Welcome!

News Feed Item

Intel Re-architects the Fundamental Building Block for High-Performance Computing

INTERNATIONAL SUPERCOMPUTING CONFERENCE (ISC) – Intel Corporation today announced new details for its next-generation Intel® Xeon Phi™ processors, code-named Knights Landing, which promise to extend the benefits of code modernization investments being made for current generation products. These include a new high-speed fabric that will be integrated on-package and high-bandwidth, on-package memory that combined, promise to accelerate the rate of scientific discovery. Currently memory and fabrics are available as discrete components in servers limiting the performance and density of supercomputers.

The new interconnect technology, called Intel® Omni Scale Fabric, is designed to address the requirements of the next generations of high-performance computing (HPC). Intel Omni Scale Fabric will be integrated in the next generation of Intel Xeon Phi processors as well as future general-purpose Intel® Xeon® processors. This integration along with the fabric’s HPC-optimized architecture is designed to address the performance, scalability, reliability, power and density requirements of future HPC deployments. It is designed to balance price and performance for entry-level through extreme-scale deployments.

“Intel is re-architecting the fundamental building block of HPC systems by integrating the Intel Omni Scale Fabric into Knights Landing, marking a significant inflection and milestone for the HPC industry,” said Charles Wuischpard, vice president and general manager of Workstations and HPC at Intel. “Knights Landing will be the first true many-core processor to address today’s memory and I/O performance challenges. It will allow programmers to leverage existing code and standard programming models to achieve significant performance gains on a wide set of applications. Its platform design, programming model and balanced performance makes it the first viable step towards exascale.”

Knights Landing – Unmatched Integration

Knights Landing will be available as a standalone processor mounted directly on the motherboard socket in addition to the PCIe-based card option. The socketed option removes programming complexities and bandwidth bottlenecks of data transfer over PCIe, common in GPU and accelerator solutions. Knights Landing will include up to 16GB high-bandwidth, on-package memory at launch – designed in partnership with Micron* – to deliver five times better bandwidth compared to DDR4 memory1, five times better energy efficiency2 and three times more density2 than current GDDR-based memory. When combined with integrated Intel Omni Scale Fabric, the new memory solution will allow Knights Landing to be installed as an independent compute building block, saving space and energy by reducing the number of components.

Powered by more than 60 HPC-enhanced Silvermont architecture-based cores, Knights Landing is expected to deliver more than 3 TFLOPS of double-precision performance3 and three times the single-threaded performance4 compared with the current generation. As a standalone server processor, Knights Landing will support DDR4 system memory comparable in capacity and bandwidth to Intel Xeon processor-based platforms, enabling applications that have a much larger memory footprint. Knights Landing will be binary-compatible with Intel Xeon processors5, making it easy for software developers to reuse the wealth of existing code.

For customers preferring discrete components and a fast upgrade path without needing to upgrade other system components, both Knights Landing and Intel Omni Scale Fabric controllers will be available as separate PCIe-based add-on cards. There is application compatibility between currently available Intel® True Scale Fabric and future Intel Omni Scale Fabric, so customers can transition to new fabric technology without change to their applications. For customers purchasing Intel True Scale Fabric today, Intel will offer a program to upgrade to Intel Omni Scale Fabric when it’s available.

Knights Landing processors are scheduled to power HPC systems in the second half of 2015. For instance, in April the National Energy Research Scientific Computing Center (NERSC) announced an HPC installation planned for 2016, serving more than 5,000 users and over 700 extreme-scale science projects.

“We are excited about our partnership with Cray and Intel to develop NERSC's next supercomputer ‘Cori,’” said Dr. Sudip Dosanjh, NERSC Director, Lawrence Berkeley National Laboratory. “Cori will consist of over 9,300 Intel Knights Landing processors and will serve as an on-ramp to exascale for our users through an accessible programming model. Our codes, which are often memory-bandwidth limited, will also greatly benefit from Knights Landing's high speed on package memory. We look forward to enabling new science that cannot be done on today's supercomputers.”

