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ASE Expands System-in-Package Business Model Through Industry Partnership with Inotera
|By Business Wire
|April 7, 2014 03:01 AM EDT
Advanced Semiconductor Engineering, Inc. (TAIEX: 2311, NYSE: ASX), the
world's largest semiconductor assembly and test service provider, today
announced a joint development with Inotera Memories, Inc. (TAIEX: 3474),
a leading DRAM wafer foundry, in a move to further strengthen ASE’s
System-in-Package (SiP) capabilities. Complementing ASE’s established
portfolio, Inotera will provide manufacturing services for silicon
interposer, an interconnect device on silicon wafer for 2.5D IC
solutions. This collaborative business model, combining Inotera’s strong
front-end wafer processing capability with ASE’s advanced IC packaging
and testing technology, will serve to deliver solutions featuring high
quality, stable yield and an efficient cost structure, to a broader
customer base and market.
Semiconductor is playing a significant role in enabling the stark
sophistication evolving within today’s vast technology landscape.
However, semiconductor evolution is being faced with serious challenges,
including the industry need for higher performance and bandwidth, lower
power, and increased efficiency. Continuously rising costs are also
affecting technology adoption and market growth. According to Gartner,
the PC and Server space is experiencing slow down, hence applications
driving market growth through 2017 are to be found in the ultra-mobile
PC, tablet, smartphone and emerging Internet of Things (IOT) sectors.
Chip makers supplying to these segments are progressively required to
integrate increased functionality within smaller form factors, therefore
enabling products to be faster and smarter. IC manufacturing is playing
a larger role within the supply chain and is seeking optimum improvement
in regard to process and production.
ASE is continuously exploring and developing new technologies in package
design and manufacturing, particularly advanced IC technologies such as
2.5D ICs and 3D ICs, to address market needs within the fast moving
mobility space. Essentially, SiP is a module containing an electronic
system or sub-systems that utilize such 2.5/3D IC packaging technologies
to miniaturize the package. Together with ASE’s electronic manufacturing
services (EMS) subsidiary, Universal Scientific Industrial (USI), ASE is
offering customers a complete SiP solution, encompassing design to
manufacturing to logistical integration. SiP technology is integral to
many end market applications including products incorporating biometric
touch, sensors, wireless, power management, camera modules, RF front end
and lighting, all of which are prevalent within today’s vast technology
“Inotera hopes to contribute our high-quality and cost-effective
manufacturing capability to ASE’s SiP solution through the
collaboration,” said Dr. Scott Meikle, President of Inotera. “By
combining strengths complementary and maintaining a full commitment to
our DRAM capacity, Inotera and ASE can provide an enabling capability to
the semiconductor supply chain,” emphasized Dr. Meikle.
“ASE recognizes that collaboration within the supply chain is critical
to the success of our vision for system integration, and it is through
the establishment of strong partnerships that we can work together to
bring optimum value and just-in-time solutions to our customers,” said
Dr Tien Wu, Chief Operating Officer, ASE Group.
He continued, “Inotera is a proven leader in DRAM wafer fab technology
and has expanded its capabilities to offer silicon interposer foundry
services to benefit ASE’s complete SiP solution. ASE’s dedicated R&D
team is developing proprietary IC packaging IPs, working with various
material and equipment suppliers, as well as customers to further expand
and strengthen our SiP portfolio.”
About Inotera Memories
Inotera Memories, Inc. was incorporated on January 23rd, 2003. Inotera's
production facilities are designed to manufacture high-density and
high-performance DRAM（Dynamic Random Access Memory）products using
state-of-the-art technology. The combination of world-leading technology
transferred from its technology partners and local cost-efficiency in
mass production has resulted in an innovative company that is highly
productive, highly competitive and at the leading edge in the DRAM
industry. For more information, please visit Inotera's IR Website：http://ir.inotera.com
About The ASE Group
The ASE Group is the world's largest provider of independent
semiconductor manufacturing services in assembly, test, materials and
design manufacturing. As a global leader geared towards meeting the
industry’s ever growing needs for faster, smaller and higher performance
chips, the Group develops and offers a wide portfolio of technology and
solutions including IC test program design, front-end engineering test,
wafer probe, wafer bump, substrate design and supply, wafer level
package, flip chip, system-in-package, final test and electronic
manufacturing services through Universal Scientific Industrial Co Ltd, a
member of the ASE Group. The Group generated sales revenues of US$7.4
billion in 2013 and employs over 60,000 people worldwide. For more
information about the ASE Group, visit www.aseglobal.com.
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