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NXP Unveils Extremely Small DSP-Based 5V Qi Wireless Charger Device

Single Chip Integrates All Critical Circuits in a Tiny 5-mm x 5-mm Package; NFC Enables "Smart" Wireless Charging

EINDHOVEN, THE NETHERLANDS and BARCELONA, SPAIN -- (Marketwired) -- 02/26/14 -- At Mobile World Congress this week, NXP Semiconductors (NASDAQ: NXPI) is demonstrating a revolutionary new Qi wireless charging transmitter device, which integrates all the circuits for a 5V mobile phone charger in an extremely small package measuring only 5-mm square. Using the NXP solution, fewer than 10 external components are needed to build a complete low-power 5V Qi A5/A11 wireless charging transmitter, alongside the Qi coil and resonant capacitors. The exceptionally tiny footprint of the NXP NXQ1TXA5 system-on-chip means that the whole transmitter sits on a PCB of less than 1.5 cm-square with components on a single side. This opens up interesting possibilities for innovative wireless charging pad designs, including fitting the transmitter within the center of the Qi coil. NXP is showing its groundbreaking reference design and 5V Qi wireless charger prototypes at Mobile World Congress (Hall 7, Stand 7E30), and a video of the demo is available here: http://youtu.be/ehGBI4blOtU

In addition, NXP is demonstrating two "smart" wireless charging reference designs for 12V and 19V Qi transmitters, featuring NFC (Near Field Communication) technology. By adding NFC, wireless chargers can offer a wide range of additional functionality. Consumers can configure wireless charging pad settings via any NFC-enabled phone or tablet, and NFC could be used to trigger "wake up" of the wireless charger, thus enabling zero standby current when not in use. Other smart features include automatic Bluetooth pairing, or launching applications and web sites when an NFC-enabled phone is put on the charging pad.

"Our new wireless charging solution for 5V Qi transmitters enables our key customers to build very small Qi transmitters -- bringing system costs down dramatically and offering a high degree of freedom in portable wireless charger design. By significantly reducing the size and cost of Qi transmitters, we're opening the exciting possibility for mobile phone manufacturers to deliver wireless charging pads as a standard feature," said Rick Dumont, marketing director, wireless charging solutions, NXP Semiconductors. "We've also received tremendous feedback on our 'smart' wireless charging solutions using NFC. The next generation of Qi wireless charging pads with NFC will enable users to stream music to their Bluetooth speakers and deliver useful content to their mobile devices as they are charging -- all while economizing on overall power consumption."

Enabling Breakthrough Integration in 5V Qi Wireless Transmitters
The NXQ1TXA5 system-on-chip integrates a power controller, digital signal processing (DSP), voltage regulation, Foreign Object Detection (FOD), a full-bridge power stage to drive the transmitter coil, and circuits for on-chip current and voltage measurement -- leaving very few external components to complete the solution. Using the NXP CoolFlux™ DSP technology, the device is extremely power efficient, achieving standby power of under 2 mW.

The reference design for the NXQ1TXA5 forms a complete wireless charger designed to meet low-power Qi A5/A11 specifications for 5V chargers and can be powered by standard USB wall chargers or PC USB ports. NXP's high-efficiency GreenChip™ TEA1720 SMPS controller complements this low-power reference design to achieve overall low-power standby operation.

"Smart" Wireless Charging with Very High Efficiency
The two other reference designs in the NXP wireless charger transmitter devices family include the NXQ1TXA6, designed to meet the Qi A6 standard for 12V, as well as the NXQ1TXA1 which is designed to meet Qi A1/A10 standard for 19V charging transmitters. Both the NXQ1TXA1 and NXQ1TXA6 come in a small package of 7-mm square with only 32 pins spaced 0.5-mm apart for easy PCB design. NXP provides a complete low component count reference design based on NXQ1TXA1 and NXQ1TXA6, with other high-performing components of its portfolio such as the GreenChip NWP2081 half-bridge driver, and NX2020N2 low RDS(on) trench MOSFETs for the coil-driving power bridge.

Availability
NXP's reference designs for its wireless charger transmitter devices will be made available in Q2 for selected customers, and the parts will be qualified for mass production in Q3.

Links

  • VIDEO: Smart wireless charging with NFC - NXP at Mobile World Congress 2014: http://youtu.be/ehGBI4blOtU
  • Wireless charging solutions from NXP:

http://www.nxp.com/applications/power-management/Wireless-charging-solutions/

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) creates solutions that enable secure connections for a smarter world. Building on its expertise in High Performance Mixed Signal electronics, NXP is driving innovation in the automotive, identification and mobile industries, and in application areas including wireless infrastructure, lighting, healthcare, industrial, consumer tech and computing. NXP has operations in more than 25 countries, and posted revenue of $4.82 billion in 2013. Find out more at www.nxp.com.

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations and market data, as well as other statements that are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. Readers are cautioned not to place undue reliance on these forward-looking statements. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after NXP distributes this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in NXP's SEC filings. Copies of NXP's SEC filings are available from the SEC website, www.sec.gov.

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For further press information, please contact:
NXP Semiconductors
Global:
Eureka Endo
+44 795 828 7483
[email protected]

NA:
Hillary Cain
+1 408 518 5227
[email protected]

GC :
Jannet Chen
+86 21 22055883
[email protected]

APAC:
Preeti Gupta
+65 6603 9022
[email protected]

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