Welcome!

News Feed Item

Freescale Integrates Support for Stringent System-Level Functional Safety with New Analog System Basis Chips

Freescale Semiconductor (NYSE: FSL) is helping automotive and industrial system designers reduce the cost and complexity of designing applications required to meet functional safety standards. Today, the company announced new system basis chips (SBCs) that provide support for stringent system-level functional safety integrated with a high efficiency DC/DC switching regulator for reducing overall energy consumption.

Developed in accordance with key functional safety requirements, Freescale’s new MC33907 and MC33908 SBCs work seamlessly with 32-bit microcontrollers (MCUs) like Freescale’s Qorivva series devices to provide a scalable power supply solution that combines power management and communications with integrated functional safety for a broad range of power segmentation architectures. For systems designers, the result is an easy-to-use software/hardware solution that supports the specific functional safety requirements of multiple applications while simplifying designs, minimizing use of external components and reducing bill-of-materials costs.

Featuring the efficiency of a dual DC/DC switching regulator architecture and unique, low-voltage operation down to 2.7 V supply, the MC33907 and MC33908 products supply power to microcontrollers and other system loads while maintaining system operation during power brown-out events such as during an automotive cranking pulse. Ultra-low power modes and innovative wake up capabilities reduce system quiescent current down to 30 µA, limiting system standby energy consumption and battery discharge. The devices’ configurable voltage regulator capabilities enable design of scalable platform solutions optimized for 32-bit MCUs supporting functional safety certifications across multiple vehicles or industrial applications.

“Achieving functional safety compliance can be difficult and costly,” said James Bates, general manager and senior vice president of Freescale’s Analog and Sensors Group. “Freescale makes it quicker and easier to achieve compliance with these new system basis chips, which are designed to meet ISO 26262 ASIL D -- the most stringent functional safety requirement, as well as the latest automotive OEM requirements for ESD and electromagnetic compatibility.”

The functional safety of the MC33907 and MC33908 products has been validated by a prestigious third-party certification organization, which found their safety architecture and approach to surpass ISO 26262 ASIL-D for safety applications. Both system basis chips are part of the Freescale SafeAssure program, which offers a broad solution set of MCUs, sensors and analog ICs, as well as support for functional safety application design that includes training, safety documentation, and software and technical support.

While total system current output capacity is 2 A for both devices, the MC33908 supplies a core current up to 1.5 A while the MC33907 is capable of 0.7 A. Along with the integrated and independent safety measures to reduce common cause failures, the devices also feature a robust CAN physical layer compliant with ISO 11898-2-5 and a serial peripheral interface to allow control and diagnostics for the target MCU.

Tweet This: New, analog system basis chips support stringent, system-level functional safety requirements @Freescale

Additional features include:

  • Innovative architecture allowing independent monitoring of safety critical parameters (supply voltage, timing, MCU and analog IC monitoring)
  • Architecture and concept assessment fit for ASIL D applications
  • Independent fail-safe state machine supporting the most stringent functional safety standards
  • Flexible DC/DC buck pre-regulator with optional boost to fit with LV124
  • Multiple regulated supplies up to 2 A
  • Low-power modes with 30 µA quiescent current
  • Analog multiplexer and battery sensing before reverse battery diode to quicken system reaction during low voltage operations
  • Advanced watchdog combined with secured SPI interface
  • High ESD robustness for system interface pins up to +/-8kV gun stress according to IEC61000-4-2 and ISO10605.2008 standards
  • Robust CAN communications physical interface with EMI/ESD performance up to +/-12kV gun stress according to IEC61000-4-2 and ISO10605.2008 standards

Development support

Freescale provides a robust lineup of hardware and software to support the MC33907 and MC33908 products, including:

  • The KIT33907AEEVB evaluation board at $150.00 (USD)
  • The KIT33908AEEVB evaluation board at $150.00 (USD)
  • The KIT33908MBEVBE mother board at $350.00 (USD)
  • The KITMPC5643DBEVM daughter board at $150.00 (USD)
  • The KIT908-5643EVM evaluation system at $550.00 (USD)

Availability and pricing

The MC33907 and MC33908 SBCs are available now for a suggested resale price starting at $2.49 and $2.55 (USD) respectively in 10,000-piece quantities. Please contact Freescale Sales for additional quantities.

Robust and reliable analog performance

The majority of Freescale analog products meet critical industrial market requirements, including operation across extended temperature ranges. These products are designed and manufactured with rigorous process controls, and qualified using industry standard methodologies designed to yield defect rates in line with the stringent requirements of the automotive market. The MC33907/8 devices, in addition to most of Freescale’s analog products for industrial, are included in Freescale’s product longevity program, which provides assurance of supply for a minimum of 10 or 15 years, depending on the product, from the time of launch. For terms and conditions, and to see a list of participating Freescale products, visit www.freescale.com/productlongevity.

Freescale SafeAssure program: Functional Safety. Simplified.

The Freescale SafeAssure functional safety program is designed to help system manufacturers more easily achieve system compliance with functional safety standards for automotive and industrial markets including: International Standards Organization (ISO) 26262 and International Electrotechnical Commission (IEC) 61508. The program highlights Freescale solutions – hardware and software – that are optimally designed to support functional safety implementations and come with a rich set of enablement collateral. For more information, visit www.freescale.com/SafeAssure.

