Welcome!

News Feed Item

Airspan Networks selects Texas Instruments' KeyStone™ SoCs for next-generation small cell backhaul platforms

BARCELONA, Spain, Feb. 24, 2014 /PRNewswire/ -- MOBILE WORLD CONGRESS -- Texas Instruments (TI) (NASDAQ: TXN) and Airspan Networks Inc., a global provider of 4G broadband wireless systems and solutions, announced a new collaboration –  Airspan's Small Cell LTE solution, AirSynergy.  With TI's KeyStoneTM-based wireless infrastructure System-on-Chips (SoCs), Airspan is able to leverage their software investment and enhance functionality and performance of their LTE small cell with a range of integrated wireless backhaul options including support for both LTE relay and hybrid non-line-of-sight (NLOS) connectivity. TI's KeyStone technology enables Airspan to deliver a small cell product which is significantly differentiated from their competition.

"We are confident that adopting TI's wireless infrastructure solutions is a game changer for Small Cell LTE deployments," said Paul Senior, CTO, Airspan. "The integration of wireless backhaul with the outdoor pico eNB dramatically reduces overall small cell TCO. By leveraging the advanced features that the platform can support ensures consistent quality of experience as a user moves between macro and pico RAN layers."

Leveraging TI's platform for its next generation of small cell backhaul products, Airspan offers a highly flexible Software Defined Radio (SDR) platform enabling multi-mode operation including LTE relay and complementary alternative wireless backhaul options. Starting with 3GPP Release 10, Airspan's AirSynergy solution has a roadmap to LTE-Advanced with capacity enhancing features such as carrier aggregation. With options for tight integration with outdoor pico cell eNB, TI's KeyStone-based solution forms the heart of Airspan's Software Defined Networking (SDN) solution for small cell backhaul over multiple wireless and wireline technologies.

TI's wireless infrastructure SoCs leverage the fastest dual ARM® Cortex® -A15 RISC processors and TI's fixed- and floating-point TMS320C66x digital signal processor (DSP) generation cores as part of TI's highly efficient KeyStone SoC architecture. Additionally TI's broad resources bring the most comprehensive portfolio of processing, software and complementary support devices to Airspan. TI also offers a complimentary portfolio of analog components, including the AFE7500 analog front end (AFE) transceiver, clock and timer, and Power over Ethernet (PoE+) solutions for both ends of the cable. This places TI in a unique position in the industry to meet small cell backhaul challenges at a system level.

"We are excited to be collaborating with Airspan on their next-generation AirSynergy small cell solution," said Ruwanga Dassanayake, worldwide business manager, communications infrastructure, TI. "Airspan is generating buzz in this fast growing market with their integrated outdoor pico small cell and backhaul approach, and we look forward to seeing their small cell solution deployed in the field quickly."

Visit TI @ Mobile World Congress
While at MWC, visit TI at 2A4MR and 2B3MR to learn more about the latest communications infrastructure news, and to check out a broad range of TI-based demos. For more information please contact: Ruwanga Dassanayake, WW Business Manager at [email protected].

For more information:

About TI's KeyStone multicore architecture
Texas Instruments' KeyStone multicore architecture is the platform for true multicore innovation, offering developers a robust portfolio of high performance, low-power multicore devices. Unleashing breakthrough performance, the KeyStone architecture is the foundation upon which TI's new TMS320C66x DSP generation was developed. KeyStone differs from any other multicore architecture as it has the capacity to provide full processing capability to every core in a multicore device. KeyStone-based devices are optimized for high performance markets including wireless base stations, mission critical, test and automation, medical imaging and high performance computing. Learn more at www.ti.com/multicore.

About Airspan Networks Inc.
Airspan (OTC Markets: AIRO) is a leading 4G LTE Small Cell solution provider, with over 1000 customers in over 100 countries. Airspan is regularly recognized as a leader and pioneer in 4G LTE and Small Cell technologies. Airspan has an expansive product portfolio, which includes indoor and outdoor Pico cells, and all-outdoor, compact Micro and Macro base stations, a wide variety of user devices, and advanced core network products. These connectivity solutions operate in bands from 400 MHz up to 6.4 GHz. For more information see www.airspan.com.

About Texas Instruments
Texas Instruments Incorporated (TI) is a global semiconductor design and manufacturing company that develops analog ICs and embedded processors. By employing the world's brightest minds, TI creates innovations that shape the future of technology. TI is helping more than 100,000 customers transform the future, today. Learn more at www.ti.com.

Trademarks
All trademarks are the property of their respective owners.

