Welcome!

News Feed Item

Pulse Electronics’ Optimized Planar Transformer ER25+ Platform Delivers up to 800W Power Capability in Small Footprint

Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, launches a new planar platform which increases throughput power for Pulse’s planar SMT transformers by 50% over transformers of comparable size to deliver up to 800 watts of power capability. These transformers are used for isolation and voltage conversion for switched mode power supplies in datacom and intermediate bus converter applications.

Pulse Electronic’s PH9278NL planar transformer is built on Pulse’s new ER25+ platform and can be customized depending on the application. The platform measures 33.5 x 26.8 x 18.3mm and delivers 50% greater power than transformers built on an ER28 platform, which measures 35.5 x 30.5 x 12.6mm. The increased power is achieved by increasing the effective cross-sectional area of the core by 40%. This results in lower core losses for a given number of winding turns. Additionally, copper losses can be reduced by removing some winding turns. The cost-effective flat coil windings have 50% lower direct current resistance compared to multilayer PCB technology. The core design allows for a compact inter-connection and termination of the winding elements.

“Traditional planar core transformers have a non-uniform flux distribution, resulting in areas of high flux density that require additional winding turns to avoid excessive heating,” explained Gerard Healy, field application engineer, Pulse Electronics Power Division. “Pulse has used modern finite element analysis techniques to analyze and optimize the core design to balance the flux distribution and increase the effective cross-sectional area without increasing the core size. This new platform enables us to increase the power capability of Pulse’s planar transformer portfolio and offers a significant advantage compared to using existing traditional cores.”

Pulse’s planar transformers are RoHS compliant and meet standard EIA481 requirements. They’re available in tape-and-reel packaging. Lead time is eight weeks. The price ranges from $3.75 to $4.95 for quantities up to 50,000 pieces. Pricing varies according to order configuration and destination. Further details are available on the data sheet at http://productfinder.pulseeng.com/products/datasheets/P729.pdf, or contact Pulse at [email protected] or www.pulseelectronics.com.

For more information on planar transformers, Gerard Healy will be presenting a paper on this topic at the PCIM Europe Conference in Nuremberg, Germany. Design of a High Efficiency Planar Transformer with Deep Interleave Flat Coil Windings for >250W Converter Topologies will be presented at the Converters poster session on Wednesday, May 21, 2014 at 3:30 PM.

White paper Flat Coil Planar Transformers: http://www.pulseelectronics.com/download/3901/g049/pdf.

ER25+ photo: http://www.pulseelectronics.com/image.php?blob_id=4219

About Pulse Electronics

Pulse Electronics is the electronic components partner that helps customers build the next great product by providing the needed technical solutions. Pulse Electronics has a long operating history of innovation in magnetics, antennas, and connectors, as well as the ability to ramp quickly into high-quality, high-volume production. The Company serves the wireless and wireline communications, power management, military/aerospace, and automotive industries. Pulse Electronics is a participating member of the IEEE, SFF, OIF, HDBaseT Alliance, CommNexus, NFC Forum, MoCA, and IWPC. Visit the Pulse Electronics website at www.pulseelectronics.com.

Cautionary Note: To the extent that statements in this press release are not strictly historical, such statements are "forward-looking" and made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on the Company's current information and expectations. These forward-looking statements are subject to certain risks and uncertainties that could cause actual results to differ materially from the statements made. Examples of such risks include those related to the risk factors disclosed from time to time in the Company's SEC filings, including, but not limited to, those discussed in the Company's most recent reports on Form 10-K, 10-Q and 8-K, and any amendments thereto. All such risk factors are incorporated herein by reference as though set forth in full. The Company undertakes no obligation to update any forward looking statement.

