|By PR Newswire||
|April 1, 2014 09:30 AM EDT||
WATERLOO, ON, April 1, 2014 /CNW/ - Terepac Corporation, a pioneer in the world's tiniest digital electronics, is honoured that a key member of its executive team has been invited to speak at two high-profile conferences in China to focus on the Internet of Things.
The organizing committee of the Wearable and Flexible Technologies World 2014 Conference has invited Terepac Chief Technology Officer, Dr. Jayna Sheats, to be keynote speaker at their conference May 14 to May 16 at the Crowne Plaza in Shanghai, China.
Dr. Sheats is also scheduled to speak in August at the first Global Sensor Summit in Wuxi, China, organized by the China R&D Center for the Internet of Things, the Chinese Academy of Sciences R&D Center for the Internet of Things, and the Jiangsu R&D Center for the Internet of Things.
"We're pleased to play a key role in advancing the Internet of Things around the world as this technology gains profile," said Terepac CEO Ric Asselstine. "Many corporations and organizations globally share our goal to create extraordinary technology and tools to give people everywhere more useful information about the world around them."
Cisco predicts the Internet of "Everything" will have an impact on society 10 times greater than the Internet itself. The global wearable device market will see big gains in the coming years due to the growing popularity of the technology. The wearable device market alone has been forecast to reach US$20.6 billion in 2018 with worldwide shipments totaling 191 million units. In China, wearable devices are expected to reach US$1.9 billion in market scale in 2015.
Next month's second annual Global AR Summit in Shanghai will focus on wearable technologies, including flexible electronics and augmented reality technologies.
"Giving a secure and private electronic voice to an almost limitless number and type of objects can result in unprecedented gains in efficiencies and insight," said Asselstine. "From health conditions to energy efficiency to more optimized industrial processes, we are learning the potential advances made possible by applying this technology."
About Terepac Corporation
Terepac Corporation, a pioneer in the burgeoning Internet of Things, has developed a breakthrough semiconductor packaging and assembly methodology which accommodates the tiniest imaginable components - at its limit to the nanometer scale. As a result, sophisticated microelectronics can be printed on flexible substrates at a fraction of the size and cost of conventional methods. These sensors can form the peripheral end of a network which provides collection, management and visualization of massive volumes of data under conditions of stringent security and privacy.
Terepac makes it possible to reduce the size and weight of electronic functionality in existing devices, and to introduce it into entirely new places, creating a secure window into the condition and behavior of objects of virtually all kinds. The result is a new category of electronics that "gives voice to the world".
Terepac Corporation is privately held with headquarters in Waterloo, Ontario, Canada. For more information, please visit www.terepac.com.
SOURCE Terepac Corporation
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