|By Business Wire||
|May 23, 2014 07:40 AM EDT||
The Silicon Integration Initiative (Si2) announced the release of a Chip Thermal Interface Protocol (CTIP) Standard for 3D Integrated Circuits (3D-IC) under the auspices of the Open3D Technical Advisory Board (TAB). The Open3D TAB is chartered to define open standards for design data formats and interfaces to enable interoperable 2.5D and 3D design flows.
The Chip Thermal Interface Protocol (CTIP) facilitates the exchange of thermal design information required to integrate silicon die into 3D-IC stacks, enabling the stack designer to simulate the thermal behavior of the entire stack, thus ensuring that it satisfies die and stack-level requirements. The standard does not assume that the individual die and the complete 3D-IC stack are designed by the same team or same design system, allowing maximum flexibility of die stack and package integration. The CTIP standard will facilitate integration into multi-vendor EDA tool flows used in the design of either the 2D die or the 3D-IC stacks.
Simulating thermal behavior is critical for 3D-IC designs, as areas of high thermal load must be equally distributed throughout the entire stack of die to ensure proper operation in all expected conditions. The CTIP standard provides designers with the ability to share thermal maps and other design information, helping prevent the buildup of thermal stress points. In the case of heterogeneous 2.5D and 3D design stacks, where chips may be sourced by multiple IP vendors and foundries, the need for communication of thermal information between vendors and customers is even more critical in order to have a viable system design.
Additional working groups for Open3D TAB members include developing standards to support:
- Power Distribution Network to ensure that each stack in the die has access to the required power supply characteristics (released May 2013)
- Thermal design and analysis of an entire 3D stack, including thermal constraints between neighboring dies (This release – the document can be found at this link: http://www.si2.org/?page=1810)
- Expression of design constraints into and out of the path-finding and floorplanning stage of the overall design process
- Stress management to ensure that no stack in the die is adversely affected by the stack level stress hot spots or thermal gradients
- Physical verification to facilitate stack level physical DRC verification
- Signal integrity to facilitate stack level electrical modeling
At the upcoming Design Automation Conference (DAC) in San Francisco, there will be a 3D Panel: “Design for 3D: Are Standards Leading the Way or Lagging Behind?” at 3PM, on Monday, June 2 in Room 300 at the Moscone Center. Representatives from Qualcomm, Altera, Invensas, eda2asic, and Helic will be speaking. The abstract is located at this link: http://www.si2.org/dac_2014/abstracts/3dpanel_abstract.php
For more information on the Open3D TAB, click here: http://www.si2.org/open3d_index.php
More information on Si2 sponsored activities, including a presentation by Dr. Chenming Hu of UC Berkeley and a press conference with STMicroelectronics and IBM are located at this link: http://www.si2.org/dac_2014/dac_2014_fp.php
Open3D TAB Members:
Altera (NASDAQ: ALTR), AMD (NYSE: AMD), ANSYS (NASDAQ:ANSS), Atrenta, Cadence Design Systems (NASDAQ: CDNS), Fraunhofer Institute, GLOBALFOUNDRIES, Helic S.A., IBM (NYSE: IBM), Intel (NASDAQ: INTC), Invarian, Mentor Graphics (NASDAQ: MENT), Qualcomm (NASDAQ: QCOM), R3Logic, SEMATECH, STMicroelectronics (NYSE: STM), and Texas Instruments (NYSE: TXN).
Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured. Now in its 26th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 100 companies involved in all parts of the silicon supply chain throughout the world, www.si2.org
Through WebRTC, audio and video communications are being embedded more easily than ever into applications, helping carriers, enterprises and independent software vendors deliver greater functionality to their end users. With today’s business world increasingly focused on outcomes, users’ growing calls for ease of use, and businesses craving smarter, tighter integration, what’s the next step in delivering a richer, more immersive experience? That richer, more fully integrated experience comes ab...
Sep. 5, 2015 08:00 AM EDT Reads: 765
Consumer IoT applications provide data about the user that just doesn’t exist in traditional PC or mobile web applications. This rich data, or “context,” enables the highly personalized consumer experiences that characterize many consumer IoT apps. This same data is also providing brands with unprecedented insight into how their connected products are being used, while, at the same time, powering highly targeted engagement and marketing opportunities. In his session at @ThingsExpo, Nathan Trel...
Sep. 5, 2015 08:00 AM EDT Reads: 314
Puppet Labs is pleased to share the findings from our 2015 State of DevOps Survey. We have deepened our understanding of how DevOps enables IT performance and organizational performance, based on responses from more than 20,000 technical professionals we’ve surveyed over the past four years. The 2015 State of DevOps Report reveals high-performing IT organizations deploy 30x more frequently with 200x shorter lead times. They have 60x fewer failures and recover 168x faster
Sep. 5, 2015 08:00 AM EDT Reads: 154
The 3rd International WebRTC Summit, to be held Nov. 4–6, 2014, at the Santa Clara Convention Center in Santa Clara, CA, announces that its Call for Papers is now open. Topics include all aspects of improving IT delivery by eliminating waste through automated business models leveraging cloud technologies. WebRTC Summit is co-located with 15th International Cloud Expo, 6th International Big Data Expo, 3rd International DevOps Summit and 2nd Internet of @ThingsExpo. WebRTC (Web-based Real-Time Com...
