Welcome!

News Feed Item

Big Performance, Small Package: Akustica’s Newest MEMS Microphones Target Smartphones and Wearables

Akustica, Inc., a Bosch Group company and leading provider of MEMS microphones, has added four new high-performance analog microphones to its high definition (HD) voice product line, including the AKU346, the industry’s smallest MEMS microphone to achieve 64dB SNR. Designed to meet the size-performance constraints of smartphones and even the smallest wearables, the new HD voice microphones combine small footprint, high signal-to-noise ratio (SNR), tight sensitivity matching, and a super-wideband frequency response to improve intelligibility and speech-recognition accuracy in consumer-electronic devices.

Akustica's new HD voice MEMS microphones deliver superior voice capture in smartphones and wearables ...

Akustica's new HD voice MEMS microphones deliver superior voice capture in smartphones and wearables (Photo: Business Wire)

New innovations in design and manufacturing enable an inherently guaranteed +/-1dB sensitivity matching between microphones. This microphone-to-microphone uniformity, along with the high SNR of the new HD voice microphones, fulfills a critical need for consumer-electronic device manufacturers who incorporate more than one microphone along with noise suppression algorithms into their devices. These algorithms generally rely on well-matched, high-performance microphones for optimization of noise cancellation and speech recognition accuracy.

Particularly challenging use cases for speech recognition are noisy environments and applications where the speaker is far away (>3 feet) from the microphones. In these situations, testing has shown that even a small improvement in SNR (1-2dB) can lead to dramatic improvements in command accuracy rates (>5%). A few percentage points of accuracy can make the difference between speech recognition ubiquity and obsolescence. This has led device manufacturers to continually look for higher performance and more uniform microphones that can meet the needs of their multi-microphone application without incurring the extra costs commonly charged today for binning and sorting after final test.

“The need for the highest-performing multi-microphone solutions is growing rapidly in the smartphone market, where the average number of microphones per phone has been steadily increasing for the last few years,” said Jérémie Bouchaud, director and senior principal analyst, MEMS & Sensors, IHS. “Today, the use of two microphones has become a standard feature for smartphones. Higher-end phones can have upwards of four microphones, further increasing the need for high SNR and tighter sensitivity matching like that provided by Akustica’s new microphones.”

Bouchaud also pointed out that MEMS microphones achieving ≥64dB SNR comprise the fastest-growing portion of the overall MEMS microphone market and are expected to generate 50% of the revenue of this important market segment by 2017.

AKU346 – Industry’s Smallest MEMS Microphone with 64dB SNR

With a footprint of just 6mm2 and an ultra-thin 0.93mm height, the AKU346 utilizes 33 percent less design space than a typical industry standard bottom-port microphone but still achieves a 64dB SNR--making it particularly well suited for use in small wearable accessories such as wired and wireless headsets, smartwatches and glasses.

AKU143, AKU345, AKU344

The AKU143, AKU345, and AKU344 are top- and bottom-port microphones with a higher SNR of 65dB, and are footprint and pin-for-pin compatible with previous generations of Akustica HD voice microphones. The industry standard form factors of all three microphones provide a straightforward path for upgrading performance of current designs.

All four of the new microphones can also support ultrasonic applications such as gesture recognition, gaming, pens and location detection.

In-house MEMS Design and Manufacturing Capability

Akustica’s new generation of HD voice microphones round out a complete portfolio of Bosch MEMS sensors supporting the human-machine interface (HMI) within consumer-electronic devices, and is another demonstration of Bosch’s commitment to consistently delivering high-performance, high-volume and high-quality MEMS sensors. With in-house design teams for MEMS, circuit design, and packaging, and more than 1000 MEMS patents and 20+ years of MEMS manufacturing experience, Akustica has quickly been able to introduce a new generation of HD voice microphones with higher performance, more uniformity, greater robustness, and smaller footprints. Additionally, Akustica’s customers now benefit from the additional economies of scale gained by manufacturing in Bosch’s advanced 8” (200mm) wafer fabrication facility in Reutlingen, Germany.

“In-house MEMS design and manufacturing speeds new product development and allows us to be a reliable and valuable partner for our customers,” said Horst Muenzel, CEO and general manager, Akustica. “We are committed to delivering new and compelling features to our customers while also adhering to stringent Bosch principles of quality and environmental responsibility. As a result, our customers know they can depend on us to deliver high volumes of MEMS microphones on time and in-spec with the high levels of performance, quality, and reliability that they have come to expect from Bosch.”

Availability

Samples of all four new HD voice microphones are available now for lead customers with mass production planned for Q2 2014. For customer pricing information, please visit http://www.akustica.com/contact.asp to find a local sales representative. For more information and datasheets for these products, please visit www.akustica.com.

About Akustica:

Akustica is a wholly owned subsidiary of the Bosch Group and a top supplier of silicon microphone products that are improving voice-input quality in a host of voice-enabled applications, from mobile phones, laptops and tablets to small wearable accessories like headsets. The company offers worldwide customer support services, from design-in services to post-production quality assurance. Akustica is a global organization with corporate headquarters in Pittsburgh, PA, regional offices in Taiwan and Shanghai, and a worldwide team of distributors. For more information about Akustica, go to: www.akustica.com.

