Welcome!

News Feed Item

EV Group Boosts 2.5D And 3D-IC/TSV Performance With New NanoSpray Application On EVG150XT High-Volume-Manufacturing Photoresist Processing System

ST. FLORIAN, Austria, March 12, 2014 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that its patented NanoSpray conformal coating technology is now available on its newly introduced EVG150XT resist coating and developing system for high-volume manufacturing (HVM) semiconductor applications.  NanoSpray provides conformal coating of structures that have vertical sidewall angles—such as through-silicon vias (TSVs), through-glass vias and through-substrate vias used for 2.5D interposers and 3D-ICs—with thick polymer liners and photoresists.  This unique capability, which is already available on previous-generation EVG resist processing platforms, has been used in production to reduce mechanical stress and improve electrical performance of these advanced-packaging interconnect structures.

EVG(R)150N XT Automated NanoSpray(TM) Coating System

TSV interconnects are critical to the development of 2.5D/3D-ICs since they enable through-chip communication between the vertically stacked device layers.  Resist coating layers are needed around the sidewalls of these structures—for passivation to protect against corrosion, isolation to reduce electrical noise, as a compliant layer to mitigate thermal stress or as a photoresist mask for in-via photolithography prior to etching. 

"NanoSpray technology from EVG to deposit uniform polymer liners in high aspect ratio through vias in glass is an important technology that we are using in our glass industry program that enabled us to lower stress and improve reliability of glass through package vias (TPVs)," stated Dr. Rao R. Tummala, professor and director of the Georgia Institute of Technology 3D Systems Packaging Research Center (GT PRC). 

EVG's NanoSpray technology is unique in its ability to deposit thick polymer liners (from 1-20 microns thick) cost-effectively.  NanoSpray has already been adopted by multiple customers due to its ability to improve electrical performance characteristics, such as reducing insertion loss, crosstalk and leakage current, as well as reducing mechanical stress in TSVs.  NanoSpray is available on EVG's 200-mm resist processing platforms as well as its latest-generation 300-mm resist processing systems, such as the EVG150XT, which provides up to a three-fold increase in throughput over prior-generation platforms.

According to DI Franz Schrank, MAS, project manager for 3D integration at ams AG, a leading developer and manufacturer of high-performance analog IC and sensor solutions, "The products we deliver to our customers need both exceptional performance, small footprint and low system cost, which is enabled by integration of multiple functions.  We have worked closely with EV Group for several years in our advanced manufacturing applications such as 3D integrated sensors, where EVG's NanoSpray solution has delivered the conformal resist coating performance we've needed for our 3D/TSV volume production."

"Our NanoSpray technology tackles several critical reliability and thermal issues associated with 3D-IC integration," stated Markus Wimplinger, corporate technology development and IP director at EV Group.  "By combining this unique capability on our most advanced resist processing platform for volume production applications, we are one step closer to offering a complete 2.5D/3D-integration solution for our customers.  This is a clear example of taking our 'Triple-i' strategy of invent, innovate and implement to its natural conclusion."

Media and analysts interested in learning more about EVG's latest developments in photoresist and lithography processing, as well as other high-volume manufacturing solutions, are invited to attend the company's presentation during the iMAPS 10th International Conference and Exhibition on Device Packaging in Scottsdale, Ariz., March 11-13.  EVG spokespeople will present "Temporary Bonding Cost Of Ownership: The Link Between Low Total Thickness Variation and Chip Yield," co-authored with Dow Corning, on Thursday, March 13 at 9:45 a.m. in the Advanced 3D Packaging 1 session.  

About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices.  Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.  Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.  More information about EVG is available at www.EVGroup.com.

