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Research and Markets: Global Wafer Level Packaging Inspection Systems Market 2014-2018 with Camtek, KLA-Tencor, Rudolph Technologies & Topcon Technohouse Dominating

Research and Markets (http://www.researchandmarkets.com/research/hl94qb/global_wafer) has announced the addition of the "Global Wafer Level Packaging Inspection Systems Market 2014-2018 with Camtek, KLA-Tencor, Rudolph Technologies & Topcon Technohouse Dominating" report to their offering.

The growth of the Global Wafer-level Packaging Inspection Systems market is driven by several factors, the most important of which is the rising demand for smartphones and tablets. One of the major reasons for the growing demand for these devices is their increasing adoption in emerging markets. This subsequently creates more demand for semiconductor wafers, thus driving the growth of the Global Wafer-level Packaging Inspection Systems market.

Commenting on the report, an analyst from the team said: The short replacement cycle of portable electronic devices is a major trend witnessed in the Global Wafer-level Packaging Inspection Systems market. In the current scenario, portable electronic devices such as smartphones and tablets are becoming obsolete within a short period of time. The main reason for this is the quick succession of next-version models, which results in consumers replacing older versions of their devices with newer ones. At the present time, the duration of the replacement cycle period is 8-12 months, but it used to be much longer. Therefore, this reduction in the product replacement cycle is fostering the demand for semiconductor wafers for their use in newly launched devices.

Further, the report states that one of the key challenges in the market is the cyclical nature of the Semiconductor industry. As a result of this, many wafer-level packaging inspection system manufacturers often experience fluctuating revenues, which in turn adversely affects their profitability.

Key vendors dominating this space are:

  • Camtek Ltd.
  • KLA-Tencor Corp
  • Rudolph Technologies Inc
  • Topcon Technohouse Corp.

Key Topics Covered:

  1. Executive Summary
  2. List of Abbreviations
  3. Scope of the Report
  4. Market Research Methodology
  5. Introduction
  6. Market Landscape
  7. Geographical Segmentation
  8. Key Leading Countries
  9. Buying Criteria
  10. Market Growth Drivers
  11. Drivers and their Impact
  12. Market Challenges
  13. Impact of Drivers and Challenges
  14. Market Trends
  15. Trends and their Impact
  16. Vendor Landscape
  17. Key Vendor Analysis

For more information visit http://www.researchandmarkets.com/research/hl94qb/global_wafer

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