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Research and Markets: Permanent Wafer Bonding for Semiconductor: Application Trends & Technology Report 2014 -EVG, SUSS MicroTec, and TEL Dominate the Market

Research and Markets (http://www.researchandmarkets.com/research/qfw455/permanent_wafer) has announced the addition of the "Permanent Wafer Bonding for Semiconductor: Application Trends & Technology" report to their offering.


The permanent bonding market is evolving, currently dominated and fragmented by 3 main permanent bonding equipment suppliers: EV Group (EVG), SUSS MicroTec, and TEL (Tokyo Electron).

These 3 vendors today account for almost 80% of the permanent bonding equipment market by focusing on MEMS and advanced packaging applications including BSI CIS, CIS capping WLP, and 3D stack TSV.

Key Findings

  • EVG is still the market leader in permanent bonding technology with more than 70% of market share, but will be challenged by the merging of TEL and AMAT (Applied Materials),two of the largest semiconductor equipment suppliers in the world.
  • The entrance of aggressive new players is likely to challenge established players in the permanent bonding market:
  • Some players have recently entered the market with low barriers of entry such as Mitsubishi Heavy Industry (MHI); mainly with customers involved in the R&D sector.
  • Other big equipment suppliers have created a challenging environment and stimulate technology innovation for further improvements in the Advanced packaging area.
  • TEL has gained more market share in 2013 from permanent bonding technologies - with significant market share achieved due to their deep involvement in 3D TSV Stack bonding technology performed at room temperature.


  • Permanent bonding market metrics (wpsy, units and value)
  • Breakdown by wafer size
  • Complete competitive analysis of the key permanent bonding equipment suppliers with in-depth profiles of the main equipment vendors
  • Market share of each major equipment supplier
  • Overview of the different permanent bonding technologies
  • Key technical insights and detailed analysis on all permanent bonding technologies, trends, & challenges
  • Detailed analysis on the applications using permanent bonding technologies
  • Detailed information on established and emerging permanent bonding process steps

Key Topics Covered:

  1. Executive summary
  2. Introduction, definitions & scope of the report
  3. 2013-2019 detailed permanent bonding
  4. Permanent bonding technologies
  5. 2013-2019 detailed permanent bonding forecast by applications
  6. Conclusions & perspectives
  7. Company presentation

Companies Mentioned

  • AMD
  • AML
  • Applied Materials
  • Avago
  • Bosch
  • Discera
  • EVG
  • Infineon
  • InvenSense
  • Lemoptix
  • Luxtera
  • Mitsubishi Heavy Industries
  • Murata / VTI
  • Nemotek
  • PlanOptik
  • Samsung
  • Sensonor
  • Silicon Labs
  • STMicroelectronics
  • SUSS MicroTec
  • Sony
  • Teledyne DALSA
  • Tokyo Electron
  • Ziptronix
  • IMEC
  • Leti
  • Texas Instruments
  • Tezzaron

For more information visit http://www.researchandmarkets.com/research/qfw455/permanent_wafer

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