About Freescale

Freescale Semiconductor (NYSE: FSL) is a global leader in embedded processing solutions, providing industry leading products that are advancing the automotive, consumer, industrial and networking markets. From microprocessors and microcontrollers to sensors, analog integrated circuits and connectivity – our technologies are the foundation for the innovations that make our world greener, safer, healthier and more connected. Some of our key applications and end-markets include automotive safety, hybrid and all-electric vehicles, next generation wireless infrastructure, smart energy management, portable medical devices, consumer appliances and smart mobile devices. The company is based in Austin, Texas, and has design, research and development, manufacturing and sales operations around the world. www.freescale.com

Freescale, the Freescale logo, Qorivva, SafeAssure and the SafeAssure logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2014 Freescale Semiconductor, Inc.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today TechTarget has been named “Media Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. TechTarget is the Web’s leading destination for serious technology buyers researching and making enterprise technology decisions. Its extensive global networ...
SoftLayer operates a global cloud infrastructure platform built for Internet scale. With a global footprint of data centers and network points of presence, SoftLayer provides infrastructure as a service to leading-edge customers ranging from Web startups to global enterprises. SoftLayer's modular architecture, full-featured API, and sophisticated automation provide unparalleled performance and control. Its flexible unified platform seamlessly spans physical and virtual devices linked via a world...
SYS-CON Events announced today that Commvault, a global leader in enterprise data protection and information management, has been named “Bronze Sponsor” of SYS-CON's 18th International Cloud Expo, which will take place on June 7–9, 2016, at the Javits Center in New York City, NY, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Commvault is a leading provider of data protection and information management...
SYS-CON Events announced today that BMC Software has been named "Siver Sponsor" of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2015 at the Javits Center in New York, New York. BMC is a global leader in innovative software solutions that help businesses transform into digital enterprises for the ultimate competitive advantage. BMC Digital Enterprise Management is a set of innovative IT solutions designed to make digital business fast, seamless, and optimized from mainframe to mo...
SYS-CON Events announced today that Tintri Inc., a leading producer of VM-aware storage (VAS) for virtualization and cloud environments, will exhibit at the 18th International CloudExpo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York, and the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
SYS-CON Events announced today BZ Media LLC has been named “Media Sponsor” of SYS-CON's 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. BZ Media LLC is a high-tech media company that produces technical conferences and expositions, and publishes a magazine, newsletters and websites in the software development, SharePoint, mobile development and Commercial Drone markets.
Enterprise networks are complex. Moreover, they were designed and deployed to meet a specific set of business requirements at a specific point in time. But, the adoption of cloud services, new business applications and intensifying security policies, among other factors, require IT organizations to continuously deploy configuration changes. Therefore, enterprises are looking for better ways to automate the management of their networks while still leveraging existing capabilities, optimizing perf...
SYS-CON Events announced today that MangoApps will exhibit at SYS-CON's 18th International Cloud Expo®, which will take place on June 7-9, 2016, at the Javits Center in New York City, NY. MangoApps provides modern company intranets and team collaboration software, allowing workers to stay connected and productive from anywhere in the world and from any device. For more information, please visit https://www.mangoapps.com/.
A strange thing is happening along the way to the Internet of Things, namely far too many devices to work with and manage. It has become clear that we'll need much higher efficiency user experiences that can allow us to more easily and scalably work with the thousands of devices that will soon be in each of our lives. Enter the conversational interface revolution, combining bots we can literally talk with, gesture to, and even direct with our thoughts, with embedded artificial intelligence, wh...
The IoT is changing the way enterprises conduct business. In his session at @ThingsExpo, Eric Hoffman, Vice President at EastBanc Technologies, discuss how businesses can gain an edge over competitors by empowering consumers to take control through IoT. We'll cite examples such as a Washington, D.C.-based sports club that leveraged IoT and the cloud to develop a comprehensive booking system. He'll also highlight how IoT can revitalize and restore outdated business models, making them profitable...
SYS-CON Events announced today that ContentMX, the marketing technology and services company with a singular mission to increase engagement and drive more conversations for enterprise, channel and SMB technology marketers, has been named “Sponsor & Exhibitor Lounge Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York City, New York. “CloudExpo is a great opportunity to start a conversation with new prospects, but what happens after the...
Many banks and financial institutions are experimenting with containers in development environments, but when will they move into production? Containers are seen as the key to achieving the ultimate in information technology flexibility and agility. Containers work on both public and private clouds, and make it easy to build and deploy applications. The challenge for regulated industries is the cost and complexity of container security compliance. VM security compliance is already challenging, ...
The pace of innovation, vendor lock-in, production sustainability, cost-effectiveness, and managing risk… In his session at 18th Cloud Expo, Dan Choquette, Founder of RackN, will discuss how CIOs are challenged finding the balance of finding the right tools, technology and operational model that serves the business the best. He will discuss how clouds, open source software and infrastructure solutions have benefits but also drawbacks and how workload and operational portability between vendors...
The essence of data analysis involves setting up data pipelines that consist of several operations that are chained together – starting from data collection, data quality checks, data integration, data analysis and data visualization (including the setting up of interaction paths in that visualization). In our opinion, the challenges stem from the technology diversity at each stage of the data pipeline as well as the lack of process around the analysis.
As machines are increasingly connected to the internet, it’s becoming easier to discover the numerous ways Industrial IoT (IIoT) is helping to shape the business world. This is exactly why we have decided to take a closer look at this pervasive movement and to examine the desire to connect more things! Now if you need a refresher on IIoT and how it is changing the world, take a moment and listen to Greg Gorbach with ARC Advisory Group. Gorbach believes, "IIoT will significantly change the worl...