|By PR Newswire||
|February 6, 2014 05:00 PM EST||
DUBLIN, February 6, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/fpj6dd/silicon_labs) has announced the addition of the "Silicon Labs Si504 - CMEMS Oscillator Reverse Costing Analysis" report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )
First Fully Integrated, Monolithic Cmos+Mems Oscillator Device
The frequency control market is largely dominated by quartz products, but silicon timing solutions have a strong value proposition for some sub-markets.
The Si504 is the first silicon oscillator from Silicon Labs. Manufactured with the CMEMS process (CMOS + MEMS), the crystal elements are replaced by micromachined semiconductor resonators.
CMEMS process consists in a monolithic integration of a CMOS circuit with Poly-SiGe (polycrystalline silicon-germanium) MEMS resonator structures.
The resonator is then vacuum encapsulated with a silicon cap using an eutectic wafer bonding process.
The Si504 is optimized to support high-volume, low-cost applications such as consumer electronics market.
This report will provide a complete teardown of the MEMS oscillator with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Supply chain evaluation
- Selling price estimation
Key Topics Covered:
- Executive Summary
- Reverse Costing Methodology
Silicon Labs Company Profile
- Silicon Labs Profile
- Si504 Characteristics
- Silicon Labs Si504
- CMEMS Oscillator
- Physical Analysis Methodology
- Package View, Dimensions & Pinout
- Package XRay
- Package Opening
- Package CrossSection
- View, Dimensions & Marking
- MEMS Cap Removed
- MEMS Cap Details
- MEMS Resonator Structure
- CMEMS Delayering & IC Process
- MEMS Cap CrossSection
- CMEMS CrossSection
- IC Layers
- MEMS Layers
Manufacturing Process Flow
- Global Overview
- CMOS FrontEnd Process
- MEMS Resonator Process Flow
- MEMS Cap & Assembly Process Flow
- Wafer Fabrication Unit
- Packaging Process Flow & Assembly Unit
- Main steps of economic analysis
- Yields Hypotheses
- CMOS FrontEnd Cost
- MEMS Resonator FrontEnd Cost
- MEMS Cap FrontEnd Cost
- CMEMS/Cap Assembly Cost
- MEMS FrontEnd Cost per process steps
- MEMS FrontEnd: Equipment Cost per Family
- MEMS FrontEnd: Material Cost per Family
- Total Frontend Cost & Price
- BackEnd 0 : Probe Test & Dicing
- Wafer & Die Cost
- BackEnd : Packaging & Final Test Cost
- Si504 Component Cost
Estimated Price Analysis
- Silicon Labs Financial Ratios
- Si504 Estimated Price
For more information visit http://www.researchandmarkets.com/research/fpj6dd/silicon_labs
Media Contact: Laura Wood , +353-1-481-1716, [email protected]
SOURCE Research and Markets
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