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Reverse Costing Analysis for the Bosch Sensortec BMG160 3-Axis MEMS Gyroscope

DUBLIN, February 5, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/5mwbpk/bosch_sensortec) has announced the addition of the "Reverse Costing Analysis for the Bosch Sensortec BMG160 3-Axis MEMS Gyroscope" report to their offering. 

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )


The first MEMS gyroscope of Bosch for Consumer Applications Employing a New Wafer Bonding Process 

More than 10 years after the release of its MEMS gyroscopes for automotive, Bosch Sensortec release its first 3-Axis gyroscope for consumer applications. 
In a market largely dominated by STMicroelectronics and InvenSense, Bosch Sensortec was the first to release a 3-axis MEMS gyroscope in a 3x3mm² package in order to gain market shares. Although the manufacturing process (Epi-poly surface micromachining) is similar to the one of automotive gyro, new processes for the capping and the wafer bonding has been adopted. Indeed, the classic "glass-frit" wafer bonding has been abandoned in favor of an eutectic bonding. 

This report provides a complete teardown of the MEMS gyro with: 

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Selling price estimation

Key Topics Covered: 

Glossary

Overview/Introduction 

Bosch Company Profile 

Physical Analysis

  • Physical Analysis Methodology
  • Package
  • Package Characteristics & Markings
  • Package Opening
  • Wire bonding process
  • Package CrossSection
  • ASIC
  • ASIC Dimensions & Markings
  • ASIC Delayering
  • ASIC CrossSection
  • ASIC Process Characteristics
  • MEMS
  • MEMS Dimensions & Markings
  • MEMS bonding pads
  • MEMS Cap Opening
  • MEMS Cap
  • MEMS Sensing Area
  • MEMS Crosssection

Manufacturing Process Flow

  • ASIC Process Flow
  • Description of the ASIC Wafer Fabrication Unit
  • MEMS Sensor Process Flow
  • MEMS Cap Process Flow
  • MEMS Wafer Bonding Process Flow
  • Description of the MEMS Wafer Fabrication Unit
  • Packaging Process Flow

Cost Analysis

  • Main Steps of Economic Analysis
  • Yields Hypotheses
  • ASIC FrontEnd Cost
  • ASIC BackEnd 0 : Probe Test, Thinning & Dicing
  • ASIC Die Cost
  • MEMS FrontEnd Cost
  • MEMS FrontEnd Cost per Process Steps
  • MEMS FrontEnd : Equipment Cost per Family
  • MEMS FrontEnd : Material Cost per Family
  • MEMS BackEnd 0 : Probe Test & Dicing
  • MEMS Die Cost (Front End + Back End 0)
  • BackEnd : Packaging Cost
  • BackEnd : Final test & Calibration Cost
  • Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis 

For more information visit http://www.researchandmarkets.com/research/5mwbpk/bosch_sensortec


Media Contact: Laura Wood, +353-1-481-1716, [email protected] 


SOURCE Research and Markets

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