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mCube 3-Axis Accelerometer Reverse Costing Analysis

DUBLIN, February 6, 2014 /PRNewswire/ --

Research and Markets (http://www.researchandmarkets.com/research/8d76qk/mcube_3axis) has announced the addition of the "mCube 3-Axis Accelerometer Reverse Costing Analysis" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

Discrete MEMS accelerometers is now a mature market. New player mCube, mainly active on Chinese market, tries to gain market share with new technologies allowing very low manufacturing cost.

mCube 3D MEMS process consists in MEMS elements monolithically fabricated on top of the drive IC and connected using thru-silicon-vias. To protect the MEMS elements, a cap is sealed with an eutectic alloy bonding process.

The mCube accelerometer is assembled in a standard LGA2x2mm package.

This report will provides a complete teardown of the MEMS accelerometer with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth manufacturing cost analysis
  • Supply chain evaluation
  • Selling price estimation

Key Topics Covered:

Glossary

Overview/Introduction

  • Executive Summary
  • Reverse Costing Methodology

mCube Company Profile

Physical Analysis

  • Physical Analysis Methodology
  • Package
  • Package Characteristics & Markings
  • Package Opening
  • Package Cross-Section
  • Die
  • Dimensions & Markings
  • Bond Pad Opening
  • MEMS Cap Removed
  • MEMS Cap Details
  • MEMS Sensing Area
  • MEMS Sensing Area Removed
  • Delayering (Metal Layers Removed)
  • IC Process
  • Die Cross-Section

Manufacturing Process Flow

  • Global Overview
  • IC Front-End Process
  • MEMS Process Flow
  • Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • CMOS Front-End Cost
  • MEMS Front-End Cost
  • MEMS Front-End Cost per process steps
  • MEMS Front-End: Equipment Cost per Family
  • MEMS Front-End: Material Cost per Family
  • Total Front-end Cost
  • Back-End 0 : Probe Test & Dicing
  • Wafer Cost
  • Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test & Calibration Cost
  • Accelero Component Cost & Price

For more information visit http://www.researchandmarkets.com/research/8d76qk/mcube_3axis

Media Contact: Laura Wood, +353-1-481-1716, [email protected]

SOURCE Research and Markets

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