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Research and Markets: Global 3D ICs Market to 2019: MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED

Research and Markets (http://www.researchandmarkets.com/research/83v4sp/3d_ics_market) has announced the addition of the "3D ICs Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019" report to their offering.

The global 3D ICs market, valued at USD 2,408.2 million in 2012, is expected to see strong growth with 18.1% CAGR during 2013 to 2019.

Global semiconductor industry is witnessing shift to 3D IC technology as it provides greater opportunity for developing a broader set of electronic systems and products with exceptional speed, reduction in the chip size, and low power consumption. Rising demand for solutions with improved performance and reduced response time, and growing number of portable devices such as smart-phones and tablets are some of the major factors to drive adoption of 3D ICs. However, high manufacturing and testing cost, lack of foundries and assembly houses to support this technology, thermal and testing issues, are some of the key challenges currently limiting the 3D ICs market growth worldwide.

This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019.

The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred.

This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter's five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments.


End-Use Sectors

  • Consumer electronics
  • Information and communication technology
  • Transport (automotive and aerospace)
  • Military
  • Others (Biomedical applications and R&D)

Substrate Type:

  • Silicon on insulator(SOI)
  • Bulk Silicon

Fabrication Process:

  • Beam re-crystallization
  • Wafer bonding
  • Silicon epitaxial growth
  • Solid phase crystallization


  • MEMS and Sensor
  • RF SiP
  • Optoelectronics and imaging
  • Memories (3D Stacks)
  • Logic (3D Sip/Soc)
  • HB LED

Key Topics Covered:

Chapter 1 Preface

Chapter 2 Executive Summary

Chapter 3 3D ICs Market Overview

Chapter 4 Global 3D ICs Market, by End-Use Industry

Chapter 5 Global 3D ICs Market, by Substrate Type

Chapter 6 Global 3D ICs Market, by Fabrication Process

Chapter 7 Global 3D ICs Market, by Product

Chapter 8 Global 3D ICs Market, by Geography

Chapter 9 Company Profiles

  • Elpida Memory, Inc. (Micron Technology, Inc.)
  • MonolithIC 3D Inc.
  • STATS ChipPAC Ltd.
  • Taiwan Semiconductor Manufacturing Company, Ltd.
  • Tezzaron Semiconductor Corporation
  • The 3M Company
  • United Microelectronics Corporation
  • XILINX, Inc.
  • Ziptronix, Inc.

For more information visit http://www.researchandmarkets.com/research/83v4sp/3d_ics_market

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