SOURCE Texas Instruments

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
While some vendors scramble to create and sell you a fancy solution for monitoring your spanking new Amazon Lambdas, hear how you can do it on the cheap using just built-in Java APIs yourself. By exploiting a little-known fact that Lambdas aren’t exactly single threaded, you can effectively identify hot spots in your serverless code. In his session at 20th Cloud Expo, David Martin, Principal Product Owner at CA Technologies, will give a live demonstration and code walkthrough, showing how to o...
The explosion of new web/cloud/IoT-based applications and the data they generate are transforming our world right before our eyes. In this rush to adopt these new technologies, organizations are often ignoring fundamental questions concerning who owns the data and failing to ask for permission to conduct invasive surveillance of their customers. Organizations that are not transparent about how their systems gather data telemetry without offering shared data ownership risk product rejection, regu...
In his keynote at 19th Cloud Expo, Sheng Liang, co-founder and CEO of Rancher Labs, discussed the technological advances and new business opportunities created by the rapid adoption of containers. With the success of Amazon Web Services (AWS) and various open source technologies used to build private clouds, cloud computing has become an essential component of IT strategy. However, users continue to face challenges in implementing clouds, as older technologies evolve and newer ones like Docker c...
SYS-CON Events announced today that Hitachi, the leading provider the Internet of Things and Digital Transformation, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Hitachi Data Systems, a wholly owned subsidiary of Hitachi, Ltd., offers an integrated portfolio of services and solutions that enable digital transformation through enhanced data management, governance, mobility and analytics. We help globa...
Cloud Expo, Inc. has announced today that Aruna Ravichandran, vice president of DevOps Product and Solutions Marketing at CA Technologies, has been named co-conference chair of DevOps at Cloud Expo 2017. The @DevOpsSummit at Cloud Expo New York will take place on June 6-8, 2017, at the Javits Center in New York City, New York, and @DevOpsSummit at Cloud Expo Silicon Valley will take place Oct. 31-Nov. 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA.
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
@DevOpsSummit at Cloud taking place June 6-8, 2017, at Javits Center, New York City, is co-located with the 20th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to wait for long developm...
With major technology companies and startups seriously embracing IoT strategies, now is the perfect time to attend @ThingsExpo 2016 in New York. Learn what is going on, contribute to the discussions, and ensure that your enterprise is as "IoT-Ready" as it can be! Internet of @ThingsExpo, taking place June 6-8, 2017, at the Javits Center in New York City, New York, is co-located with 20th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry p...
Translating agile methodology into real-world best practices within the modern software factory has driven widespread DevOps adoption, yet much work remains to expand workflows and tooling across the enterprise. As models evolve from pockets of experimentation into wholescale organizational reinvention, practitioners find themselves challenged to incorporate the culture and architecture necessary to support DevOps at scale. In his session at @DevOpsSummit at 20th Cloud Expo, Anand Akela, Senior...
SYS-CON Events announced today that Juniper Networks (NYSE: JNPR), an industry leader in automated, scalable and secure networks, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Juniper Networks challenges the status quo with products, solutions and services that transform the economics of networking. The company co-innovates with customers and partners to deliver automated, scalable and secure network...
Five years ago development was seen as a dead-end career, now it’s anything but – with an explosion in mobile and IoT initiatives increasing the demand for skilled engineers. But apart from having a ready supply of great coders, what constitutes true ‘DevOps Royalty’? It’ll be the ability to craft resilient architectures, supportability, security everywhere across the software lifecycle. In his keynote at @DevOpsSummit at 20th Cloud Expo, Jeffrey Scheaffer, GM and SVP, Continuous Delivery Busine...
SYS-CON Events announced today that Progress, a global leader in application development, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Enterprises today are rapidly adopting the cloud, while continuing to retain business-critical/sensitive data inside the firewall. This is creating two separate data silos – one inside the firewall and the other outside the firewall. Cloud ISVs oft...
As pervasive as cloud technology is -- and as persuasive as the arguments are for using it -- the cloud has its limits. Some companies will always have security concerns about storing data in the cloud and certain high-transaction applications will always be better suited for on-premises storage. Those statements were among the bottom-line takeaways delivered at Cloud Expo this week, a three day, bi-annual event focused on cloud technologies, adoption and associated challenges.
Bert Loomis was a visionary. This general session will highlight how Bert Loomis and people like him inspire us to build great things with small inventions. In their general session at 19th Cloud Expo, Harold Hannon, Architect at IBM Bluemix, and Michael O'Neill, Strategic Business Development at Nvidia, discussed the accelerating pace of AI development and how IBM Cloud and NVIDIA are partnering to bring AI capabilities to "every day," on-demand. They also reviewed two "free infrastructure" pr...
SYS-CON Events announced today that T-Mobile will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. As America's Un-carrier, T-Mobile US, Inc., is redefining the way consumers and businesses buy wireless services through leading product and service innovation. The Company's advanced nationwide 4G LTE network delivers outstanding wireless experiences to 67.4 million customers who are unwilling to compromise on ...