Sep. 5, 2015 07:15 AM EDT Reads: 1,651
Contrary to mainstream media attention, the multiple possibilities of how consumer IoT will transform our everyday lives aren’t the only angle of this headline-gaining trend. There’s a huge opportunity for “industrial IoT” and “Smart Cities” to impact the world in the same capacity – especially during critical situations. For example, a community water dam that needs to release water can leverage embedded critical communications logic to alert the appropriate individuals, on the right device, as...
Sep. 5, 2015 07:15 AM EDT Reads: 183
SYS-CON Events announced today the Containers & Microservices Bootcamp, being held November 3-4, 2015, in conjunction with 17th Cloud Expo, @ThingsExpo, and @DevOpsSummit at the Santa Clara Convention Center in Santa Clara, CA. This is your chance to get started with the latest technology in the industry. Combined with real-world scenarios and use cases, the Containers and Microservices Bootcamp, led by Janakiram MSV, a Microsoft Regional Director, will include presentations as well as hands-on...
Sep. 5, 2015 07:00 AM EDT Reads: 452
Even though you are running an agile development process, that doesn’t necessarily mean that your performance testing is being conducted in a truly agile way. Saving performance testing for a “final sprint” before release still treats it like a waterfall development step, with all the cost and risk that comes with that. In this post, we will show you how to make load testing happen early and often by putting SLAs on the agile task board.
Sep. 5, 2015 07:00 AM EDT Reads: 114
WebRTC has had a real tough three or four years, and so have those working with it. Only a few short years ago, the development world were excited about WebRTC and proclaiming how awesome it was. You might have played with the technology a couple of years ago, only to find the extra infrastructure requirements were painful to implement and poorly documented. This probably left a bitter taste in your mouth, especially when things went wrong.
Sep. 5, 2015 07:00 AM EDT Reads: 522
Manufacturing connected IoT versions of traditional products requires more than multiple deep technology skills. It also requires a shift in mindset, to realize that connected, sensor-enabled “things” act more like services than what we usually think of as products. In his session at @ThingsExpo, David Friedman, CEO and co-founder of Ayla Networks, will discuss how when sensors start generating detailed real-world data about products and how they’re being used, smart manufacturers can use the ...
Sep. 5, 2015 07:00 AM EDT Reads: 125
It’s been proven time and time again that in tech, diversity drives greater innovation, better team productivity and greater profits and market share. So what can we do in our DevOps teams to embrace diversity and help transform the culture of development and operations into a true “DevOps” team? In her session at DevOps Summit, Stefana Muller, Director, Product Management – Continuous Delivery at CA Technologies, answered that question citing examples, showing how to create opportunities for ...
Sep. 5, 2015 06:45 AM EDT Reads: 554
The 17th International Cloud Expo has announced that its Call for Papers is open. 17th International Cloud Expo, to be held November 3-5, 2015, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, APM, APIs, Microservices, Security, Big Data, Internet of Things, DevOps and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding bu...
Sep. 5, 2015 06:30 AM EDT Reads: 1,729
The Internet of Things is in the early stages of mainstream deployment but it promises to unlock value and rapidly transform how organizations manage, operationalize, and monetize their assets. IoT is a complex structure of hardware, sensors, applications, analytics and devices that need to be able to communicate geographically and across all functions. Once the data is collected from numerous endpoints, the challenge then becomes converting it into actionable insight.
Sep. 5, 2015 06:00 AM EDT Reads: 152
With the Apple Watch making its way onto wrists all over the world, it’s only a matter of time before it becomes a staple in the workplace. In fact, Forrester reported that 68 percent of technology and business decision-makers characterize wearables as a top priority for 2015. Recognizing their business value early on, FinancialForce.com was the first to bring ERP to wearables, helping streamline communication across front and back office functions. In his session at @ThingsExpo, Kevin Roberts...
Sep. 5, 2015 06:00 AM EDT Reads: 150
In his session at @ThingsExpo, Lee Williams, a producer of the first smartphones and tablets, will talk about how he is now applying his experience in mobile technology to the design and development of the next generation of Environmental and Sustainability Services at ETwater. He will explain how M2M controllers work through wirelessly connected remote controls; and specifically delve into a retrofit option that reverse-engineers control codes of existing conventional controller systems so the...
Sep. 5, 2015 05:00 AM EDT Reads: 300
ElasticBox, the agile application delivery manager, announced freely available public boxes for the DevOps community. ElasticBox works with enterprises to help them deploy any application to any cloud. Public boxes are curated reference boxes that represent some of the most popular applications and tools for orchestrating deployments at scale. Boxes are an adaptive way to represent reusable infrastructure as components of code. Boxes contain scripts, variables, and metadata to automate proces...
Sep. 5, 2015 04:30 AM EDT Reads: 159