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Research and Markets: Global Thermal Management Systems Market for Electronic Equipment 2014-2018: Implementation of Thermal Management Hardware in Products Saves Time and Expense for Vendors

Research and Markets (http://www.researchandmarkets.com/research/brxtqc/global_thermal) has announced the addition of the "Global Thermal Management Systems Market for Electronic Equipment 2014-2018" report to their offering.

Thermal management is the management of excess heat generated by the electronic devices by using various heat control techniques and solutions, thereby preventing the electronic device from system breakdown. The thermal management system comprises of hardware, software, interface materials, and substrate. Technologies such as air cooling, liquid cooling, thermoelectric cooling, and multiphase cooling are implemented widely across several industries for thermal management.

The analysts forecast the Global Thermal Management Systems Market for Electronic Equipment to grow at a CAGR of 7.66 percent over the period 2013-2018.

This report covers the present scenario and the growth prospects of the Global Thermal Management System market for Electronics Equipment for the period 2013-2018. To calculate the market size, it considers the revenue generated from the sales of:

  • Hardware
  • Software
  • Interface Materials
  • Substrate

Key Topics Covered:

01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

04. Market Research Methodology

05. Introduction

06. Market Landscape

07. Market Segmentation by Technology

08. Market Segmentation by Product

09. Market Segmentation by End-users

10. Geographical Segmentation

11. Buying Criteria

12. Market Growth Drivers

13. Drivers and their Impact

14. Market Challenges

15. Impact of Drivers and Challenges

16. Market Trends

17. Trends and their Impact

18. Vendor Landscape

19. Key Vendor Analysis

20. Other Reports in this Series

Companies Mentioned:

  • AI Technology
  • ANSYS
  • Aavid Thermalloy
  • Alcoa Inc.
  • AltairEngineering
  • Amkor Technology
  • Bergquist Company
  • CPS Technologies Corp.
  • Chomerics (Division of Parker Hannifin)
  • Cool Innovations
  • Dassault Systèmes
  • Degree Controls
  • Emersion Electric Co.
  • Henkel AG & Company
  • II-VI Incorporated
  • ITW Vortec
  • JARO Components Inc.
  • KGaA
  • KOOLTRONIC
  • Kyocera Corporation
  • Laird plc
  • Lord Corp.
  • Lytron Inc.
  • Lytron Inc.
  • MSC SoftwareCorporation
  • Materion Corp.
  • Mentor Graphics Corporation
  • Micronel Global EngineersPvt Ltd.
  • Morgan Advanced Materials plc
  • NMB Technologies Corporation
  • Netzsch Inc
  • Noren Products.
  • OCZ Storage Solutions
  • Pfannenberg GmbH
  • Qualtek Electronics Corp.
  • RPM International Inc.
  • Rittal GmbH & Co. KG
  • STATS ChipPAC
  • SolidWorks Corp.
  • Sunonwealth Electric Machine Industry Company Limited
  • Tellurex Corporation
  • Thermacore
  • Unitrack Industries
  • W.E.T. Automotive Systems AG
  • Wakefield-Vette
  • ebmpapstGroup

For more information visit http://www.researchandmarkets.com/research/brxtqc/global_thermal

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