New Fabric, New Speeds with Intel Omni Scale Fabric

Intel Omni Scale fabric is built upon a combination of enhanced acquired IP from Cray and QLogic, and Intel’s own in-house innovations. It will include a full product line offering consisting of adapters, edge switches, director switch systems, and open-source fabric management and software tools. Additionally, traditional electrical transceivers in the director switches in today’s fabrics will be replaced by Intel® Silicon Photonics-based solutions, enabling increased port density, simplified cabling and reduced costs6. Intel Silicon Photonics-based cabling and transceiver solutions may also be used with Intel Omni Scale-based processors, adapter cards and edge switches.

Intel Supercomputing Momentum Continues

The current generation of Intel Xeon processors and Intel Xeon Phi coprocessors powers the top-rated system in the world – the 35 PFLOPS “Milky Way 2” in China. Intel Xeon Phi coprocessors are also available in more than 200 OEM designs worldwide.

Intel-based systems account for 85 percent of all supercomputers on the 43rd edition of the TOP500 list announced today and 97 percent of all new additions. Within 18 months after the introduction of Intel’s first many-core architecture products, Intel Xeon Phi coprocessor-based systems already make up 18 percent of the aggregated performance of all TOP500 supercomputers. The complete TOP500 list is available at www.top500.org.

To help optimize applications for many-core processing, Intel has also established more than 30 Intel Parallel Computing Centers (IPCC) in cooperation with universities and research facilities around the world. Today’s parallel optimization investment with the Intel Xeon Phi coprocessor will carry forward to Knights Landing, as optimizations using standards-based, common programming languages persist with a recompile. Incremental tuning gains will be available to take advantage of innovative new functionality.

About Intel

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. As a leader in corporate responsibility and sustainability, Intel also manufactures the world’s first commercially available “conflict-free” microprocessors. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com, and about Intel’s conflict-free efforts at conflictfree.intel.com.

Copyright © 2014, Intel Corporation

Intel, Xeon, Intel Xeon Phi, Intel Atom and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or other countries.

*Other brands and names may be claimed as the property of others.

All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.

Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2®, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products.

Results have been measured by Intel based on software, benchmark or other data of third parties and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. Intel does not control or audit the design or implementation of third party data referenced in this document. Intel encourages all of its customers to visit the websites of the referenced third parties or other sources to confirm whether the referenced data is accurate and reflects performance of systems available for purchase”

1 Projected result based on internal Intel analysis of STREAM benchmark using a Knights Landing processor with 16GB of high-bandwidth versus DDR4 memory only with all channels populated

2 Projected results based on internal Intel analysis of Knights Landing’s on-package memory MCDRAM vs Knights Corner’s GDDR5 memory

3 Internal and preliminary projections of theoretical double-precision performance measured by Linpack. Based on current expectations of Knights Landing’s cores, clock frequency and floating point operations per cycle.

4. Projected peak theoretical single-thread performance relative to 1st Generation Intel® Xeon Phi™ Coprocessor 7120P (formerly code-named Knights Corner)

5 Binary Compatible with Intel Xeon processors using Haswell Instruction Set (except TSX - Transactional Synchronization Extensions)

6 The TCO or other cost reduction scenarios described in this document are intended to enable you to get a better understanding of how the purchase of a given Intel product, combined with a number of situation-specific variables, might affect your future cost and savings. Circumstances will vary and there may be unaccounted-for costs related to the use and deployment of a given product. Nothing in this document should be interpreted as either a promise of or contract for a given level of costs.”

