Welcome!

News Feed Item

Si2 Announces New Thermal Interface Protocol Standard for 3D Integrated Circuits

The Silicon Integration Initiative (Si2) announced the release of a Chip Thermal Interface Protocol (CTIP) Standard for 3D Integrated Circuits (3D-IC) under the auspices of the Open3D Technical Advisory Board (TAB). The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows.

The Chip Thermal Interface Protocol (CTIP) facilitates the exchange of thermal design information required to integrate silicon die into 3D-IC stacks, enabling the stack designer to simulate the thermal behavior of the entire stack, thus ensuring that it satisfies die and stack-level requirements. The standard does not assume that the individual die and the complete 3D-IC stack are designed by the same team or same design system, allowing maximum flexibility of die stack and package integration. The CTIP standard will facilitate integration into multi-vendor EDA tool flows used in the design of either the 2D die or the 3D-IC stacks.

Simulating thermal behavior is critical for 3D-IC designs, as areas of high thermal load must be equally distributed throughout the entire stack of die to ensure proper operation in all expected conditions. The CTIP standard provides designers with the ability to share thermal maps and other design information, helping prevent the buildup of thermal stress points. In the case of heterogeneous 2.5D and 3D design stacks, where chips may be sourced by multiple IP vendors and foundries, the need for communication of thermal information between vendors and customers is even more critical in order to have a viable system design.

Additional working groups for Open3D TAB members include developing standards to support:

  • Power Distribution Network to ensure that each stack in the die has access to the required power supply characteristics (released May 2013)
  • Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies (This release – the document can be found at this link: http://www.si2.org/?page=1810)
  • Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process
  • Stress management to ensure that no stack in the die is adversely affected by the stack level stress hot spots or thermal gradients
  • Physical verification to facilitate stack level physical DRC verification
  • Signal integrity to facilitate stack level electrical modeling

At the upcoming Design Automation Conference (DAC) in San Francisco, there will be a 3D Panel: “Design for 3D: Are Standards Leading the Way or Lagging Behind?” at 3PM, on Monday, June 2 in Room 300 at the Moscone Center. Representatives from Qualcomm, Altera, Invensas, eda2asic, and Helic will be speaking. The abstract is located at this link: http://www.si2.org/dac_2014/abstracts/3dpanel_abstract.php

For more information on the Open3D TAB, click here: http://www.si2.org/open3d_index.php

More information on Si2 sponsored activities, including a presentation by Dr. Chenming Hu of UC Berkeley and a press conference with STMicroelectronics and IBM are located at this link: http://www.si2.org/dac_2014/dac_2014_fp.php

Open3D TAB Members:

Altera (NASDAQ: ALTR), AMD (NYSE: AMD), ANSYS (NASDAQ:ANSS), Atrenta, Cadence Design Systems (NASDAQ: CDNS), Fraunhofer Institute, GLOBALFOUNDRIES, Helic S.A., IBM (NYSE: IBM), Intel (NASDAQ: INTC), Invarian, Mentor Graphics (NASDAQ: MENT), Qualcomm (NASDAQ: QCOM), R3Logic, SEMATECH, STMicroelectronics (NYSE: STM), and Texas Instruments (NYSE: TXN).

About Si2

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured. Now in its 26th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 100 companies involved in all parts of the silicon supply chain throughout the world, www.si2.org

