|By PR Newswire||
|February 5, 2014 02:34 PM EST||
DUBLIN, February 5, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems) has announced the addition of the "Reverse Costing Analysis of the iPhone 5S MEMS Gyroscope STMicroelectronics 3x3mm" report to their offering.
STMicroelectronics 4x4mm MEMS gyro was integrated in the previous iPhones (iPhone 4, 4S & 5). For the new iPhone 5S, Apple has chosen the latest 3x3mm MEMS gyro from ST, thus achieving a 45% footprint reduction.
The new 3-Axis MEMS gyroscope is assembled with a true CSP process (Chip Scale Packaging) allowing a package efficiency of 75% (silicon area/package area). This packaging size reduction combined with dies shrinking allowed ST to reduce by 20% the production cost of their latest gyro.
This report provides a complete teardown of the MEMS gyro with:
- Detailed photos
- Material analysis
- Comparison with iPhone 4/4S/5 gyro
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Supply chain evaluation
- Selling price estimation
Key Topics Covered:
STMicroelectronics Company Profile
- Physical Analysis Methodology
- Package Characteristics & Markings
- Package Opening
- Wire bonding process
- Package Cross-Section
- ASIC Dimensions & Markings
- ASIC Delayering
- ASIC Cross-Section
- ASIC Process Characteristics
- MEMS Dimensions & Markings
- MEMS bonding pads
- MEMS Cap Opening
- MEMS Cap
- MEMS Sensing Area
- MEMS Cross-section
Comparison with iPhone 4/4S/5 Gyroscope
Manufacturing Process Flow
- ASIC Process Flow
- Description of the ASIC Wafer Fabrication Unit
- MEMS Sensor Process Flow
- MEMS Cap Process Flow
- MEMS Wafer Bonding Process Flow
- Description of the MEMS Wafer Fabrication Unit
- Packaging Process Flow
- Main Steps of Economic Analysis
- Yields Hypotheses
- ASIC Front-End Cost
- ASIC Back-End 0 : Probe Test, Backgrinding & Dicing
- ASIC Die Cost
- MEMS Front-End Cost
- MEMS Front-End Cost per Process Steps
- MEMS Front-End : Equipment Cost per Family
- MEMS Front-End : Material Cost per Family
- MEMS Back-End 0 : Probe Test & Dicing
- MEMS Die Cost (Front End + Back End 0)
- Back-End : Packaging Cost
- Back-End : Final test & Calibration Cost
- Component Cost (FE + BE 0 + BE 1)
- Comparison with iPhone 4/4S/5 Gyro Component Cost
Estimated Price Analysis
For more information visit http://www.researchandmarkets.com/research/lxrnrn/iphone_5s_mems
Media Contact: Laura Wood, +353-1-481-1716, [email protected]
SOURCE Research and Markets
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