Copyright ©2014 Pulse Electronics Corporation. All rights reserved. All brand names and trademarks are properties of their respective holders.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
Digital Transformation: Preparing Cloud & IoT Security for the Age of Artificial Intelligence. As automation and artificial intelligence (AI) power solution development and delivery, many businesses need to build backend cloud capabilities. Well-poised organizations, marketing smart devices with AI and BlockChain capabilities prepare to refine compliance and regulatory capabilities in 2018. Volumes of health, financial, technical and privacy data, along with tightening compliance requirements by...
Transformation Abstract Encryption and privacy in the cloud is a daunting yet essential task for both security practitioners and application developers, especially as applications continue moving to the cloud at an exponential rate. What are some best practices and processes for enterprises to follow that balance both security and ease of use requirements? What technologies are available to empower enterprises with code, data and key protection from cloud providers, system administrators, inside...
The deluge of IoT sensor data collected from connected devices and the powerful AI required to make that data actionable are giving rise to a hybrid ecosystem in which cloud, on-prem and edge processes become interweaved. Attendees will learn how emerging composable infrastructure solutions deliver the adaptive architecture needed to manage this new data reality. Machine learning algorithms can better anticipate data storms and automate resources to support surges, including fully scalable GPU-c...
To Really Work for Enterprises, MultiCloud Adoption Requires Far Better and Inclusive Cloud Monitoring and Cost Management … But How? Overwhelmingly, even as enterprises have adopted cloud computing and are expanding to multi-cloud computing, IT leaders remain concerned about how to monitor, manage and control costs across hybrid and multi-cloud deployments. It’s clear that traditional IT monitoring and management approaches, designed after all for on-premises data centers, are falling short in ...
Consumer-driven contracts are an essential part of a mature microservice testing portfolio enabling independent service deployments. In this presentation we'll provide an overview of the tools, patterns and pain points we've seen when implementing contract testing in large development organizations.
With more than 30 Kubernetes solutions in the marketplace, it's tempting to think Kubernetes and the vendor ecosystem has solved the problem of operationalizing containers at scale or of automatically managing the elasticity of the underlying infrastructure that these solutions need to be truly scalable. Far from it. There are at least six major pain points that companies experience when they try to deploy and run Kubernetes in their complex environments. In this presentation, the speaker will d...
DXWordEXPO New York 2018, colocated with CloudEXPO New York 2018 will be held November 11-13, 2018, in New York City and will bring together Cloud Computing, FinTech and Blockchain, Digital Transformation, Big Data, Internet of Things, DevOps, AI, Machine Learning and WebRTC to one location.
Containers and Kubernetes allow for code portability across on-premise VMs, bare metal, or multiple cloud provider environments. Yet, despite this portability promise, developers may include configuration and application definitions that constrain or even eliminate application portability. In this session we'll describe best practices for "configuration as code" in a Kubernetes environment. We will demonstrate how a properly constructed containerized app can be deployed to both Amazon and Azure ...
We are seeing a major migration of enterprises applications to the cloud. As cloud and business use of real time applications accelerate, legacy networks are no longer able to architecturally support cloud adoption and deliver the performance and security required by highly distributed enterprises. These outdated solutions have become more costly and complicated to implement, install, manage, and maintain.SD-WAN offers unlimited capabilities for accessing the benefits of the cloud and Internet. ...
Business professionals no longer wonder if they'll migrate to the cloud; it's now a matter of when. The cloud environment has proved to be a major force in transitioning to an agile business model that enables quick decisions and fast implementation that solidify customer relationships. And when the cloud is combined with the power of cognitive computing, it drives innovation and transformation that achieves astounding competitive advantage.
DXWorldEXPO LLC announced today that "IoT Now" was named media sponsor of CloudEXPO | DXWorldEXPO 2018 New York, which will take place on November 11-13, 2018 in New York City, NY. IoT Now explores the evolving opportunities and challenges facing CSPs, and it passes on some lessons learned from those who have taken the first steps in next-gen IoT services.
SYS-CON Events announced today that Silicon India has been named “Media Sponsor” of SYS-CON's 21st International Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Published in Silicon Valley, Silicon India magazine is the premiere platform for CIOs to discuss their innovative enterprise solutions and allows IT vendors to learn about new solutions that can help grow their business.
In his general session at 19th Cloud Expo, Manish Dixit, VP of Product and Engineering at Dice, discussed how Dice leverages data insights and tools to help both tech professionals and recruiters better understand how skills relate to each other and which skills are in high demand using interactive visualizations and salary indicator tools to maximize earning potential. Manish Dixit is VP of Product and Engineering at Dice. As the leader of the Product, Engineering and Data Sciences team at D...
In this presentation, you will learn first hand what works and what doesn't while architecting and deploying OpenStack. Some of the topics will include:- best practices for creating repeatable deployments of OpenStack- multi-site considerations- how to customize OpenStack to integrate with your existing systems and security best practices.
SYS-CON Events announced today that CrowdReviews.com has been named “Media Sponsor” of SYS-CON's 22nd International Cloud Expo, which will take place on June 5–7, 2018, at the Javits Center in New York City, NY. CrowdReviews.com is a transparent online platform for determining which products and services are the best based on the opinion of the crowd. The crowd consists of Internet users that have experienced products and services first-hand and have an interest in letting other potential buye...