on bio-markers, allowing check-in before active service
  • Smart appliances can re-order supplies when an indicator says the product quantity is getting low
  • Patients can be monitored with one-time use devices for blood-oxygen levels, pulse readings, and other vital signs, and data gathered with the tap of a phone

Integration of Kovio technology accelerates time-to-market for NFC labels, and expands both Thinfilm's manufacturing capacity and intellectual property portfolio.

Unique marriage of technologies creates significant barriers to entry

"Printed transistor circuits are an important capability to enable truly smart devices but there are few companies in the world that have the know-how to produce these. Kovio is one of them," remarks Das.

Christer Karlsson, Thinfilm CTO explains, "The team here in San Jose can produce NFC Barcodes with well over 1500 active transistors, at pilot scale. Marrying the organic transistors we've been developing with the poly-silicon devices developed at Kovio establishes a formidable barrier-to-entry for future competitors."

The Kovio NFC Barcode(TM) is the only NFC interface in printed electronics and is supported commercially by Google Android and numerous NFC controllers being deployed in phones around the world. Thinfilm expects to demonstrate NFC-readable sensor labels by year-end.

Thinfilm NFC Innovation Center

"We are particularly excited to have more than 20 of the former Kovio team members joining to open the NFC Innovation Center. This core team will build out the Innovation Center's competence in design, process development and manufacturing," adds Karlsson. "The site at Zanker Road, San Jose, is deep in the heart of Silicon Valley, steps from the silicon industry's giants, an ideal location to recruit additional talent into Thinfilm and build the ecosystem."

Included in the acquisition:

  • Over 200 international patents and patents pending covering electronic inks, NFC and RF applications and protocols, process technologies, devices and circuits
  • Installed pilot manufacturing capacity of 100s of millions of units per year
  • 60,000 square foot manufacturing and development site
  • Kovio product lines in NFC and Electronic Article Surveillance
  • Encore software platform to support cloud-based data exchange

Broadening the Thinfilm portfolio

As part of the acquisition, Thinfilm has also acquired Kovio's technology for Electronic Article Surveillance (EAS) loss prevention tags. These solutions were developed in partnership with industry leaders such as Tyco Solutions and NedAp and complement Thinfilm's existing offerings in brand protection.

Thinfilm has also built a global team supporting the development of custom designs of integrated systems in ultra-low-cost electronics. According to Das, "Thinfilm is filling the need in the printed electronics industry by putting together complete solutions." Thinfilm will continue to pursue strategic partnerships, such as those it has with the Bemis Company, Brady Corporation, and Hasbro to accelerate the introduction of printed electronic systems into a wide range of markets.

"Thinfilm is the only company that is moving the needle when it comes to delivering printed electronics," said Randall Sherman, founder and president of New Venture Research.

Financial Terms

Thinfilm completed the acquisition of Kovio assets for a total of 2.7 USDm in cash and 1.0 USDm in equity, consisting of 1.0 million of Thinfilm shares, acquired by Kovio creditors at 5.92 NOK/share.

About Thin Film Electronics ASA

Thin Film Electronics ASA (Ticker: THIN.OL) is a leader in the development of Printed Electronics. The first to commercialize printed rewritable memory, Thinfilm is creating printed system products that will include memory, sensing, display and wireless communication-at a cost-per-functionality unmatched by any other electronic technology. Thinfilm's roadmap of system products integrates technology from a strong and growing ecosystem of partners to enable the Internet of Things by bringing intelligence to disposable goods. Company headquarters are in Oslo, Norway, with product development in Linköping, Sweden, sales offices in San Francisco, USA, and Tokyo, Japan, and manufacturing in Pyongtaek, South Korea. http://www.thinfilm.no/

