|By PR Newswire||
|March 10, 2014 02:00 AM EDT||
PHOENIX, March 10, 2014 /PRNewswire/ -- FlipChip International - (FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced they will give the following paper at the IMAPS – 10th International Conference and Exhibition on Device Packaging 2014 in Scottsdale Arizona, USA.
Dielectric Laser Via Drilling for Next Generation Wafer Level Processing
Jim Zaccardi, FlipChip International (Guy Burgess, Theodore Tessier, FlipChip International;
Matt Souter, SUSS MicroTec Photonic Systems Inc.)
The common via formation processes used today for dielectrics in WLCSP RDL and flipchip products typically rely on standard photolithography processing using stepper and 1x aligner equipment and processes. There is considerable interest in using laser via drilling (ablation) in dielectrics for flipchip, RDL inner layers, and WLCSP processing for reduced via dimensions and enabling a broader range of dielectric materials, including inherently non-photosensitive options. This presentation will demonstrate "state of the art" laser ablation process results; through different dielectrics showing improved feature resolution and reduced via opening sizes resulting in significantly improved interconnect density. Laser via drilling is a more simplified process compared to traditional photolithography methods. This presentation will demonstrate how using laser via drilling could dramatically improve the design rules for next generation RDL designs.
The paper will be presented on Tuesday, March 11th at 3:00pm.
Ted Tessier, FCI's CTO commented, "For nearly 2 decades, FCI has been the recognized industry leader in flip chip and WLCSP technology development, due to our unmatched experience in bumping related product and process development and engineering in Phoenix, Arizona and more recently in Shanghai, China. Since its beginnings, FCI has worked closely with our material and equipment suppliers, to identify leading edge technologies that push the limits of wafer level packaging. Minimum via size and capture pad dimensions have long been pinch-points to substantially increasing the interconnection density of redistribution layers. Laser via drilling is a game changing technology that enables significant interconnection density improvements, while also enabling a number of other important material and process improvements."
FlipChip International – (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI is a leader in wafer level packaging and high volume plastic assembly and final test with patented technologies spanning from Cu Pillar Bumping, Spheron™ Wafer Level Chipscale Packaging, and ChipsetT™ Embedded Die Packaging, and FlipChip on Lead frame assembly has a global footprint, offering high volume advanced packaging services from ISO/TS 16949-certified factories located in Phoenix, AZ, Shanghai, China and Porto, Portugal.
SOURCE FlipChip International
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