|By PR Newswire||
|February 6, 2014 05:00 PM EST||
DUBLIN, February 6, 2014 /PRNewswire/ --
Research and Markets (http://www.researchandmarkets.com/research/9l2njj/bosch_sensortec) has announced the addition of the "Bosch Sensortec BMX055 9-Axis MEMS IMU - Reverse Costing Analysis" report to their offering.
(Logo: http://photos.prnewswire.com/prnh/20130307/600769 )
The first 9-Axis MEMS IMU from Bosch for Consumer Applications
Combines 3-Axis Gyroscope, 3-Axis Accelerometer and 3-Axis Magnetometer
In the race of motion integration, Bosch Sensortec has released its first 9-Axis IMU for consumer applications. The BMX055 combines a 12-bit 3-Axis accelerometer, a 16bit 3-Axis gyroscope and a wide-range 3-Axis geomagnetic sensor in a 4.5x3.0mm LGA package (the smallest footprint at its introduction).
It is the first 9-Axis MEMS IMU where all the functionalities are developed and manufactured by the same player. The BMX055 integrates the second generation of Bosch geomagnetic sensor where the 3-Axis are integrated on a single die compared to 3 separates dies for the previous generation.
This report provides a complete teardown of the MEMS IMU with:
- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth manufacturing cost analysis
- Selling price estimation
Key Topics Covered:
Introduction, Bosch Company Profile
- Package Views, Dimensions & Pin Out
- Package Opening
- Wire bonding process
- Package CrossSection
- ASIC Gyro & Accelero Dies
- View, Dimensions & Marking
- Main Blocks Identification
- MEMS Gyro & Accelero Dies
- View, Dimensions & Marking
- Bond Pad Opening & Bond Pad
- Cap Removed & Cap Details
- Sensing Area Details
- CrossSection (Sensor, Cap & Bonding)
- Process Characteristics
- Magnetometer Die
- View, Dimensions & Marking
- Hall sensor and fluxgate sensors
- Main Blocks Identification
- CrossSection (CMOS & Sensor)
Manufacturing Process Flow
- ASIC Gyro & Accelero FrontEnd Process
- MEMS Gyro & Accelero Process Flow
- Magnetometer Process Flow
- Wafer Fabrication Unit
- Packaging Process Flow
- Package Assembly Unit
- Main steps of economic analysis
- Yields Hypotheses
- ASIC Gyro & Accelero FrontEnd Cost
- ASIC Gyro & Accelero BackEnd 0 : Probe Test & Dicing
- ASIC Gyro & Accelero Wafer & Die Cost
- MEMS Gyro & Accelero FrontEnd Cost
- MEMS Gyro & Accelero BackEnd 0 : Probe Test & Dicing
- MEMS Gyro & Accelero Wafer & Die Cost
- Magnetometer CMOS FrontEnd Cost
- Magnetometer Sensor Cost
- Magnetometer BackEnd 0 : Probe Test & Dicing
- Magnetometer Wafer & Die Cost
- BackEnd : Packaging Cost
- BackEnd : Final Test & Calibration Cost
- BMX055 Component Cost
Estimated Price Analysis
For more information visit http://www.researchandmarkets.com/research/9l2njj/bosch_sensortec
Media Contact: Laura Wood , +353-1-481-1716, [email protected]
SOURCE Research and Markets
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