|By Business Wire||
|May 23, 2014 06:22 PM EDT||
Research and Markets (http://www.researchandmarkets.com/research/g4nsw2/system_in_package) has announced the addition of the "System in Package (SIP) Market by Technology, Type, Interconnection Technology, Applications and Geography - Global Trends & Forecasts to - 2014 - 2020" report to their offering.
The semiconductor packaging industry in the past decade has seen the emergence of System in Package (SiP) technologies. This has been driven by the increasing demands of the portable and consumer electronics industry with greater product functionality and with improved performance at reduced costs. SiP paradigm in the electronics product execution allows the mixing of optimum active and passive device technologies in bare die format within a single package outline for cost effective, high performance, and short time-to-market. Thus, there are many wireless and consumer-focused IC and systems companies which are turning to System in Package (SiP) design to gain a competitive advantage.
Some of the key players in this market include Amkor Technology (U.S.), ASE Global (Taiwan), Powertech Technology (Taiwan), STATS ChipPAC (Singapore), ChipMOS Technologies (Taiwan), Fujitsu Semiconductor Limited (Japan), Siliconware Precision Industries Co., Ltd. (Taiwan), InsightSiP (France), Freescale Semiconductor Inc. (U.S.), Wi2Wi Inc.(U.S.), and Nanium S.A. (Portugal).
System in Package (SiP) has overcome the formidable integration barriers of heterogeneity without compromising individual chip technologies enclosed in a single module. This has given the semiconductor packaging industry a potential to revolutionize the products by manufacturing them with smaller form factor. SiP is constantly developing in automotive and medical applications due to the compact packaging technique.
Key Topics Covered:
2 Executive Summary
3 Market Overview
4 Market Analysis
5 Global System in Package (SIP) Market Segmentation
6 Market By Application
7 Market By Geography
8 Competitive Landscape
9 Company Profiles
- Amkor Technology Inc.
- ASE Inc.
- Chipmos Tech. Inc.
- Chipbond Technology Corporation
- Fujitsu Ltd.
- GS Nanotech
- Insight SIP
- Jiangsu Changjiang Electronics Technology Co. Ltd.
- Nanium S.A.
- Powertech Technologies Inc.
- Qualcomm Incorporated
- Siliconware Precision Industries Co., Ltd.
- Stats Chippac Ltd.
- Toshiba Corporation
- WI2WI Corporation
For more information visit http://www.researchandmarkets.com/research/g4nsw2/system_in_package
Enterprise IT has been in the era of Hybrid Cloud for some time now. But it seems most conversations about Hybrid are focused on integrating AWS, Microsoft Azure, or Google ECM into existing on-premises systems. Where is all the Private Cloud? What do technology providers need to do to make their offerings more compelling? How should enterprise IT executives and buyers define their focus, needs, and roadmap, and communicate that clearly to the providers?
Sep. 27, 2016 05:00 PM EDT Reads: 1,585
Sep. 27, 2016 04:45 PM EDT Reads: 341
Sep. 27, 2016 04:00 PM EDT Reads: 2,630
Sep. 27, 2016 03:30 PM EDT Reads: 293
Sep. 27, 2016 03:15 PM EDT Reads: 2,756
Sep. 27, 2016 03:15 PM EDT Reads: 1,365
Sep. 27, 2016 03:15 PM EDT Reads: 2,854
Sep. 27, 2016 03:00 PM EDT Reads: 1,689
Sep. 27, 2016 02:45 PM EDT Reads: 2,201
Sep. 27, 2016 02:45 PM EDT Reads: 4,638
Sep. 27, 2016 02:45 PM EDT Reads: 1,253
Sep. 27, 2016 02:15 PM EDT Reads: 1,994
Sep. 27, 2016 02:00 PM EDT Reads: 1,445
Sep. 27, 2016 01:30 PM EDT Reads: 1,713
SYS-CON Events announced today that Tintri Inc., a leading producer of VM-aware storage (VAS) for virtualization and cloud environments, will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Tintri VM-aware storage is the simplest for virtualized applications and cloud. Organizations including GE, Toyota, United Healthcare, NASA and 6 of the Fortune 15 have said “No to LUNs.” With Tintri they mana...
Sep. 27, 2016 01:00 PM EDT Reads: 2,817