|By Business Wire||
|March 26, 2014 10:00 PM EDT||
Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering enhanced design flexibility and a high degree of reliability. The new offerings, for use in leading-edge LED lighting such as LED bulbs, MR/PAR and downlights, will be available in the market during the second quarter of this year.
Samsung Flip Chip FCOM LED Lighting (Photo: Business Wire)
“By utilizing an advanced flip chip technology, Samsung has made significant improvements to its LED packages and modules,” said Bangwon Oh, senior vice president, LED strategic marketing team, Samsung Electronics. “Our new Samsung FC and FCOM solutions also strengthen our overall line-up of LED component solutions, further enhancing our market competitiveness.”
Samsung’s new flip chip (FC) LED package and flip chip on module (FCOM) solutions feature highly efficient and versatile LED structures, created by flipping over blue LED chips and adhering phosphor film to each of them. Unlike conventional LED packages that dispense phosphor and then place a plastic mold over each chip, Samsung’s FC package technology can produce LED packages down to a chip-scale size without any mold, enabling more compact lighting fixture designs.
Samsung’s new FC and FCOM series can be driven at a current higher than that of conventional LED components, and have low thermal resistance. The low thermal resistance improves the reliability of the FC and FCOM solutions, resulting in higher flux, and a decrease in the number of packages needed, plus a reduction in the size of the circuit board.
Also, by attaching a cell film, each package gains uniform thickness and lower color deviation. As a result, the FC and FCOM solutions provide a high level of color consistency and ensure the chromaticity control of MacAdam 3-step ellipses.
The new FC and FCOM LED solutions include a middle power LED package (LM131A), a high power LED package (LH141A) and an LED downlight module, all featuring the new Samsung flip chip technology.
Flip chip middle power LED package (LM131A) and high power LED package (LH141A)
Samsung’s LM131A and LH141A flip chip packages feature exceptionally compact form factors of 1.22x1.22 millimeters and 1.4x1.4mm, respectively. By excluding a plastic mold, the two packages can function at a high current level in a highly reliable manner, even after long hour of use. These advantages make them ideal for use in LED lighting applications requiring a small form factor with high light output, including LED bulbs and spotlight products such as MRs and PARs.
In addition, the use of a phosphor film assures color quality that satisfies the MacAdam 3-step.
Flip chip on module (FCOM) for LED downlight fixtures
Samsung’s new FCOM downlight products are distinguished by their high light output. Compared to a chip-on-board (COB) engine, which has a fixed wattage, the new FCOM permits simple adjustments in the number of FC LED packages to make the module compatible with a variety of electrical drivers of different wattages, in allowing greater design flexibility.
To create a downlight with 1000lm output and 100lm/W efficacy, Samsung FCOMs require a 1.7x1.7 centimeter circuit. Such a small form factor makes these FCOMs well-suited for size-sensitive LED lighting applications, which include LED bulbs, MR/PAR spotlights, downlights and even cove lighting.
Samsung’s FCOMs satisfy the MacAdam 3-step and can support MacAdam 2-step depending on customer needs, thanks to the superb color consistency of the chips and a rating of at least 80 on the color rendering index (CRI). The new Samsung FCOMs also offer a range of correlated color temperature (CCT) – from 2700K to 5000K.
All of these new LED solutions will be showcased at the Light and Building trade fair being held in Frankfurt, Germany, March 30 - April 4, along with a wide variety of other Samsung LED component solutions. (Booth B04 in Hall 6.2)
About Samsung Electronics Co., Ltd.
Samsung Electronics Co., Ltd. is a global leader in technology, opening new possibilities for people everywhere. Through relentless innovation and discovery, we are transforming the worlds of TVs, smartphones, tablets, PCs, cameras, home appliances, printers, LTE systems, medical devices, semiconductors and LED solutions. We employ 286,000 people across 80 countries with annual sales of US$216.7 billion. To discover more, please visit www.samsung.com.
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm. In his Day 3 Keynote at 20th Cloud Expo, Chris Brown, a Solutions Marketing Manager at Nutanix, will explore t...
Apr. 30, 2017 04:45 AM EDT Reads: 1,190
NHK, Japan Broadcasting, will feature the upcoming @ThingsExpo Silicon Valley in a special 'Internet of Things' and smart technology documentary that will be filmed on the expo floor between November 3 to 5, 2015, in Santa Clara. NHK is the sole public TV network in Japan equivalent to the BBC in the UK and the largest in Asia with many award-winning science and technology programs. Japanese TV is producing a documentary about IoT and Smart technology and will be covering @ThingsExpo Silicon Val...
Apr. 30, 2017 03:45 AM EDT Reads: 9,436
In his general session at 19th Cloud Expo, Manish Dixit, VP of Product and Engineering at Dice, discussed how Dice leverages data insights and tools to help both tech professionals and recruiters better understand how skills relate to each other and which skills are in high demand using interactive visualizations and salary indicator tools to maximize earning potential. Manish Dixit is VP of Product and Engineering at Dice. As the leader of the Product, Engineering and Data Sciences team at D...
