Welcome!

News Feed Item

IEEE Forms Two Working Groups to Standardize Steps in Electronic Design Automation Focusing on Mixed-Signal Language Extensions and Interoperability of Large Scale Integration, Package and Board Design

IEEE, the world’s largest professional organization dedicated to advancing technology for humanity, today announced that the IEEE Standards Association (IEEE-SA) approved the formation of the IEEE P1666.1™ SystemC Analog/Mixed-Signal (AMS) Extensions Working Group and the IEEE P2401™ LPB – Standard Format for Large Scale Integration (LSI)-Package-Board Interoperable Design Working Group. Due to their technical work in electronic design automation (EDA) standards development, both working groups are sponsored by the IEEE Computer Society’s Design Automation Standards Committee (DASC).

“These draft standards seek to aid in the development of more powerful and economically affordable electronics,” said Stan Krolikoski, chair of the DASC. “Building in affordability broadens access to electronics, so more people can expand their reach of information, automate daily tasks and much more. In addition, both working groups are a result of the IEEE-SA’s collaboration with Accellera Systems Initiative and the Japan Electronics and Information Technology Industries Association (JEITA), which are organizations that support standards development for use by the global electronics industry.”

As the core standard, IEEE 1666™-2011 “Standard for SystemC Language Reference Manual” provides the high-level design and modeling language for digital electronics. Augmenting that standard, IEEE P1666.1 “SystemC Analog/Mixed-Signal (AMS) Extensions Language Reference Manual” is intended to allow SystemC to capture both analog and digital design content. With the objective to standardize the SystemC AMS extensions, IEEE P1666.1 defines AMS extensions as a powerful language option in the electronic system-level (ESL) design process.

“IEEE P1666.1 is expanding SystemC to model both digital and AMS functions,” said Martin Barnasconi, chair of the IEEE P1666.1 working group. “These two domains are increasingly found in System-on-a-chip (SoC) and embedded systems; therefore, this extension enables the modeling and design of these emerging heterogeneous systems more efficiently and effectively.”

IEEE P2401 “Standard Format for LSI-Package-Board Interoperable Design” seeks to standardize the data exchange format for the integrated circuit, the package and the board—the three components that make up the hardware system. This interoperable format will expedite the exchange of design information among the three components, thereby speeding up system design at lower cost.

“The intention of IEEE P2401 is to offer a common format that LSI-Package-Board design tools can use to exchange information and data seamlessly,” said Yoshinori Fukuba, chair of the IEEE P2401 working group. “The standard proposes to eliminate the multiple different input and output formats. As a result, the standard will allow for the use of a common interoperable format during the design process.”

Both working groups are actively seeking participants for the development of these standards. For more information on the IEEE P1666.1 SystemC Analog Mixed Signal (AMS) Extensions Working Group, please visit https://standards.ieee.org/develop/wg/P1666.1.html. For more information on the IEEE P2401 LPB – Standard Format for LSI-Package-Board Interoperable Design Working Group, please visit https://standards.ieee.org/develop/wg/LPB.html.

IEEE 1666-2011 is available at no charge via the IEEE GET Program, which grants the public free access to view and download certain current individual standards. To view and download IEEE 1666-2011, please visit the IEEE 1666-2011 GET Program web page.

To learn more about IEEE-SA, visit us on Facebook at http://www.facebook.com/ieeesa, follow us on Twitter at http://www.twitter.com/ieeesa, connect with us on LinkedIn at http://www.linkedin.com/groups?gid=1791118 or on the Standards Insight Blog at http://www.standardsinsight.com.

About the IEEE Standards Association

The IEEE Standards Association, a globally recognized standards-setting body within IEEE, develops consensus standards through an open process that engages industry and brings together a broad stakeholder community. IEEE standards set specifications and best practices based on current scientific and technological knowledge. The IEEE-SA has a portfolio of over 900 active standards and more than 500 standards under development. For more information visit http://standards.ieee.org/.

