Welcome!

News Feed Item

TRADE NEWS: Agilent Technologies Announces Advanced Modeling Solutions for Nanoscale 3D FinFETs and High-Frequency/High-Power GaN HEMTs

Agilent Technologies Inc. (NYSE:A) today announced several innovations for the 2014 release of its industry-leading suite of device modeling and characterization software tools. The suite comprises Agilent EEsof EDA’s Integrated Circuits Characterization and Analysis Program (IC-CAP), Model Builder Program (MBP), and Model Quality Assurance (MQA).

“Over the past few years, we’ve steadily expanded our device modeling platform through internal development and acquisition of key technologies,” said Brian Chen, Agilent’s device modeling planning manager. “This marks the first release of our entire portfolio and represents a significant advancement toward our vision of being a partner that uniquely delivers a complete end-to-end, measurement-to-modeling solution.”

Advanced Modeling Capabilities

The new software release features three advanced device modeling packages for Agilent’s DynaFET, BSIM6, and BSIM-CMG models.

BSIM6 is the industry-standard model for bulk MOSFETs, offering important improvements for analog/RF applications over its predecessor, BSIM4. BSIM-CMG is the industry-standard model for sub-20 nm 3-D FinFET technologies. Modeling solutions for both BSIM6 and BSIM-CMG in the 2014 release are designed to help the semiconductor industry understand and use these new technologies.

The DynaFET modeling package is based on internally developed technology and is an integral part of Agilent’s GaN HEMT characterization, modeling and simulation solution. The GaN HEMT modeling package provides a GUI-based turnkey solution for DynaFET model generation.

Using artificial neural networks for charge and current formulations, and incorporating trapping/de-trapping and self-heating effects, the time-domain DynaFET model is capable of fitting accurately to DC, linear and large-signal measurement data—all simultaneously. This allows a single model file to be used for the design of different applications under various bias conditions, all with accurate simulation results.

Additional Enhancements

The 2014 device modeling and characterization software release also provides a number of new and enhanced features designed to noticeably improve productivity across the end-to-end work flow of device characterization, model generation and model validation. These enhancements include:

  • a programming editor;
  • faster simulation speed with major simulators;
  • expanded mismatch and variation modeling solutions; and
  • a streamlined and flexible user interface to create, manage, monitor, and debug measurement test plans.

U.S. Pricing and Availability

Agilent’s 2014 device modeling and characterization software release will be available in July.

More information on the 2014 release of IC-CAP, MBD and MQA software is available at www.agilent.com/find/eesof-iccap, www.agilent.com/find/eesof-mbp and www.agilent.com/find/eesof-mqa, respectively. Images of the software are available at www.agilent.com/find/DeviceModeling_2014_images.

About IC-CAP Software

Agilent IC-CAP software is a device-modeling program that delivers powerful characterization and analysis capabilities for today’s semiconductor modeling processes. Providing efficient and accurate extraction of active device and circuit model parameters, IC-CAP performs numerous modeling tasks, including instrument control, data acquisition, graphical analysis, simulation and optimization. It is used by semiconductor foundries and design houses to characterize foundry processes. For more information on IC-CAP, visit www.agilent.com/find/eesof-iccap.

About MBP Software

Model Builder Program (MBP) is a one-stop solution that provides both automation and flexibility for high-volume, high-throughput device modeling. MBP includes powerful, built-in characterization and modeling capabilities as well as an open interface for modeling strategy customization. It is widely used both by semiconductor foundries and design houses to extract and customize SPICE model libraries. For more information, visit www.agilent.com/find/eesof-mbp.

About MQA Software

Model Quality Assurance (MQA) provides the complete solution and framework to fabless design companies, IDMs and foundries for SPICE model library validation, comparison, and documentation. MQA has become a de facto industry-standard SPICE model QA tool. MQA performs model QA, comparison, and documentation automatically to ensure design success using advanced process technologies. For more information about MQA, visit www.agilent.com/find/eesof-mqa.

About Agilent EEsof EDA Software

Agilent EEsof EDA is the leading supplier of electronic design automation software for microwave, RF, high-frequency, high-speed digital, RF system, electronic system level, circuit, 3-D electromagnetic, physical design and device-modeling applications. More information is available at www.agilent.com/find/eesof.

About Agilent Technologies

Agilent Technologies Inc. (NYSE:A) is the world’s premier measurement company and a technology leader in chemical analysis, life sciences, diagnostics, electronics and communications. The company’s 20,600 employees serve customers in more than 100 countries. Agilent had revenues of $6.8 billion in fiscal 2013. Information about Agilent is available at www.agilent.com.

On Sept. 19, 2013, Agilent announced plans to separate into two publicly traded companies through a tax-free spinoff of its electronic measurement business. The new company is named Keysight Technologies, Inc. The separation is expected to be completed in early November 2014.

