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TRADE NEWS: Agilent Technologies Announces Advanced Modeling Solutions for Nanoscale 3D FinFETs and High-Frequency/High-Power GaN HEMTs
|By Business Wire
|June 18, 2014 11:01 AM EDT
Agilent Technologies Inc. (NYSE:A) today announced several innovations
for the 2014 release of its industry-leading suite of device modeling
and characterization software tools. The suite comprises Agilent EEsof
Circuits Characterization and Analysis Program (IC-CAP), Model
Builder Program (MBP), and Model
Quality Assurance (MQA).
“Over the past few years, we’ve steadily expanded our device modeling
platform through internal development and acquisition of key
technologies,” said Brian Chen, Agilent’s device modeling planning
manager. “This marks the first release of our entire portfolio and
represents a significant advancement toward our vision of being a
partner that uniquely delivers a complete end-to-end,
Advanced Modeling Capabilities
The new software release features three advanced device modeling
packages for Agilent’s DynaFET, BSIM6, and BSIM-CMG models.
BSIM6 is the industry-standard model for bulk MOSFETs, offering
important improvements for analog/RF applications over its predecessor,
BSIM4. BSIM-CMG is the industry-standard model for sub-20 nm 3-D FinFET
technologies. Modeling solutions for both BSIM6 and BSIM-CMG in the 2014
release are designed to help the semiconductor industry understand and
use these new technologies.
The DynaFET modeling package is based on internally developed technology
and is an integral part of Agilent’s GaN HEMT characterization, modeling
and simulation solution. The GaN HEMT modeling package provides a
GUI-based turnkey solution for DynaFET model generation.
Using artificial neural networks for charge and current formulations,
and incorporating trapping/de-trapping and self-heating effects, the
model is capable of fitting accurately to DC, linear and
large-signal measurement data—all simultaneously. This allows a single
model file to be used for the design of different applications under
various bias conditions, all with accurate simulation results.
The 2014 device modeling and characterization software release also
provides a number of new and enhanced features designed to noticeably
improve productivity across the end-to-end work flow of device
characterization, model generation and model validation. These
a programming editor;
faster simulation speed with major simulators;
expanded mismatch and variation modeling solutions; and
a streamlined and flexible user interface to create, manage, monitor,
and debug measurement test plans.
U.S. Pricing and Availability
Agilent’s 2014 device modeling and characterization software release
will be available in July.
More information on the 2014 release of IC-CAP, MBD and MQA software is
available at www.agilent.com/find/eesof-iccap,
respectively. Images of the software are available at www.agilent.com/find/DeviceModeling_2014_images.
About IC-CAP Software
Agilent IC-CAP software is a device-modeling program that delivers
powerful characterization and analysis capabilities for today’s
semiconductor modeling processes. Providing efficient and accurate
extraction of active device and circuit model parameters, IC-CAP
performs numerous modeling tasks, including instrument control, data
acquisition, graphical analysis, simulation and optimization. It is used
by semiconductor foundries and design houses to characterize foundry
processes. For more information on IC-CAP, visit www.agilent.com/find/eesof-iccap.
About MBP Software
Model Builder Program (MBP) is a one-stop solution that provides both
automation and flexibility for high-volume, high-throughput device
modeling. MBP includes powerful, built-in characterization and modeling
capabilities as well as an open interface for modeling strategy
customization. It is widely used both by semiconductor foundries and
design houses to extract and customize SPICE model libraries. For more
information, visit www.agilent.com/find/eesof-mbp.
About MQA Software
Model Quality Assurance (MQA) provides the complete solution and
framework to fabless design companies, IDMs and foundries for SPICE
model library validation, comparison, and documentation. MQA has become
a de facto industry-standard SPICE model QA tool. MQA performs model QA,
comparison, and documentation automatically to ensure design success
using advanced process technologies. For more information about MQA,
About Agilent EEsof EDA Software
Agilent EEsof EDA is the leading supplier of electronic design
automation software for microwave, RF, high-frequency, high-speed
digital, RF system, electronic system level, circuit, 3-D
electromagnetic, physical design and device-modeling applications. More
information is available at www.agilent.com/find/eesof.
About Agilent Technologies
Agilent Technologies Inc. (NYSE:A) is the world’s premier measurement
company and a technology leader in chemical analysis, life sciences,
diagnostics, electronics and communications. The company’s 20,600
employees serve customers in more than 100 countries. Agilent had
revenues of $6.8 billion in fiscal 2013. Information about Agilent is
available at www.agilent.com.
On Sept. 19, 2013, Agilent announced plans to separate into two publicly
traded companies through a tax-free spinoff of its electronic
measurement business. The new company is named Keysight Technologies,
Inc. The separation is expected to be completed in early November 2014.
NOTE TO EDITORS: Further technology, corporate citizenship and executive
news is available at www.agilent.com/go/news.
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