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Research and Markets: Apple iPhone 5S Camera Module 8Mpixel 1.5m Stacked BSI CIS from Sony - Technology Analysis

Research and Markets (http://www.researchandmarkets.com/research/h6gc5h/apple_iphone_5s) has announced the addition of the "Apple iPhone 5S Camera Module 8Mpixel 1.5µm Stacked BSI CIS from Sony - Technology Analysis" report to their offering.

For the iPhone 5S iSight camera module, Apple continues to integrate a 8Mpixel resolution CMOS Image Sensor. They achieve to obtain 33% increase in light sensitivity by improving the camera aperture from f/2.4 to f/2.2 and by rising the pixel size from 1.4µm to 1.5µm.

The unique technology from Sony (Exmor-RS) allows to raise the pixel array size by 15% and thus to considerably improve the light sensitivity by keeping a similar cost compared to the previous CIS. The technology consists in a stacking of two separate chips using optimized processes: a pixel array circuit which uses a Back-Side Illuminated (BSI) technology, and a logic ISP circuit processed with a 65nm technology node. The two circuits are stacked with a wafer bonding process and connected together with copper TSVs.

The camera module, with dimensions of 8.5 x 7.8 x 5.7mm, is equipped with a 5-elements lens module and a VCM auto-focus actuator. The CIS is assembled in flip-chip on a ceramic substrate with a gold stud bumping process.

Key Topics Covered:

CAMERA MODULE SUPPLY CHAIN & COMPANIES PROFILE

Physical Analysis

Camera Module

- Camera Module View & Dimensions

- Camera Module X-Ray

- Camera Module Disassembly

CMOS Image Sensor

- View & Dimensions

- Pads, Tungsten Grid

- TSV Connections

- CIS Pixels

- Logic Circuit (Transistors, SRAM)

Cross-Section: Camera Module

- Overview

- Driver (Assembly & Process) & MLCC

- Ceramic Substrate, IR Filter & FPC

- Lenses, Housing, VCM

Cross-Section: CMOS Image Sensor

- Overview

- Pad Trenches

- Pixel Array Circuit

- Logic Circuit

- TSVs

Comparison with previous 8Mpixel CIS from OVT, Samsung and Sony

CIS MANUFACTURING PROCESS FLOW

Global Overview

Logic Circuit Front-End Process

Pixel Array Circuit Front-End Process

BSI + TSV + Microlenses Process

CIS Wafer Fabrication Unit

For more information visit http://www.researchandmarkets.com/research/h6gc5h/apple_iphone_5s

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