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Research and Markets: Maxim Integrated MAX21000 - 3-Axis MEMS Gyroscope Reverse Costing Analysis

Research and Markets (http://www.researchandmarkets.com/research/b68rl2/maxim_integrated) has announced the addition of the "Maxim Integrated MAX21000 - 3-Axis MEMS Gyroscope Reverse Costing Analysis" report to their offering.

Following the purchase of MEMS manufacturer SensorDynamics in 2011, Maxim releases its first MEMS Gyroscope reference with a very accurate and cost effective component.

The MAX21000 continues to use the PSM-X2 process jointly developed by SensorDynamics and the Fraunhofer Institute for Silicon Technology. This technology platform includes a proprietary surface micromachining process to build the mechanical structures and a gold silicon eutectic wafer bonding allowing an hermetic encapsulation of the gyro sensor.

Compared with state of the art 3x3mm MEMS gyroscopes supplied by STMicroelectronics and Bosch Sensortec, the new design developed by Maxim for this reference offers 28% to 35% reduction in silicon area for the MEMS die, enabling a significant cost advantage.

Assembled in a LGA 3.0x3.0x0.9mm package, the MAX21000 is a low power consumption (5.4mA) and high accuracy 3-axis gyroscope targeted for mobile applications.

Key Topics Covered:


Overview/Introduction , Maxim Company Profile

Physical Analysis


  • Package Views & Dimensions
  • Package Pin Out
  • Package Opening
  • Wire Bonding Process
  • Package Cross-Section


  • View, Dimensions & Marking
  • Delayering
  • Main Blocks Identification
  • Cross-Section
  • Process Characteristics


  • View, Dimensions & Marking
  • Bond Pad Opening
  • Cap Removed & Cap Details
  • Sensing Area Details
  • Cross-Section (Sensor, Cap & Sealing)
  • Process Characteristics

Manufacturing Process Flow

  • ASIC Front-End Process
  • ASIC Wafer Fabrication Unit
  • MEMS Process Flow
  • MEMS Wafer Fabrication Unit
  • Packaging Process Flow
  • Package Assembly Unit

Cost Analysis

  • Main steps of economic analysis
  • Yields Hypotheses
  • ASIC Front-End Cost
  • ASIC Back-End 0 : Probe Test & Dicing
  • ASIC Wafer & Die Cost
  • MEMS Front-End Cost
  • MEMS Back-End 0 : Probe Test & Dicing
  • MEMS Front-End Cost per process steps
  • MEMS Wafer & Die Cost
  • Back-End : Packaging Cost
  • Back-End : Packaging Cost per Process Steps
  • Back-End : Final Test Cost
  • MAX21000 Component Cost

Estimated Price Analysis

For more information visit http://www.researchandmarkets.com/research/b68rl2/maxim_integrated

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