Welcome!

News Feed Item

EV Group Boosts 2.5D And 3D-IC/TSV Performance With New NanoSpray Application On EVG150XT High-Volume-Manufacturing Photoresist Processing System

ST. FLORIAN, Austria, March 12, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.  NanoSpray provides conformal coating of structures that have vertical sidewall angles—such as through-silicon vias (TSVs), through-glass vias and through-substrate vias used for 2.5D interposers and 3D-ICs—with thick polymer liners and photoresists.  This unique capability, which is already available on previous-generation EVG resist processing platforms, has been used in production to reduce mechanical stress and improve electrical performance of these advanced-packaging interconnect structures.

EVG(R)150N XT Automated NanoSpray(TM) Coating System

TSV interconnects are critical to the development of 2.5D/3D-ICs since they enable through-chip communication between the vertically stacked device layers.  Resist coating layers are needed around the sidewalls of these structures—for passivation to protect against corrosion, isolation to reduce electrical noise, as a compliant layer to mitigate thermal stress or as a photoresist mask for in-via photolithography prior to etching. 

"NanoSpray technology from EVG to deposit uniform polymer liners in high aspect ratio through vias in glass is an important technology that we are using in our glass industry program that enabled us to lower stress and improve reliability of glass through package vias (TPVs)," stated Dr. Rao R. Tummala, professor and director of the Georgia Institute of Technology 3D Systems Packaging Research Center (GT PRC). 

EVG's NanoSpray technology is unique in its ability to deposit thick polymer liners (from 1-20 microns thick) cost-effectively.  NanoSpray has already been adopted by multiple customers due to its ability to improve electrical performance characteristics, such as reducing insertion loss, crosstalk and leakage current, as well as reducing mechanical stress in TSVs.  NanoSpray is available on EVG's 200-mm resist processing platforms as well as its latest-generation 300-mm resist processing systems, such as the EVG150XT, which provides up to a three-fold increase in throughput over prior-generation platforms.

According to DI Franz Schrank, MAS, project manager for 3D integration at ams AG, a leading developer and manufacturer of high-performance analog IC and sensor solutions, "The products we deliver to our customers need both exceptional performance, small footprint and low system cost, which is enabled by integration of multiple functions.  We have worked closely with EV Group for several years in our advanced manufacturing applications such as 3D integrated sensors, where EVG's NanoSpray solution has delivered the conformal resist coating performance we've needed for our 3D/TSV volume production."

"Our NanoSpray technology tackles several critical reliability and thermal issues associated with 3D-IC integration," stated Markus Wimplinger, corporate technology development and IP director at EV Group.  "By combining this unique capability on our most advanced resist processing platform for volume production applications, we are one step closer to offering a complete 2.5D/3D-integration solution for our customers.  This is a clear example of taking our 'Triple-i' strategy of invent, innovate and implement to its natural conclusion."

Media and analysts interested in learning more about EVG's latest developments in photoresist and lithography processing, as well as other high-volume manufacturing solutions, are invited to attend the company's presentation during the iMAPS 10th International Conference and Exhibition on Device Packaging in Scottsdale, Ariz., March 11-13.  EVG spokespeople will present "Temporary Bonding Cost Of Ownership: The Link Between Low Total Thickness Variation and Chip Yield," co-authored with Dow Corning, on Thursday, March 13 at 9:45 a.m. in the Advanced 3D Packaging 1 session.  

About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices.  Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.  Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.  More information about EVG is available at www.EVGroup.com.

