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TowerJazz Releases Enhanced RF SOI CMOS and High Speed SiGe Process Design Kits for Use with Agilent Technologies’ Advanced Design System Software
|By Business Wire
|June 3, 2014 04:00 AM EDT
TowerJazz, the global specialty foundry leader, today announced the
availability of enhanced RF SOI CMOS and high speed SiGe process design
kits (PDKs) for its 0.18um process technology. These kits were developed
for use with Agilent Technologies’ Advanced Design System (ADS) software
and target a wide range of analog markets including front-end modules
for mobile phones, tablets and WiFi terminals, fiber optic connections
for data centers and network infrastructure, radar for automotive
collision avoidance and other high-frequency applications.
The enhanced PDKs enable reduction of die size and bill of materials
with new advanced inductor based passive components e.g. significant
area savings are possible when using solenoids which provide 250% more
inductance per area as compared to regular inductors. The new PDKs also
improve simulation accuracy for die packaged in thin-form factors and
allows the simulation of thermal effects across chips that are critical
in many of the targeted applications.
In addition to inductors, the PDKs are now supporting scalable solenoids
(series inductors), balun/transformer devices and improved model
capabilities to account for substrate thinning and flipchip packaging
effects. Ultrathin substrates of 100um or less are common in the
assembly of FEM chips, while flipchip stand-off distances between the
chip surface and the circuit laminate can be on the order of 80um.
The Agilent EES of EDA Electro-Thermal Simulator in ADS has been enabled
for high-speed SiGe BiCMOS technology, allowing designers to simulate
the impact of thermal coupling across the chip. Thermal effects in SiGe
designs can cause degradation in both performance and reliability. This
new capability allows designers using the ADS PDK for TowerJazz’s
SBC18HA process to “design around” the thermal effects by optimizing
design parameters in conjunction with layout modifications.
TowerJazz and Agilent plan to demonstrate the PDKs at the International
Microwave Symposium (IMS) conference, June 3-5, in Tampa, FL, booth
#1328 and the Design Automation (DAC) conference, June 2-4, in San
Francisco, CA, booth #1301.
"We are excited to work with Agilent and complement our leading edge RF
SOI and SiGe BiCMOS technologies with strong design enablement
capability to speed our customers’ time to market,” said Ori Galzur,
vice president of the TowerJazz VLSI Design Center. "We constantly
strive to provide our customers a clear advantage in bringing analog
products to market by offering the best process technology together with
a sophisticated design infrastructure."
“We are very pleased that our mutual customers can now leverage RF
critical functionalities like cutting edge inductor design capability
and electro-thermal analysis in TowerJazz’s leading RF process
technologies,” said Juergen Hartung, RFIC marketing and foundry program
manager of Agilent’s EEs of EDA. “Based on a full 3D thermal solver
tightly integrated with ADS circuit simulation and IC layout
environment, this solution provides accurate, ’thermally aware’
simulation results, including steady-state, transient, and envelope
analyses, that account for thermal coupling between devices as well as
heat transfer through the die and packaging.”
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), its fully owned
U.S. subsidiary Jazz Semiconductor, Inc. and its fully owned Japanese
subsidiary TowerJazz Japan, Ltd., operate collectively under the brand
name TowerJazz, the global specialty foundry leader. TowerJazz also owns
51% of TowerJazz Panasonic Semiconductor Company, Ltd. (TPSCo) through a
joint venture with Panasonic Corporation. TowerJazz manufactures
integrated circuits, offering a broad range of customizable process
technologies including: SiGe, BiCMOS, Mixed-Signal/CMOS, RF CMOS, CMOS
Image Sensor, integrated Power Management (BCD & 700V), and MEMS
capabilities. Through TPSCo, TowerJazz offers additional capacity as
well as leading edge 45nm CMOS, 65nm RF CMOS and 65nm 1.12um pixel
technologies. TowerJazz provides a world-class design enablement
platform that enables a quick and accurate design cycle. TowerJazz also
offers Transfer Optimization and development Process Services (TOPS) to
IDMs and fabless companies that need to expand capacity. To provide
multi-fab sourcing for its customers, TowerJazz operates two
manufacturing facilities in Israel, one in the U.S., and four in Japan.
For more information, please visit www.towerjazz.com.
Safe Harbor Regarding Forward-Looking Statements
This press release includes forward-looking statements, which are
subject to risks and uncertainties. Actual results may vary from those
projected or implied by such forward-looking statements. A complete
discussion of risks and uncertainties that may affect the accuracy of
forward-looking statements included in this press release or which may
otherwise affect TowerJazz’s business is included under the heading
"Risk Factors" in Tower’s most recent filings on Forms 20-F, F-3, F-4
and 6-K, as were filed with the Securities and Exchange Commission (the
“SEC”) and the Israel Securities Authority and Jazz’s most recent
filings on Forms 10-K and 10-Q, as were filed with the SEC,
respectively. Tower and Jazz do not intend to update, and expressly
disclaim any obligation to update, the information contained in this
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