About IEEE

IEEE, a large, global technical professional organization, is dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice on a wide variety of areas ranging from aerospace systems, computers and telecommunications to biomedical engineering, electric power and consumer electronics. Learn more at http://www.ieee.org.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today that N3N will exhibit at SYS-CON's @ThingsExpo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. N3N’s solutions increase the effectiveness of operations and control centers, increase the value of IoT investments, and facilitate real-time operational decision making. N3N enables operations teams with a four dimensional digital “big board” that consolidates real-time live video feeds alongside IoT sensor data a...
Internet of @ThingsExpo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 21st Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The Internet of Things (IoT) is the most profound change in personal and enterprise IT since the creation of the Worldwide Web more than 20 years ago. All major researchers estimate there will be tens of billions devic...
Mobile device usage has increased exponentially during the past several years, as consumers rely on handhelds for everything from news and weather to banking and purchases. What can we expect in the next few years? The way in which we interact with our devices will fundamentally change, as businesses leverage Artificial Intelligence. We already see this taking shape as businesses leverage AI for cost savings and customer responsiveness. This trend will continue, as AI is used for more sophistica...
SYS-CON Events announced today that SourceForge has been named “Media Sponsor” of SYS-CON's 21st International Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. SourceForge is the largest, most trusted destination for Open Source Software development, collaboration, discovery and download on the web serving over 32 million viewers, 150 million downloads and over 460,000 active development projects each and every month.
There is a huge demand for responsive, real-time mobile and web experiences, but current architectural patterns do not easily accommodate applications that respond to events in real time. Common solutions using message queues or HTTP long-polling quickly lead to resiliency, scalability and development velocity challenges. In his session at 21st Cloud Expo, Ryland Degnan, a Senior Software Engineer on the Netflix Edge Platform team, will discuss how by leveraging a reactive stream-based protocol,...
Today most companies are adopting or evaluating container technology - Docker in particular - to speed up application deployment, drive down cost, ease management and make application delivery more flexible overall. As with most new architectures, this dream takes significant work to become a reality. Even when you do get your application componentized enough and packaged properly, there are still challenges for DevOps teams to making the shift to continuous delivery and achieving that reducti...
SYS-CON Events announced today that Daiya Industry will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Daiya Industry specializes in orthotic support systems and assistive devices with pneumatic artificial muscles in order to contribute to an extended healthy life expectancy. For more information, please visit https://www.daiyak...
SYS-CON Events announced today that Nihon Micron will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Nihon Micron Co., Ltd. strives for technological innovation to establish high-density, high-precision processing technology for providing printed circuit board and metal mount RFID tags used for communication devices. For more inf...
SYS-CON Events announced today that Massive Networks, that helps your business operate seamlessly with fast, reliable, and secure internet and network solutions, has been named "Exhibitor" of SYS-CON's 21st International Cloud Expo ®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. As a premier telecommunications provider, Massive Networks is headquartered out of Louisville, Colorado. With years of experience under their belt, their team of...
SYS-CON Events announced today that Suzuki Inc. will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Suzuki Inc. is a semiconductor-related business, including sales of consuming parts, parts repair, and maintenance for semiconductor manufacturing machines, etc. It is also a health care business providing experimental research for...
"Our strategy is to focus on the hyperscale providers - AWS, Azure, and Google. Over the last year we saw that a lot of developers need to learn how to do their job in the cloud and we see this DevOps movement that we are catering to with our content," stated Alessandro Fasan, Head of Global Sales at Cloud Academy, in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
Enterprises are moving to the cloud faster than most of us in security expected. CIOs are going from 0 to 100 in cloud adoption and leaving security teams in the dust. Once cloud is part of an enterprise stack, it’s unclear who has responsibility for the protection of applications, services, and data. When cloud breaches occur, whether active compromise or a publicly accessible database, the blame must fall on both service providers and users. In his session at 21st Cloud Expo, Ben Johnson, C...
21st International Cloud Expo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud strategy. Me...
Many organizations adopt DevOps to reduce cycle times and deliver software faster; some take on DevOps to drive higher quality and better end-user experience; others look to DevOps for a clearer line-of-sight to customers to drive better business impacts. In truth, these three foundations go together. In this power panel at @DevOpsSummit 21st Cloud Expo, moderated by DevOps Conference Co-Chair Andi Mann, industry experts will discuss how leading organizations build application success from all...
SYS-CON Events announced today that mruby Forum will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. mruby is the lightweight implementation of the Ruby language. We introduce mruby and the mruby IoT framework that enhances development productivity. For more information, visit http://forum.mruby.org/.