NOTE TO EDITORS: Further technology, corporate citizenship and executive news is available at www.agilent.com/go/news.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
In his Opening Keynote at 21st Cloud Expo, John Considine, General Manager of IBM Cloud Infrastructure, led attendees through the exciting evolution of the cloud. He looked at this major disruption from the perspective of technology, business models, and what this means for enterprises of all sizes. John Considine is General Manager of Cloud Infrastructure Services at IBM. In that role he is responsible for leading IBM’s public cloud infrastructure including strategy, development, and offering m...
Today we can collect lots and lots of performance data. We build beautiful dashboards and even have fancy query languages to access and transform the data. Still performance data is a secret language only a couple of people understand. The more business becomes digital the more stakeholders are interested in this data including how it relates to business. Some of these people have never used a monitoring tool before. They have a question on their mind like “How is my application doing” but no id...
CloudEXPO | DXWorldEXPO are the world's most influential, independent events where Cloud Computing was coined and where technology buyers and vendors meet to experience and discuss the big picture of Digital Transformation and all of the strategies, tactics, and tools they need to realize their goals. Sponsors of DXWorldEXPO | CloudEXPO benefit from unmatched branding, profile building and lead generation opportunities.
DXWorldEXPO LLC announced today that All in Mobile, a mobile app development company from Poland, will exhibit at the 22nd International CloudEXPO | DXWorldEXPO. All In Mobile is a mobile app development company from Poland. Since 2014, they maintain passion for developing mobile applications for enterprises and startups worldwide.
For far too long technology teams have lived in siloes. Not only physical siloes, but cultural siloes pushed by competing objectives. This includes informational siloes where business users require one set of data and tech teams require different data. DevOps intends to bridge these gaps to make tech driven operations more aligned and efficient.
The best way to leverage your CloudEXPO | DXWorldEXPO presence as a sponsor and exhibitor is to plan your news announcements around our events. The press covering CloudEXPO | DXWorldEXPO will have access to these releases and will amplify your news announcements. More than two dozen Cloud companies either set deals at our shows or have announced their mergers and acquisitions at CloudEXPO. Product announcements during our show provide your company with the most reach through our targeted audienc...
@DevOpsSummit at Cloud Expo, taking place November 12-13 in New York City, NY, is co-located with 22nd international CloudEXPO | first international DXWorldEXPO and will feature technical sessions from a rock star conference faculty and the leading industry players in the world.
Everything run by electricity will eventually be connected to the Internet. Get ahead of the Internet of Things revolution. In his session at @ThingsExpo, Akvelon expert and IoT industry leader Sergey Grebnov provided an educational dive into the world of managing your home, workplace and all the devices they contain with the power of machine-based AI and intelligent Bot services for a completely streamlined experience.
DXWorldEXPO | CloudEXPO are the world's most influential, independent events where Cloud Computing was coined and where technology buyers and vendors meet to experience and discuss the big picture of Digital Transformation and all of the strategies, tactics, and tools they need to realize their goals. Sponsors of DXWorldEXPO | CloudEXPO benefit from unmatched branding, profile building and lead generation opportunities.
With 10 simultaneous tracks, keynotes, general sessions and targeted breakout classes, @CloudEXPO and DXWorldEXPO are two of the most important technology events of the year. Since its launch over eight years ago, @CloudEXPO and DXWorldEXPO have presented a rock star faculty as well as showcased hundreds of sponsors and exhibitors!
22nd International Cloud Expo, taking place June 5-7, 2018, at the Javits Center in New York City, NY, and co-located with the 1st DXWorld Expo will feature technical sessions from a rock star conference faculty and the leading industry players in the world. Cloud computing is now being embraced by a majority of enterprises of all sizes. Yesterday's debate about public vs. private has transformed into the reality of hybrid cloud: a recent survey shows that 74% of enterprises have a hybrid cloud ...
HyperConvergence came to market with the objective of being simple, flexible and to help drive down operating expenses. It reduced the footprint by bundling the compute/storage/network into one box. This brought a new set of challenges as the HyperConverged vendors are very focused on their own proprietary building blocks. If you want to scale in a certain way, let's say you identified a need for more storage and want to add a device that is not sold by the HyperConverged vendor, forget about it...
Dhiraj Sehgal works in Delphix's product and solution organization. His focus has been DevOps, DataOps, private cloud and datacenters customers, technologies and products. He has wealth of experience in cloud focused and virtualized technologies ranging from compute, networking to storage. He has spoken at Cloud Expo for last 3 years now in New York and Santa Clara.
In his keynote at 19th Cloud Expo, Sheng Liang, co-founder and CEO of Rancher Labs, discussed the technological advances and new business opportunities created by the rapid adoption of containers. With the success of Amazon Web Services (AWS) and various open source technologies used to build private clouds, cloud computing has become an essential component of IT strategy. However, users continue to face challenges in implementing clouds, as older technologies evolve and newer ones like Docker c...
"MobiDev is a software development company and we do complex, custom software development for everybody from entrepreneurs to large enterprises," explained Alan Winters, U.S. Head of Business Development at MobiDev, in this SYS-CON.tv interview at 21st Cloud Expo, held Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA.