Welcome!

News Feed Item

Renesas Electronics Develops Industry’s First 28nm Embedded Flash Memory Technology for Microcontrollers

Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, today announced that it has developed the industry's first 28-nanometer (nm) flash memory intellectual property (IP) for microcontrollers (MCUs) using a 28 nm process technology.

As engines move to even lower fuel consumption, new control mechanisms are now required to deal with the introduction of new combustion methods and further system evolution associated with downsizing. High-speed real-time processing, such as dynamically switching between multiple control algorithms according to the load in response to feedback from various sensors, will become necessary, and a performance level three to five times that will be required in automotive MCUs. Furthermore, while the number of ECUs is increasing, if we consider the limitations on power supply, such as the practice of stopping the engine when the car is temporarily stopped, it is clear that while performance must be improved, it is also necessary to reduce power consumption.

Also, due to issues such as the increasing complexity of integrating multiple MCUs and the control algorithms themselves, flash MCUs will require an increase in on-chip flash memory capacity to about three times that of previous devices. At the same time, since it is now extremely important to increase the safety and security of automotive control and of the requirements on automotive MCUs, high-level functional safety has become critical. A new many-core architecture is now required for the inclusion of multiple dual processors operating in lock step, and for the integration of a variety of functions. In low fuel consumption engines, the processing accelerators for the injection pulse generation and signal processing required for high-precision combustion control, knock control, and cooperative control with the driving support systems that will lead to autonomous cars are now required and thus a higher integration density, that is, moving to a finer feature size fabrication process, is now indispensable.

Renesas’ current 40 nm process technology supports up to 8MB of on-chip flash memory for MCUs. However, on-chip MCU flash memory modules as large as 10 MB will be required to support the increasing sophistication of the control systems implemented with MCUs.

Moving to smaller process geometry is one approach to increasing the integration density of the flash memory and peripheral functions that are integrated on a single chip. Single-chip MCUs developed using Renesas’ new 28 nm process technology will be able to support a maximum capacity of over 16MB flash memory on chip.

Renesas has been moving forward with prototypes in the 28 nm process, which features even finer features than the existing 40 nm process. In the latest prototype chip, Renesas was able to achieve a high-speed readout operating clock frequency of 160 MHz, a data retention time of 20 years, and a rewrite cycle count of 250,000 cycles (for data storage). Although it becomes increasingly difficult to maintain flash memory performance and reliability as feature sizes are reduced, Renesas succeeded in creating this prototype by taking advantage of the scalability of the MONOS (Note 1) structure flash memory, which made it possible to increase both the capacity and the performance of the memory integrated in flash MCUs. Renesas’ MONOS technology for MCUs has achieved a superb track record through the company’s 40 nm process generation.

The new 28nm flash memory IP for MCUs offers design benefits for automotive and other industries with high-reliability criteria. For example, in the ADAS (advanced driving assistant system) field, the increased memory capacity and performance will make it possible to support complex data processing for 3D radar to increase the safety of automotive. Furthermore, in the power train area, this new technology will enable an even finer-grained control of fuel injection and ignition through increases in the amount of mapping data used for fuel injection and increased data processing capability. This will contribute not only to increased fuel efficiency, but also to reduced environmental and energy challenges. Additionally, by adopting a 28 nm process, it will be possible to reduce current consumption.

Renesas will accelerate their development of 28 nm process automotive flash MCUs for commercial release to support needs for high-speed readout, high reliability, and larger capacities – a maximum capacity of over 16 MB.

Renesas already leads the industry in mass producing flash MCUs and has contributed to the wider adoption of flash MCUs in a wide range of industries, including automotive, consumer, and industrial. Renesas grasped the trend towards higher reliability and increased integration densities early on, and deployed the MONOS structure flash memory, which is comparatively easy to adapt to finer feature size processes, in 150 nm process MCUs in 2004, in 90 nm MCUs in 2007, and in 40 nm MCUs in 2012. In addition, Renesas was the first semiconductor manufacturer to ship flash MCU samples from 90nm generation onward while scaling the process technology.

Key features of the 28 nm on-chip flash memory IP:

(1) Verified high-speed readout

In the prototype chip, Renesas achieved a readout speed of 160 MHz (as compared to 120 MHz in Renesas 40 nm process devices) from program storage flash memory. This will make it possible for MCU products based on the 28 nm technology to implement complex real-time processing, such as engine control.

(2) Verified high reliability

The new IP maintains the 20-year data retention time, which is crucial for automotive MCUs, and achieves a rewrite cycle count of 250,000 times when used as data storage flash memory, which is also the same as that of Renesas 40 nm process devices.

(3)Possible to include large capacity Flash

When 28 nm process flash MCUs are fabricated using this flash memory, it will be possible to include a maximum capacity of over 16 MB on a single chip.

Moving to a finer process also enables about twice as many high-speed/low-power transistors to be included in the logic blocks compared with the earlier Renesas 40 nm process. This makes it possible to develop MCUs that include support for multiple CPU cores, functional safety and security, and multiple interface standards, and enables the integration of the automotive electronic control unit (ECU).

Now, Renesas has completed the development of the industry’s first 28 nm process on-chip flash memory IP for MCUs based on the expertise accumulated over many years and its experience in reducing feature sizes to the 40 nm process. This development will make it possible for Renesas to be the first to create 28 nm flash MCUs for automotive applications, Renesas will be able to deliver increased memory capacities and improved processing performance in conjunction with the finer feature sizes in the logic circuits other than flash memory circuits.

Based on the successful results of this development effort, Renesas will accelerate its development of 28 nm process automotive flash MCUs and will be the first to introduce such products to the market to respond to customer needs. Thus Renesas will be contributing to our system designers’ development leading-edge product development to implement a secure, safe, and pleasant automotive society.

(Note 1) MONOS (Metal Oxide Nitride Oxide Silicon)

Renesas is applying the MONOS technology, which has a 20-year track record in EEPROMs, secure MCUs, and other products, to flash memory integrated on the MCU chip. Renesas is also developing its own unique transistor structures.

(Remarks)

All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723), the world’s number one supplier of microcontrollers, is a premier supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad-range of analog and power devices. Business operations began as Renesas Electronics in April 2010 through the integration of NEC Electronics Corporation (TSE:6723) and Renesas Technology Corp., with operations spanning research, development, design and manufacturing for a wide range of applications. Headquartered in Japan, Renesas Electronics has subsidiaries in 20 countries worldwide. More information can be found at www.renesas.com.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
For organizations that have amassed large sums of software complexity, taking a microservices approach is the first step toward DevOps and continuous improvement / development. Integrating system-level analysis with microservices makes it easier to change and add functionality to applications at any time without the increase of risk. Before you start big transformation projects or a cloud migration, make sure these changes won’t take down your entire organization.
Internet of @ThingsExpo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 21st Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The Internet of Things (IoT) is the most profound change in personal and enterprise IT since the creation of the Worldwide Web more than 20 years ago. All major researchers estimate there will be tens of billions devic...
We build IoT infrastructure products - when you have to integrate different devices, different systems and cloud you have to build an application to do that but we eliminate the need to build an application. Our products can integrate any device, any system, any cloud regardless of protocol," explained Peter Jung, Chief Product Officer at Pulzze Systems, in this SYS-CON.tv interview at @ThingsExpo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA
21st International Cloud Expo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud strategy. Me...
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend 21st Cloud Expo October 31 - November 2, 2017, at the Santa Clara Convention Center, CA, and June 12-14, 2018, at the Javits Center in New York City, NY, and learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.
SYS-CON Events announced today that Ayehu will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on October 31 - November 2, 2017 at the Santa Clara Convention Center in Santa Clara California. Ayehu provides IT Process Automation & Orchestration solutions for IT and Security professionals to identify and resolve critical incidents and enable rapid containment, eradication, and recovery from cyber security breaches. Ayehu provides customers greater control over IT infras...
SYS-CON Events announced today that MobiDev, a client-oriented software development company, will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MobiDev is a software company that develops and delivers turn-key mobile apps, websites, web services, and complex software systems for startups and enterprises. Since 2009 it has grown from a small group of passionate engineers and business...
SYS-CON Events announced today that GrapeUp, the leading provider of rapid product development at the speed of business, will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Grape Up is a software company, specialized in cloud native application development and professional services related to Cloud Foundry PaaS. With five expert teams that operate in various sectors of the market acr...
"We are a monitoring company. We work with Salesforce, BBC, and quite a few other big logos. We basically provide monitoring for them, structure for their cloud services and we fit into the DevOps world" explained David Gildeh, Co-founder and CEO of Outlyer, in this SYS-CON.tv interview at DevOps Summit at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
SYS-CON Events announced today that Enzu will exhibit at SYS-CON's 21st Int\ernational Cloud Expo®, which will take place October 31-November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Enzu’s mission is to be the leading provider of enterprise cloud solutions worldwide. Enzu enables online businesses to use its IT infrastructure to their competitive advantage. By offering a suite of proven hosting and management services, Enzu wants companies to focus on the core of their ...
DevOps at Cloud Expo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 21st Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to w...
New competitors, disruptive technologies, and growing expectations are pushing every business to both adopt and deliver new digital services. This ‘Digital Transformation’ demands rapid delivery and continuous iteration of new competitive services via multiple channels, which in turn demands new service delivery techniques – including DevOps. In this power panel at @DevOpsSummit 20th Cloud Expo, moderated by DevOps Conference Co-Chair Andi Mann, panelists examined how DevOps helps to meet the de...
While DevOps most critically and famously fosters collaboration, communication, and integration through cultural change, culture is more of an output than an input. In order to actively drive cultural evolution, organizations must make substantial organizational and process changes, and adopt new technologies, to encourage a DevOps culture. Moderated by Andi Mann, panelists discussed how to balance these three pillars of DevOps, where to focus attention (and resources), where organizations might...
Cloud Expo, Inc. has announced today that Andi Mann and Aruna Ravichandran have been named Co-Chairs of @DevOpsSummit at Cloud Expo Silicon Valley which will take place Oct. 31-Nov. 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. "DevOps is at the intersection of technology and business-optimizing tools, organizations and processes to bring measurable improvements in productivity and profitability," said Aruna Ravichandran, vice president, DevOps product and solutions marketing...
Automation is enabling enterprises to design, deploy, and manage more complex, hybrid cloud environments. Yet the people who manage these environments must be trained in and understanding these environments better than ever before. A new era of analytics and cognitive computing is adding intelligence, but also more complexity, to these cloud environments. How smart is your cloud? How smart should it be? In this power panel at 20th Cloud Expo, moderated by Conference Chair Roger Strukhoff, pane...