Welcome!

News Feed Item

Si2 Announces New Thermal Interface Protocol Standard for 3D Integrated Circuits

The Silicon Integration Initiative (Si2) announced the release of a Chip Thermal Interface Protocol (CTIP) Standard for 3D Integrated Circuits (3D-IC) under the auspices of the Open3D Technical Advisory Board (TAB). The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows.

The Chip Thermal Interface Protocol (CTIP) facilitates the exchange of thermal design information required to integrate silicon die into 3D-IC stacks, enabling the stack designer to simulate the thermal behavior of the entire stack, thus ensuring that it satisfies die and stack-level requirements. The standard does not assume that the individual die and the complete 3D-IC stack are designed by the same team or same design system, allowing maximum flexibility of die stack and package integration. The CTIP standard will facilitate integration into multi-vendor EDA tool flows used in the design of either the 2D die or the 3D-IC stacks.

Simulating thermal behavior is critical for 3D-IC designs, as areas of high thermal load must be equally distributed throughout the entire stack of die to ensure proper operation in all expected conditions. The CTIP standard provides designers with the ability to share thermal maps and other design information, helping prevent the buildup of thermal stress points. In the case of heterogeneous 2.5D and 3D design stacks, where chips may be sourced by multiple IP vendors and foundries, the need for communication of thermal information between vendors and customers is even more critical in order to have a viable system design.

Additional working groups for Open3D TAB members include developing standards to support:

  • Power Distribution Network to ensure that each stack in the die has access to the required power supply characteristics (released May 2013)
  • Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies (This release – the document can be found at this link: http://www.si2.org/?page=1810)
  • Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process
  • Stress management to ensure that no stack in the die is adversely affected by the stack level stress hot spots or thermal gradients
  • Physical verification to facilitate stack level physical DRC verification
  • Signal integrity to facilitate stack level electrical modeling

At the upcoming Design Automation Conference (DAC) in San Francisco, there will be a 3D Panel: “Design for 3D: Are Standards Leading the Way or Lagging Behind?” at 3PM, on Monday, June 2 in Room 300 at the Moscone Center. Representatives from Qualcomm, Altera, Invensas, eda2asic, and Helic will be speaking. The abstract is located at this link: http://www.si2.org/dac_2014/abstracts/3dpanel_abstract.php

For more information on the Open3D TAB, click here: http://www.si2.org/open3d_index.php

More information on Si2 sponsored activities, including a presentation by Dr. Chenming Hu of UC Berkeley and a press conference with STMicroelectronics and IBM are located at this link: http://www.si2.org/dac_2014/dac_2014_fp.php

Open3D TAB Members:

Altera (NASDAQ: ALTR), AMD (NYSE: AMD), ANSYS (NASDAQ:ANSS), Atrenta, Cadence Design Systems (NASDAQ: CDNS), Fraunhofer Institute, GLOBALFOUNDRIES, Helic S.A., IBM (NYSE: IBM), Intel (NASDAQ: INTC), Invarian, Mentor Graphics (NASDAQ: MENT), Qualcomm (NASDAQ: QCOM), R3Logic, SEMATECH, STMicroelectronics (NYSE: STM), and Texas Instruments (NYSE: TXN).

About Si2

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured. Now in its 26th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 100 companies involved in all parts of the silicon supply chain throughout the world, www.si2.org