Photo -  http://photos.prnewswire.com/prnh/20140312/SF80553

SOURCE EV Group

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
"Digital transformation - what we knew about it in the past has been redefined. Automation is going to play such a huge role in that because the culture, the technology, and the business operations are being shifted now," stated Brian Boeggeman, VP of Alliances & Partnerships at Ayehu, in this SYS-CON.tv interview at 21st Cloud Expo, held Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA.
The past few years have brought a sea change in the way applications are architected, developed, and consumed—increasing both the complexity of testing and the business impact of software failures. How can software testing professionals keep pace with modern application delivery, given the trends that impact both architectures (cloud, microservices, and APIs) and processes (DevOps, agile, and continuous delivery)? This is where continuous testing comes in. D
"Evatronix provides design services to companies that need to integrate the IoT technology in their products but they don't necessarily have the expertise, knowledge and design team to do so," explained Adam Morawiec, VP of Business Development at Evatronix, in this SYS-CON.tv interview at @ThingsExpo, held Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA.
"WineSOFT is a software company making proxy server software, which is widely used in the telecommunication industry or the content delivery networks or e-commerce," explained Jonathan Ahn, COO of WineSOFT, in this SYS-CON.tv interview at 21st Cloud Expo, held Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA.
Smart cities have the potential to change our lives at so many levels for citizens: less pollution, reduced parking obstacles, better health, education and more energy savings. Real-time data streaming and the Internet of Things (IoT) possess the power to turn this vision into a reality. However, most organizations today are building their data infrastructure to focus solely on addressing immediate business needs vs. a platform capable of quickly adapting emerging technologies to address future ...
Mobile device usage has increased exponentially during the past several years, as consumers rely on handhelds for everything from news and weather to banking and purchases. What can we expect in the next few years? The way in which we interact with our devices will fundamentally change, as businesses leverage Artificial Intelligence. We already see this taking shape as businesses leverage AI for cost savings and customer responsiveness. This trend will continue, as AI is used for more sophistica...
There is a huge demand for responsive, real-time mobile and web experiences, but current architectural patterns do not easily accommodate applications that respond to events in real time. Common solutions using message queues or HTTP long-polling quickly lead to resiliency, scalability and development velocity challenges. In his session at 21st Cloud Expo, Ryland Degnan, a Senior Software Engineer on the Netflix Edge Platform team, will discuss how by leveraging a reactive stream-based protocol,...
In his Opening Keynote at 21st Cloud Expo, John Considine, General Manager of IBM Cloud Infrastructure, led attendees through the exciting evolution of the cloud. He looked at this major disruption from the perspective of technology, business models, and what this means for enterprises of all sizes. John Considine is General Manager of Cloud Infrastructure Services at IBM. In that role he is responsible for leading IBM’s public cloud infrastructure including strategy, development, and offering m...
Sanjeev Sharma Joins June 5-7, 2018 @DevOpsSummit at @Cloud Expo New York Faculty. Sanjeev Sharma is an internationally known DevOps and Cloud Transformation thought leader, technology executive, and author. Sanjeev's industry experience includes tenures as CTO, Technical Sales leader, and Cloud Architect leader. As an IBM Distinguished Engineer, Sanjeev is recognized at the highest levels of IBM's core of technical leaders.
Product connectivity goes hand and hand these days with increased use of personal data. New IoT devices are becoming more personalized than ever before. In his session at 22nd Cloud Expo | DXWorld Expo, Nicolas Fierro, CEO of MIMIR Blockchain Solutions, will discuss how in order to protect your data and privacy, IoT applications need to embrace Blockchain technology for a new level of product security never before seen - or needed.
The 22nd International Cloud Expo | 1st DXWorld Expo has announced that its Call for Papers is open. Cloud Expo | DXWorld Expo, to be held June 5-7, 2018, at the Javits Center in New York, NY, brings together Cloud Computing, Digital Transformation, Big Data, Internet of Things, DevOps, Machine Learning and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding busin...
Digital transformation is about embracing digital technologies into a company's culture to better connect with its customers, automate processes, create better tools, enter new markets, etc. Such a transformation requires continuous orchestration across teams and an environment based on open collaboration and daily experiments. In his session at 21st Cloud Expo, Alex Casalboni, Technical (Cloud) Evangelist at Cloud Academy, explored and discussed the most urgent unsolved challenges to achieve f...
SYS-CON Events announced today that Synametrics Technologies will exhibit at SYS-CON's 22nd International Cloud Expo®, which will take place on June 5-7, 2018, at the Javits Center in New York, NY. Synametrics Technologies is a privately held company based in Plainsboro, New Jersey that has been providing solutions for the developer community since 1997. Based on the success of its initial product offerings such as WinSQL, Xeams, SynaMan and Syncrify, Synametrics continues to create and hone inn...
Digital Transformation (DX) is not a "one-size-fits all" strategy. Each organization needs to develop its own unique, long-term DX plan. It must do so by realizing that we now live in a data-driven age, and that technologies such as Cloud Computing, Big Data, the IoT, Cognitive Computing, and Blockchain are only tools. In her general session at 21st Cloud Expo, Rebecca Wanta explained how the strategy must focus on DX and include a commitment from top management to create great IT jobs, monitor ...
In a recent survey, Sumo Logic surveyed 1,500 customers who employ cloud services such as Amazon Web Services (AWS), Microsoft Azure, and Google Cloud Platform (GCP). According to the survey, a quarter of the respondents have already deployed Docker containers and nearly as many (23 percent) are employing the AWS Lambda serverless computing framework. It’s clear: serverless is here to stay. The adoption does come with some needed changes, within both application development and operations. Tha...