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Infonetics: Ethernet Access Device (EAD) Market Benefits from Operator Plans to End T1s and E1s

Market research firm Infonetics Research released excerpts from its latest Ethernet Access Devices market share, market size, and forecasts report, which tracks revenue, units, and ports for copper and fiber Ethernet access devices (EADs).

ANALYST NOTE

“A number of major operators around the world—Deutsche Telekom, BT, and AT&T, among others—are starting to make end-of-life plans for customer TDM connections such as T1s and E1s, and Ethernet services are the main replacement technology for TDM,” notes Michael Howard, principal analyst for carrier networks and co-founder of Infonetics Research.

Continues Howard: “This bodes well for EFM (Ethernet in the first mile) bonded copper and fiber Ethernet access devices (EADs), on which we expect operators to spend a cumulative $5.6 billion worldwide over the five years from 2014 to 2018.”

EAD MARKET HIGHLIGHTS

  • Worldwide Ethernet access device (EAD) revenue took an 11% jump in 2013 over 2012, to $958 million, as economic conditions eased in Europe and picked up in Japan
  • Spending on copper EADs totaled $283 million in 2013, illustrating copper’s important but limited role for Ethernet services
  • Now in steady decline, Ethernet over TDM (EoTDM) bonded circuits remain a niche market, providing an inexpensive way to combine several E1s or T1s in logical bonding
  • Actelis, Adva, Ciena, Overture, and RAD (in alphabetical order) lead the EAD market (all 5 companies topped the leaderboard in both 2012 and 2013)

NFV WEBINAR

Join analyst Michael Howard June 19 at 11:00 AM EDT for NFV: An Easier Initial Target Than SDN?, a free, live event for operators exploring use cases, lessons learned, and recommendations for developing NFV projects. Attend live or access the replay at: http://w.on24.com/r.htm?e=793989&s=1&k=BA88F4D4A551DA1913530B000C135707

EAD REPORT SYNOPSIS

Infonetics’ biannual Ethernet access devices report provides regional market size, vendor market share, forecasts through 2018, analysis, and trends for copper (EFM bonded copper, EoTDM bonded circuits) and fiber EADs and ports by speed (100M, 1G, 10G, 100G). Vendors tracked: Accedian, Actelis, Adtran, Adva, Calix, Canoga Perkins, Ciena, Coriant, FibroLan, Fujitsu, Ipitek, MRV, NEC, Omnitron, OneAccess, Overture, RAD, Tellabs, Telco Systems, Zhone, others. To buy the report, contact Infonetics: http://www.infonetics.com/contact.asp.

RELATED REPORT EXCERPTS

RECENT AND UPCOMING MARKET FORECAST REPORTS AND SURVEYS

Download Infonetics’ 2014 market research brochure, publication calendar, events brochure, report highlights, tables of contents, and more at http://www.infonetics.com/login.

INFONETICS WEBINARS

Visit https://www.infonetics.com/infonetics-events to register for upcoming webinars, view recent webinars on demand, or learn about sponsoring a webinar.

  • NFV: An Easier Initial Target Than SDN? (June 19: Attend)
  • Unlocking Revenues with Carrier Ethernet 2.0 Wholesale E-Access (View on-demand)
  • NFV: The Nitty Gritty (View on-demand)
  • Virtualizing Networks with SDN NVOs and Bare Metal Switches (View on-demand)
  • Making Your Network Run Hotter With SDN (Sponsor)
  • The Role of NFV in Mobile Networks (Sponsor)

TO BUY REPORTS, CONTACT:

N. America (West), Asia Pacific: Larry Howard [email protected] +1 408-583-3335

N.A. (East, Midwest), L. America, EMEA: Scott Coyne [email protected] +1 408-583-3395

Greater China, SE Asia, India: 大中华区 Jeffrey Song [email protected] +86 21-3919-8505

Japan 日本 Takashi Kimura, TAK Analytics [email protected] +81 3-6408-5566

South Korea 대한민국 Doug Moon, MBAP [email protected], +82 2-3453-9400

ABOUT INFONETICS

Infonetics Research (www.infonetics.com) is an international market research and consulting firm serving the communications industry since 1990. A leader in defining and tracking emerging and established technologies in all world regions, Infonetics helps clients plan, strategize, and compete effectively. View Infonetics’ About Us slides at http://bit.ly/QUrbrV.

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