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
@DevOpsSummit at Cloud taking place June 6-8, 2017, at Javits Center, New York City, is co-located with the 20th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to wait for long developm...
SYS-CON Events announced today that Juniper Networks (NYSE: JNPR), an industry leader in automated, scalable and secure networks, will exhibit at SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Juniper Networks challenges the status quo with products, solutions and services that transform the economics of networking. The company co-innovates with customers and partners to deliver automated, scalable and secure network...
Grape Up is a software company, specialized in cloud native application development and professional services related to Cloud Foundry PaaS. With five expert teams that operate in various sectors of the market across the USA and Europe, we work with a variety of customers from emerging startups to Fortune 1000 companies.
Financial Technology has become a topic of intense interest throughout the cloud developer and enterprise IT communities. Accordingly, attendees at the upcoming 20th Cloud Expo at the Javits Center in New York, June 6-8, 2017, will find fresh new content in a new track called FinTech.
In his keynote at 19th Cloud Expo, Sheng Liang, co-founder and CEO of Rancher Labs, discussed the technological advances and new business opportunities created by the rapid adoption of containers. With the success of Amazon Web Services (AWS) and various open source technologies used to build private clouds, cloud computing has become an essential component of IT strategy. However, users continue to face challenges in implementing clouds, as older technologies evolve and newer ones like Docker c...
SYS-CON Events announced today that Interoute, owner-operator of one of Europe's largest networks and a global cloud services platform, has been named “Bronze Sponsor” of SYS-CON's 20th Cloud Expo, which will take place on June 6-8, 2017 at the Javits Center in New York, New York. Interoute is the owner-operator of one of Europe's largest networks and a global cloud services platform which encompasses 12 data centers, 14 virtual data centers and 31 colocation centers, with connections to 195 add...
In his keynote at @ThingsExpo, Chris Matthieu, Director of IoT Engineering at Citrix and co-founder and CTO of Octoblu, focused on building an IoT platform and company. He provided a behind-the-scenes look at Octoblu’s platform, business, and pivots along the way (including the Citrix acquisition of Octoblu).
Cloud Expo, Inc. has announced today that Aruna Ravichandran, vice president of DevOps Product and Solutions Marketing at CA Technologies, has been named co-conference chair of DevOps at Cloud Expo 2017. The @DevOpsSummit at Cloud Expo New York will take place on June 6-8, 2017, at the Javits Center in New York City, New York, and @DevOpsSummit at Cloud Expo Silicon Valley will take place Oct. 31-Nov. 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA.
SYS-CON Events announced today that CollabNet, a global leader in enterprise software development, release automation and DevOps solutions, will be a Bronze Sponsor of SYS-CON's 20th International Cloud Expo®, taking place from June 6-8, 2017, at the Javits Center in New York City, NY. CollabNet offers a broad range of solutions with the mission of helping modern organizations deliver quality software at speed. The company’s latest innovation, the DevOps Lifecycle Manager (DLM), supports Value S...
Join IBM November 2 at 19th Cloud Expo at the Santa Clara Convention Center in Santa Clara, CA, and learn how to go beyond multi-speed it to bring agility to traditional enterprise applications. Technology innovation is the driving force behind modern business and enterprises must respond by increasing the speed and efficiency of software delivery. The challenge is that existing enterprise applications are expensive to develop and difficult to modernize. This often results in what Gartner calls ...
NHK, Japan Broadcasting, will feature the upcoming @ThingsExpo Silicon Valley in a special 'Internet of Things' and smart technology documentary that will be filmed on the expo floor between November 3 to 5, 2015, in Santa Clara. NHK is the sole public TV network in Japan equivalent to the BBC in the UK and the largest in Asia with many award-winning science and technology programs. Japanese TV is producing a documentary about IoT and Smart technology and will be covering @ThingsExpo Silicon Val...
Translating agile methodology into real-world best practices within the modern software factory has driven widespread DevOps adoption, yet much work remains to expand workflows and tooling across the enterprise. As models evolve from pockets of experimentation into wholescale organizational reinvention, practitioners find themselves challenged to incorporate the culture and architecture necessary to support DevOps at scale. In his session at @DevOpsSummit at 20th Cloud Expo, Anand Akela, Senior...
@GonzalezCarmen has been ranked the Number One Influencer and @ThingsExpo has been named the Number One Brand in the “M2M 2016: Top 100 Influencers and Brands” by Analytic. Onalytica analyzed tweets over the last 6 months mentioning the keywords M2M OR “Machine to Machine.” They then identified the top 100 most influential brands and individuals leading the discussion on Twitter.
The 20th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held June 6-8, 2017, at the Javits Center in New York City, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Containers, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportunity. Submit your speaking proposal ...
The age of Digital Disruption is evolving into the next era – Digital Cohesion, an age in which applications securely self-assemble and deliver predictive services that continuously adapt to user behavior. Information from devices, sensors and applications around us will drive services seamlessly across mobile and fixed devices/infrastructure. This evolution is happening now in software defined services and secure networking. Four key drivers – Performance, Economics, Interoperability and Trust ...