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
Enterprise IT has been in the era of Hybrid Cloud for some time now. But it seems most conversations about Hybrid are focused on integrating AWS, Microsoft Azure, or Google ECM into existing on-premises systems. Where is all the Private Cloud? What do technology providers need to do to make their offerings more compelling? How should enterprise IT executives and buyers define their focus, needs, and roadmap, and communicate that clearly to the providers?
"We are an all-flash array storage provider but our focus has been on VM-aware storage specifically for virtualized applications," stated Dhiraj Sehgal of Tintri in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
"We are a leader in the market space called network visibility solutions - it enables monitoring tools and Big Data analysis to access the data and be able to see the performance," explained Shay Morag, VP of Sales and Marketing at Niagara Networks, in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
According to Forrester Research, every business will become either a digital predator or digital prey by 2020. To avoid demise, organizations must rapidly create new sources of value in their end-to-end customer experiences. True digital predators also must break down information and process silos and extend digital transformation initiatives to empower employees with the digital resources needed to win, serve, and retain customers.
Amazon has gradually rolled out parts of its IoT offerings in the last year, but these are just the tip of the iceberg. In addition to optimizing their back-end AWS offerings, Amazon is laying the ground work to be a major force in IoT – especially in the connected home and office. Amazon is extending its reach by building on its dominant Cloud IoT platform, its Dash Button strategy, recently announced Replenishment Services, the Echo/Alexa voice recognition control platform, the 6-7 strategic...
Organizations planning enterprise data center consolidation and modernization projects are faced with a challenging, costly reality. Requirements to deploy modern, cloud-native applications simultaneously with traditional client/server applications are almost impossible to achieve with hardware-centric enterprise infrastructure. Compute and network infrastructure are fast moving down a software-defined path, but storage has been a laggard. Until now.
We're entering the post-smartphone era, where wearable gadgets from watches and fitness bands to glasses and health aids will power the next technological revolution. With mass adoption of wearable devices comes a new data ecosystem that must be protected. Wearables open new pathways that facilitate the tracking, sharing and storing of consumers’ personal health, location and daily activity data. Consumers have some idea of the data these devices capture, but most don’t realize how revealing and...
IoT solutions exploit operational data generated by Internet-connected smart “things” for the purpose of gaining operational insight and producing “better outcomes” (for example, create new business models, eliminate unscheduled maintenance, etc.). The explosive proliferation of IoT solutions will result in an exponential growth in the volume of IoT data, precipitating significant Information Governance issues: who owns the IoT data, what are the rights/duties of IoT solutions adopters towards t...
Get deep visibility into the performance of your databases and expert advice for performance optimization and tuning. You can't get application performance without database performance. Give everyone on the team a comprehensive view of how every aspect of the system affects performance across SQL database operations, host server and OS, virtualization resources and storage I/O. Quickly find bottlenecks and troubleshoot complex problems.
Whether your IoT service is connecting cars, homes, appliances, wearable, cameras or other devices, one question hangs in the balance – how do you actually make money from this service? The ability to turn your IoT service into profit requires the ability to create a monetization strategy that is flexible, scalable and working for you in real-time. It must be a transparent, smoothly implemented strategy that all stakeholders – from customers to the board – will be able to understand and comprehe...
Between 2005 and 2020, data volumes will grow by a factor of 300 – enough data to stack CDs from the earth to the moon 162 times. This has come to be known as the ‘big data’ phenomenon. Unfortunately, traditional approaches to handling, storing and analyzing data aren’t adequate at this scale: they’re too costly, slow and physically cumbersome to keep up. Fortunately, in response a new breed of technology has emerged that is cheaper, faster and more scalable. Yet, in meeting these new needs they...
Complete Internet of Things (IoT) embedded device security is not just about the device but involves the entire product’s identity, data and control integrity, and services traversing the cloud. A device can no longer be looked at as an island; it is a part of a system. In fact, given the cross-domain interactions enabled by IoT it could be a part of many systems. Also, depending on where the device is deployed, for example, in the office building versus a factory floor or oil field, security ha...
When it comes to cloud computing, the ability to turn massive amounts of compute cores on and off on demand sounds attractive to IT staff, who need to manage peaks and valleys in user activity. With cloud bursting, the majority of the data can stay on premises while tapping into compute from public cloud providers, reducing risk and minimizing need to move large files. In his session at 18th Cloud Expo, Scott Jeschonek, Director of Product Management at Avere Systems, discussed the IT and busin...
An IoT product’s log files speak volumes about what’s happening with your products in the field, pinpointing current and potential issues, and enabling you to predict failures and save millions of dollars in inventory. But until recently, no one knew how to listen. In his session at @ThingsExpo, Dan Gettens, Chief Research Officer at OnProcess, discussed recent research by Massachusetts Institute of Technology and OnProcess Technology, where MIT created a new, breakthrough analytics model for s...
"We are the public cloud providers. We are currently providing 50% of the resources they need for doing e-commerce business in China and we are hosting about 60% of mobile gaming in China," explained Yi Zheng, CPO and VP of Engineering at CDS Global Cloud, in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.