Follow us on Twitter: http://www.twitter.com/ThinfilmMemory

Follow us on LinkedIn: http://www.linkedin.com/company/thin-film-electronics

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
One of the hottest areas in cloud right now is DRaaS and related offerings. In his session at 16th Cloud Expo, Dale Levesque, Disaster Recovery Product Manager with Windstream's Cloud and Data Center Marketing team, will discuss the benefits of the cloud model, which far outweigh the traditional approach, and how enterprises need to ensure that their needs are properly being met.
In their session at 17th Cloud Expo, Hal Schwartz, CEO of Secure Infrastructure & Services (SIAS), and Chuck Paolillo, CTO of Secure Infrastructure & Services (SIAS), provide a study of cloud adoption trends and the power and flexibility of IBM Power and Pureflex cloud solutions. In his role as CEO of Secure Infrastructure & Services (SIAS), Hal Schwartz provides leadership and direction for the company.
In a recent research, analyst firm IDC found that the average cost of a critical application failure is $500,000 to $1 million per hour and the average total cost of unplanned application downtime is $1.25 billion to $2.5 billion per year for Fortune 1000 companies. In addition to the findings on the cost of the downtime, the research also highlighted best practices for development, testing, application support, infrastructure, and operations teams.
"We've just seen a huge influx of new partners coming into our ecosystem, and partners building unique offerings on top of our API set," explained Seth Bostock, Chief Executive Officer at IndependenceIT, in this SYS-CON.tv interview at 16th Cloud Expo, held June 9-11, 2015, at the Javits Center in New York City.
SYS-CON Events announced today that HPM Networks will exhibit at the 17th International Cloud Expo®, which will take place on November 3–5, 2015, at the Santa Clara Convention Center in Santa Clara, CA. For 20 years, HPM Networks has been integrating technology solutions that solve complex business challenges. HPM Networks has designed solutions for both SMB and enterprise customers throughout the San Francisco Bay Area.
For IoT to grow as quickly as analyst firms’ project, a lot is going to fall on developers to quickly bring applications to market. But the lack of a standard development platform threatens to slow growth and make application development more time consuming and costly, much like we’ve seen in the mobile space. In his session at @ThingsExpo, Mike Weiner, Product Manager of the Omega DevCloud with KORE Telematics Inc., discussed the evolving requirements for developers as IoT matures and conducte...
The Software Defined Data Center (SDDC), which enables organizations to seamlessly run in a hybrid cloud model (public + private cloud), is here to stay. IDC estimates that the software-defined networking market will be valued at $3.7 billion by 2016. Security is a key component and benefit of the SDDC, and offers an opportunity to build security 'from the ground up' and weave it into the environment from day one. In his session at 16th Cloud Expo, Reuven Harrison, CTO and Co-Founder of Tufin,...
With SaaS use rampant across organizations, how can IT departments track company data and maintain security? More and more departments are commissioning their own solutions and bypassing IT. A cloud environment is amorphous and powerful, allowing you to set up solutions for all of your user needs: document sharing and collaboration, mobile access, e-mail, even industry-specific applications. In his session at 16th Cloud Expo, Shawn Mills, President and a founder of Green House Data, discussed h...
Mobile, social, Big Data, and cloud have fundamentally changed the way we live. “Anytime, anywhere” access to data and information is no longer a luxury; it’s a requirement, in both our personal and professional lives. For IT organizations, this means pressure has never been greater to deliver meaningful services to the business and customers.
Container technology is sending shock waves through the world of cloud computing. Heralded as the 'next big thing,' containers provide software owners a consistent way to package their software and dependencies while infrastructure operators benefit from a standard way to deploy and run them. Containers present new challenges for tracking usage due to their dynamic nature. They can also be deployed to bare metal, virtual machines and various cloud platforms. How do software owners track the usag...
The Internet of Everything (IoE) brings together people, process, data and things to make networked connections more relevant and valuable than ever before – transforming information into knowledge and knowledge into wisdom. IoE creates new capabilities, richer experiences, and unprecedented opportunities to improve business and government operations, decision making and mission support capabilities.
Chuck Piluso presented a study of cloud adoption trends and the power and flexibility of IBM Power and Pureflex cloud solutions. Prior to Secure Infrastructure and Services, Mr. Piluso founded North American Telecommunication Corporation, a facilities-based Competitive Local Exchange Carrier licensed by the Public Service Commission in 10 states, serving as the company's chairman and president from 1997 to 2000. Between 1990 and 1997, Mr. Piluso served as chairman & founder of International Te...
There are many considerations when moving applications from on-premise to cloud. It is critical to understand the benefits and also challenges of this migration. A successful migration will result in lower Total Cost of Ownership, yet offer the same or higher level of robustness. In his session at 15th Cloud Expo, Michael Meiner, an Engineering Director at Oracle, Corporation, analyzed a range of cloud offerings (IaaS, PaaS, SaaS) and discussed the benefits/challenges of migrating to each offe...
Puppet Labs has announced the next major update to its flagship product: Puppet Enterprise 2015.2. This release includes new features providing DevOps teams with clarity, simplicity and additional management capabilities, including an all-new user interface, an interactive graph for visualizing infrastructure code, a new unified agent and broader infrastructure support.
SYS-CON Events announced today that MobiDev, a software development company, will exhibit at the 17th International Cloud Expo®, which will take place November 3–5, 2015, at the Santa Clara Convention Center in Santa Clara, CA. MobiDev is a software development company with representative offices in Atlanta (US), Sheffield (UK) and Würzburg (Germany); and development centers in Ukraine. Since 2009 it has grown from a small group of passionate engineers and business managers to a full-scale mobi...