The Bosch Group is a leading global supplier of technology and services. According to preliminary figures, its roughly 281,000 associates generated sales of 46.4 billion euros ($61.6 billion) in 2013*. The Bosch Group comprises Robert Bosch GmbH and its more than 350 subsidiaries and regional companies in some 60 countries. If its sales and service partners are included, then Bosch is represented in roughly 150 countries. Its operations are divided into four business sectors: Automotive Technology, Industrial Technology, Consumer Goods, and Energy and Building Technology. This worldwide development, manufacturing, and sales network is the foundation for further growth. In 2013, Bosch applied for some 5,000 patents worldwide. The Bosch Group’s products and services are designed to fascinate, and to improve the quality of life by providing solutions which are both innovative and beneficial. In this way, the company offers technology worldwide that is “Invented for life.” Additional information on the global organization is available online at www.bosch.com, www.bosch-press.com, and http://twitter.com/BoschPresse.

*Due to a change in legal rules governing consolidation, 2013 figures can only be compared to a limited extent with 2012 figures. Exchange rate: 1 EUR = $1.32812

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today that Outscale, a global pure play Infrastructure as a Service provider and strategic partner of Dassault Systèmes, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Founded in 2010, Outscale simplifies infrastructure complexities and boosts the business agility of its customers. Outscale delivers a secure, reliable and industrial strength solution for its customers, which in...
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend @CloudExpo | @ThingsExpo, June 6-8, 2017, at the Javits Center in New York City, NY and October 31 - November 2, 2017, Santa Clara Convention Center, CA. Learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.
SYS-CON Events announced today that EARP Integration will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. EARP Integration is a passionate software house. Since its inception in 2009 the company successfully delivers smart solutions for cities and factories that start their digital transformation. EARP provides bespoke solutions like, for example, advanced enterprise portals, business intelligence systems an...
IBM helps FinTechs and financial services companies build and monetize cognitive-enabled financial services apps quickly and at scale. Hosted on IBM Bluemix, IBM’s platform builds in customer insights, regulatory compliance analytics and security to help reduce development time and testing. In his session at 20th Cloud Expo, Tom Eck, Industry Platforms CTO at IBM Cloud, will discuss how these tools simplify the time-consuming tasks of selection, mapping and data integration, allowing developers ...
Existing Big Data solutions are mainly focused on the discovery and analysis of data. The solutions are scalable and highly available but tedious when swapping in and swapping out occurs in disarray and thrashing takes place. The resolution for thrashing through machine learning algorithms and support nomenclature is through simple techniques. Organizations that have been collecting large customer data are increasingly seeing the need to use the data for swapping in and out and thrashing occurs ...
In his session at 20th Cloud Expo, Brad Winett, Senior Technologist for DDN Storage, will present several current, end-user environments that are using object storage at scale for cloud deployments including private cloud and cloud providers. Details on the top considerations of features and functions for selecting object storage will be included. Brad will also touch on recent developments in tiering technologies that deliver single solution and an end-user view of data across files and objects...
For financial firms, the cloud is going to increasingly become a crucial part of dealing with customers over the next five years and beyond, particularly with the growing use and acceptance of virtual currencies. There are new data storage paradigms on the horizon that will deliver secure solutions for storing and moving sensitive financial data around the world without touching terrestrial networks. In his session at 20th Cloud Expo, Cliff Beek, President of Cloud Constellation Corporation, w...
Most DevOps journeys involve several phases of maturity. Research shows that the inflection point where organizations begin to see maximum value is when they implement tight integration deploying their code to their infrastructure. Success at this level is the last barrier to at-will deployment. Storage, for instance, is more capable than where we read and write data. In his session at @DevOpsSummit at 20th Cloud Expo, Josh Atwell, a Developer Advocate for NetApp, will discuss the role and value...
Amazon started as an online bookseller 20 years ago. Since then, it has evolved into a technology juggernaut that has disrupted multiple markets and industries and touches many aspects of our lives. It is a relentless technology and business model innovator driving disruption throughout numerous ecosystems. Amazon’s AWS revenues alone are approaching $16B a year making it one of the largest IT companies in the world. With dominant offerings in Cloud, IoT, eCommerce, Big Data, AI, Digital Assis...
SYS-CON Events announced today that Progress, a global leader in application development, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Enterprises today are rapidly adopting the cloud, while continuing to retain business-critical/sensitive data inside the firewall. This is creating two separate data silos – one inside the firewall and the other outside the firewall. Cloud ISVs oft...
The 21st International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Digital Transformation, Machine Learning and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding busin...
Internet of @ThingsExpo, taking place October 31 - November 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 21st International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. @ThingsExpo Silicon Valley Call for Papers is now open.
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm. In his Day 3 Keynote at 20th Cloud Expo, Chris Brown, a Solutions Marketing Manager at Nutanix, will explore t...
As cloud adoption continues to transform business, today's global enterprises are challenged with managing a growing amount of information living outside of the data center. The rapid adoption of IoT and increasingly mobile workforce are exacerbating the problem. Ensuring secure data sharing and efficient backup poses capacity and bandwidth considerations as well as policy and regulatory compliance issues.
Interested in leveling up on your Cloud Foundry skills? Join IBM for Cloud Foundry Days on June 7 at Cloud Expo New York at the Javits Center in New York City. Cloud Foundry Days is a free half day educational conference and networking event. Come find out why Cloud Foundry is the industry's fastest-growing and most adopted cloud application platform.