Photo -  http://photos.prnewswire.com/prnh/20140312/SF80553

SOURCE EV Group

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
If you’re responsible for an application that depends on the data or functionality of various IoT endpoints – either sensors or devices – your brand reputation depends on the security, reliability, and compliance of its many integrated parts. If your application fails to deliver the expected business results, your customers and partners won't care if that failure stems from the code you developed or from a component that you integrated. What can you do to ensure that the endpoints work as expect...
DevOps at Cloud Expo – being held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA – announces that its Call for Papers is open. Born out of proven success in agile development, cloud computing, and process automation, DevOps is a macro trend you cannot afford to miss. From showcase success stories from early adopters and web-scale businesses, DevOps is expanding to organizations of all sizes, including the world's largest enterprises – and delivering real results. Am...
SYS-CON Events announced today that Pulzze Systems will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Pulzze Systems, Inc. provides infrastructure products for the Internet of Things to enable any connected device and system to carry out matched operations without programming. For more information, visit http://www.pulzzesystems.com.
The Internet of Things can drive efficiency for airlines and airports. In their session at @ThingsExpo, Shyam Varan Nath, Principal Architect with GE, and Sudip Majumder, senior director of development at Oracle, will discuss the technical details of the connected airline baggage and related social media solutions. These IoT applications will enhance travelers' journey experience and drive efficiency for the airlines and the airports. The session will include a working demo and a technical d...
SYS-CON Events announced today that Commvault, a global leader in enterprise data protection and information management, has been named “Bronze Sponsor” of SYS-CON's 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Commvault is a leading provider of data protection and information management solutions, helping companies worldwide activate their data to drive more value and business insight and to transform moder...
The Transparent Cloud-computing Consortium (abbreviation: T-Cloud Consortium) will conduct research activities into changes in the computing model as a result of collaboration between "device" and "cloud" and the creation of new value and markets through organic data processing High speed and high quality networks, and dramatic improvements in computer processing capabilities, have greatly changed the nature of applications and made the storing and processing of data on the network commonplace.
SYS-CON Events announced today that Bsquare has been named “Silver Sponsor” of SYS-CON's @ThingsExpo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. For more than two decades, Bsquare has helped its customers extract business value from a broad array of physical assets by making them intelligent, connecting them, and using the data they generate to optimize business processes.
I'm a lonely sensor. I spend all day telling the world how I'm feeling, but none of the other sensors seem to care. I want to be connected. I want to build relationships with other sensors to be more useful for my human. I want my human to understand that when my friends next door are too hot for a while, I'll soon be flaming. And when all my friends go outside without me, I may be left behind. Don't just log my data; use the relationship graph. In his session at @ThingsExpo, Ryan Boyd, Engi...
Fact is, enterprises have significant legacy voice infrastructure that’s costly to replace with pure IP solutions. How can we bring this analog infrastructure into our shiny new cloud applications? There are proven methods to bind both legacy voice applications and traditional PSTN audio into cloud-based applications and services at a carrier scale. Some of the most successful implementations leverage WebRTC, WebSockets, SIP and other open source technologies. In his session at @ThingsExpo, Da...
SYS-CON Events announced today that Secure Channels will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. The bedrock of Secure Channels Technology is a uniquely modified and enhanced process based on superencipherment. Superencipherment is the process of encrypting an already encrypted message one or more times, either using the same or a different algorithm.
Traditional on-premises data centers have long been the domain of modern data platforms like Apache Hadoop, meaning companies who build their business on public cloud were challenged to run Big Data processing and analytics at scale. But recent advancements in Hadoop performance, security, and most importantly cloud-native integrations, are giving organizations the ability to truly gain value from all their data. In his session at 19th Cloud Expo, David Tishgart, Director of Product Marketing ...
Almost two-thirds of companies either have or soon will have IoT as the backbone of their business in 2016. However, IoT is far more complex than most firms expected. How can you not get trapped in the pitfalls? In his session at @ThingsExpo, Tony Shan, a renowned visionary and thought leader, will introduce a holistic method of IoTification, which is the process of IoTifying the existing technology and business models to adopt and leverage IoT. He will drill down to the components in this fra...
The vision of a connected smart home is becoming reality with the application of integrated wireless technologies in devices and appliances. The use of standardized and TCP/IP networked wireless technologies in line-powered and battery operated sensors and controls has led to the adoption of radios in the 2.4GHz band, including Wi-Fi, BT/BLE and 802.15.4 applied ZigBee and Thread. This is driving the need for robust wireless coexistence for multiple radios to ensure throughput performance and th...
SYS-CON Events announced today the Kubernetes and Google Container Engine Workshop, being held November 3, 2016, in conjunction with @DevOpsSummit at 19th Cloud Expo at the Santa Clara Convention Center in Santa Clara, CA. This workshop led by Sebastian Scheele introduces participants to Kubernetes and Google Container Engine (GKE). Through a combination of instructor-led presentations, demonstrations, and hands-on labs, students learn the key concepts and practices for deploying and maintainin...
Enterprise IT has been in the era of Hybrid Cloud for some time now. But it seems most conversations about Hybrid are focused on integrating AWS, Microsoft Azure, or Google ECM into existing on-premises systems. Where is all the Private Cloud? What do technology providers need to do to make their offerings more compelling? How should enterprise IT executives and buyers define their focus, needs, and roadmap, and communicate that clearly to the providers?