|By Business Wire||
|May 19, 2014 08:08 AM EDT||
Ventev Wireless Infrastructure, a division of TESSCO Technologies Incorporated (NASDAQ:TESS), will showcase solutions from its comprehensive product portfolio, including the new TerraWave Wireless LAN Site Survey Kit, at Cisco Live 2014, May 18-22, in San Francisco. Hosted by Cisco Systems, the conference is the industry’s premier education and training event focused on the innovations of tomorrow – with topics that span technical education, IT management, and service provider programs.
For more than 12 years TerraWave, one of Ventev Wireless Infrastructure’s three product lines and a Cisco Solution Developer, has been designing market-leading antenna, cabling, and enclosure solutions that simplify the process of deploying, maintaining and securing Cisco Wi-Fi networks in any environment.
Products on display at the show will include:
- New! TerraWave Cisco Indoor AP Wireless LAN Site Survey Kit (TESSCO No. 502643) –enables precise site surveys that eliminate deployment issues and allow for seamless network implementation of Cisco indoor access points. Easy to transport, organize, and inventory, the kit equips system engineers with all of the critical products needed to perform professional site surveys in most environments and industries.
- New! TerraWave High-Density Patch Antenna for Cisco and Meraki Access Points (TESSCO No. 515086) – features a narrow beamwidth and advanced technology that reduces the number of users per access point, increasing the capacity for improved coverage in high-density networks.
- Ventev PoE Outdoor Enclosure System for the Cisco 3602e Access Point (TESSCO No. 566513) – allows indoor access points to be deployed in outdoor environments. For refrigerator-type applications, Ventev also offers a Freezer Enclosure System (TESSCO No. 501516).
- TerraWave Co-Locating Mount (TESSCO No. 568600) – simplifies overall deployments of high-density networks by co-locating the antenna with the access point, and features an aesthetically pleasing design that conceals the access point and cabling.
Visit www.terra-wave.com/cisco-live-2014 for more information on the Cisco-compatible solutions that Ventev Wireless Infrastructure will have on display at the Moscone Center, May 18-22, in San Francisco.
About Ventev Wireless Infrastructure
Ventev Wireless Infrastructure, a division of TESSCO Technologies Inc., designs and manufactures solutions that deploy, protect, power, and improve the performance of every type of wireless network: Wi-Fi, DAS (distributed antenna systems), cellular, mesh and two-way. Ventev’s extensive line of products such as antennas, enclosures, cable, and solar-powered base stations support these networks and their applications both indoors and outdoors. Ventev Wireless Infrastructure's (www.ventev.com) three product lines are: TerraWave Solutions® (Wi-Fi enclosures, antennas and cable assemblies); Ventev® (integrated power and outdoor enclosure solutions); and Wireless Solutions® (base station infrastructure including towers, site hardware and grounding).
TESSCO Technologies Inc. (NASDAQ:TESS), Hunt Valley, Maryland, is Your Total Source® for making wireless work. The convergence of wireless and the Internet is revolutionizing the way we live, work and play. New systems and applications are creating opportunities and challenges at an unprecedented rate. TESSCO is there, thinking in new ways for exceptional outcomes. TESSCO (www.tessco.com) architects and delivers, with innovation, productivity and speed, the product and value chain solutions to organizations responsible for building, using and maintaining wireless broadband systems. The Company is a component of the Russell 2000® index.
Oct. 1, 2016 06:30 AM EDT Reads: 1,912
Oct. 1, 2016 06:15 AM EDT Reads: 792
Oct. 1, 2016 06:00 AM EDT Reads: 1,934
Oct. 1, 2016 06:00 AM EDT Reads: 2,791
Oct. 1, 2016 05:45 AM EDT Reads: 1,334
Oct. 1, 2016 05:30 AM EDT Reads: 630
Oct. 1, 2016 05:15 AM EDT Reads: 1,434
Oct. 1, 2016 05:00 AM EDT Reads: 4,752
Oct. 1, 2016 04:45 AM EDT Reads: 570
Oct. 1, 2016 04:30 AM EDT Reads: 1,812
Oct. 1, 2016 04:00 AM EDT Reads: 1,657
Oct. 1, 2016 04:00 AM EDT Reads: 5,479
Oct. 1, 2016 04:00 AM EDT Reads: 3,127
Oct. 1, 2016 03:30 AM EDT Reads: 1,232
There is growing need for data-driven applications and the need for digital platforms to build these apps. In his session at 19th Cloud Expo, Muddu Sudhakar, VP and GM of Security & IoT at Splunk, will cover different PaaS solutions and Big Data platforms that are available to build applications. In addition, AI and machine learning are creating new requirements that developers need in the building of next-gen apps. The next-generation digital platforms have some of the past platform needs a...
Oct. 1, 2016 03:00 AM EDT Reads: 1,977