Apr. 30, 2017 03:30 AM EDT Reads: 6,241
Join IBM November 2 at 19th Cloud Expo at the Santa Clara Convention Center in Santa Clara, CA, and learn how to go beyond multi-speed it to bring agility to traditional enterprise applications. Technology innovation is the driving force behind modern business and enterprises must respond by increasing the speed and efficiency of software delivery. The challenge is that existing enterprise applications are expensive to develop and difficult to modernize. This often results in what Gartner calls ...
Apr. 30, 2017 02:45 AM EDT Reads: 3,412
The 20th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held June 6-8, 2017, at the Javits Center in New York City, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Containers, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportunity. Submit your speaking proposal ...
Apr. 30, 2017 02:45 AM EDT Reads: 1,757
Keeping pace with advancements in software delivery processes and tooling is taxing even for the most proficient organizations. Point tools, platforms, open source and the increasing adoption of private and public cloud services requires strong engineering rigor – all in the face of developer demands to use the tools of choice. As Agile has settled in as a mainstream practice, now DevOps has emerged as the next wave to improve software delivery speed and output. To make DevOps work, organization...
Apr. 30, 2017 02:45 AM EDT Reads: 9,254
The age of Digital Disruption is evolving into the next era – Digital Cohesion, an age in which applications securely self-assemble and deliver predictive services that continuously adapt to user behavior. Information from devices, sensors and applications around us will drive services seamlessly across mobile and fixed devices/infrastructure. This evolution is happening now in software defined services and secure networking. Four key drivers – Performance, Economics, Interoperability and Trust ...
Apr. 30, 2017 01:45 AM EDT Reads: 1,088
“DevOps is really about the business. The business is under pressure today, competitively in the marketplace to respond to the expectations of the customer. The business is driving IT and the problem is that IT isn't responding fast enough," explained Mark Levy, Senior Product Marketing Manager at Serena Software, in this SYS-CON.tv interview at DevOps Summit, held Nov 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA.
Apr. 30, 2017 01:15 AM EDT Reads: 16,428
SYS-CON Events announced today that CollabNet, a global leader in enterprise software development, release automation and DevOps solutions, will be a Bronze Sponsor of SYS-CON's 20th International Cloud Expo®, taking place from June 6-8, 2017, at the Javits Center in New York City, NY. CollabNet offers a broad range of solutions with the mission of helping modern organizations deliver quality software at speed. The company’s latest innovation, the DevOps Lifecycle Manager (DLM), supports Value S...
Apr. 30, 2017 01:15 AM EDT Reads: 1,456
All organizations that did not originate this moment have a pre-existing culture as well as legacy technology and processes that can be more or less amenable to DevOps implementation. That organizational culture is influenced by the personalities and management styles of Executive Management, the wider culture in which the organization is situated, and the personalities of key team members at all levels of the organization. This culture and entrenched interests usually throw a wrench in the work...
Apr. 30, 2017 12:30 AM EDT Reads: 1,030
With billions of sensors deployed worldwide, the amount of machine-generated data will soon exceed what our networks can handle. But consumers and businesses will expect seamless experiences and real-time responsiveness. What does this mean for IoT devices and the infrastructure that supports them? More of the data will need to be handled at - or closer to - the devices themselves.
Apr. 30, 2017 12:15 AM EDT Reads: 1,204
Building a cross-cloud operational model can be a daunting task. Per-cloud silos are not the answer, but neither is a fully generic abstraction plane that strips out capabilities unique to a particular provider. In his session at 20th Cloud Expo, Chris Wolf, VP & Chief Technology Officer, Global Field & Industry at VMware, will discuss how successful organizations approach cloud operations and management, with insights into where operations should be centralized and when it’s best to decentraliz...
Apr. 30, 2017 12:00 AM EDT Reads: 1,102
Translating agile methodology into real-world best practices within the modern software factory has driven widespread DevOps adoption, yet much work remains to expand workflows and tooling across the enterprise. As models evolve from pockets of experimentation into wholescale organizational reinvention, practitioners find themselves challenged to incorporate the culture and architecture necessary to support DevOps at scale. In his session at @DevOpsSummit at 20th Cloud Expo, Anand Akela, Senior...
Apr. 29, 2017 11:15 PM EDT Reads: 2,028
Web Real-Time Communication APIs have quickly revolutionized what browsers are capable of. In addition to video and audio streams, we can now bi-directionally send arbitrary data over WebRTC's PeerConnection Data Channels. With the advent of Progressive Web Apps and new hardware APIs such as WebBluetooh and WebUSB, we can finally enable users to stitch together the Internet of Things directly from their browsers while communicating privately and securely in a decentralized way.
Apr. 29, 2017 11:15 PM EDT Reads: 9,245
In his keynote at @ThingsExpo, Chris Matthieu, Director of IoT Engineering at Citrix and co-founder and CTO of Octoblu, focused on building an IoT platform and company. He provided a behind-the-scenes look at Octoblu’s platform, business, and pivots along the way (including the Citrix acquisition of Octoblu).
Apr. 29, 2017 10:45 PM EDT Reads: 1,824