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today the Enterprise IoT Bootcamp, being held November 1-2, 2016, in conjunction with 19th Cloud Expo | @ThingsExpo at the Santa Clara Convention Center in Santa Clara, CA. Combined with real-world scenarios and use cases, the Enterprise IoT Bootcamp is not just based on presentations but with hands-on demos and detailed walkthroughs. We will introduce you to a variety of real world use cases prototyped using Arduino, Raspberry Pi, BeagleBone, Spark, and Intel Edison. Y...
If you’re responsible for an application that depends on the data or functionality of various IoT endpoints – either sensors or devices – your brand reputation depends on the security, reliability, and compliance of its many integrated parts. If your application fails to deliver the expected business results, your customers and partners won't care if that failure stems from the code you developed or from a component that you integrated. What can you do to ensure that the endpoints work as expect...
Fact is, enterprises have significant legacy voice infrastructure that’s costly to replace with pure IP solutions. How can we bring this analog infrastructure into our shiny new cloud applications? There are proven methods to bind both legacy voice applications and traditional PSTN audio into cloud-based applications and services at a carrier scale. Some of the most successful implementations leverage WebRTC, WebSockets, SIP and other open source technologies. In his session at @ThingsExpo, Da...
Without a clear strategy for cost control and an architecture designed with cloud services in mind, costs and operational performance can quickly get out of control. To avoid multiple architectural redesigns requires extensive thought and planning. Boundary (now part of BMC) launched a new public-facing multi-tenant high resolution monitoring service on Amazon AWS two years ago, facing challenges and learning best practices in the early days of the new service. In his session at 19th Cloud Exp...
Internet of @ThingsExpo, taking place November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with the 19th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world and ThingsExpo Silicon Valley Call for Papers is now open.
SYS-CON Events announced today that Niagara Networks will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Niagara Networks offers the highest port-density systems, and the most complete Next-Generation Network Visibility systems including Network Packet Brokers, Bypass Switches, and Network TAPs.
While DevOps promises a better and tighter integration among an organization’s development and operation teams and transforms an application life cycle into a continual deployment, Chef and Azure together provides a speedy, cost-effective and highly scalable vehicle for realizing the business values of this transformation. In his session at @DevOpsSummit at 19th Cloud Expo, Yung Chou, a Technology Evangelist at Microsoft, will present a unique opportunity to witness how Chef and Azure work tog...
Cognitive Computing is becoming the foundation for a new generation of solutions that have the potential to transform business. Unlike traditional approaches to building solutions, a cognitive computing approach allows the data to help determine the way applications are designed. This contrasts with conventional software development that begins with defining logic based on the current way a business operates. In her session at 18th Cloud Expo, Judith S. Hurwitz, President and CEO of Hurwitz & ...
SYS-CON Events announced today that ReadyTalk, a leading provider of online conferencing and webinar services, has been named Vendor Presentation Sponsor at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. ReadyTalk delivers audio and web conferencing services that inspire collaboration and enable the Future of Work for today’s increasingly digital and mobile workforce. By combining intuitive, innovative tec...
There is growing need for data-driven applications and the need for digital platforms to build these apps. In his session at 19th Cloud Expo, Muddu Sudhakar, VP and GM of Security & IoT at Splunk, will cover different PaaS solutions and Big Data platforms that are available to build applications. In addition, AI and machine learning are creating new requirements that developers need in the building of next-gen apps. The next-generation digital platforms have some of the past platform needs a...
Almost two-thirds of companies either have or soon will have IoT as the backbone of their business in 2016. However, IoT is far more complex than most firms expected. How can you not get trapped in the pitfalls? In his session at @ThingsExpo, Tony Shan, a renowned visionary and thought leader, will introduce a holistic method of IoTification, which is the process of IoTifying the existing technology and business models to adopt and leverage IoT. He will drill down to the components in this fra...
SYS-CON Events announced today that Pulzze Systems will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Pulzze Systems, Inc. provides infrastructure products for the Internet of Things to enable any connected device and system to carry out matched operations without programming. For more information, visit http://www.pulzzesystems.com.
I'm a lonely sensor. I spend all day telling the world how I'm feeling, but none of the other sensors seem to care. I want to be connected. I want to build relationships with other sensors to be more useful for my human. I want my human to understand that when my friends next door are too hot for a while, I'll soon be flaming. And when all my friends go outside without me, I may be left behind. Don't just log my data; use the relationship graph. In his session at @ThingsExpo, Ryan Boyd, Engi...
The Transparent Cloud-computing Consortium (abbreviation: T-Cloud Consortium) will conduct research activities into changes in the computing model as a result of collaboration between "device" and "cloud" and the creation of new value and markets through organic data processing High speed and high quality networks, and dramatic improvements in computer processing capabilities, have greatly changed the nature of applications and made the storing and processing of data on the network commonplace.
In his general session at 18th Cloud Expo, Lee Atchison, Principal Cloud Architect and Advocate at New Relic, discussed cloud as a ‘better data center’ and how it adds new capacity (faster) and improves application availability (redundancy). The cloud is a ‘Dynamic Tool for Dynamic Apps’ and resource allocation is an integral part of your application architecture, so use only the resources you need and allocate /de-allocate resources on the fly.