|By Business Wire||
|June 26, 2014 06:44 PM EDT||
The Wireless Innovation Forum, a non-profit international industry association dedicated to driving the future of radio communications and systems worldwide, today announced the dates for a preview of changes included in the much anticipated SCA 4.1 Standard. The event, held in cooperation with the Joint Tactical Networking Center (JTNC), will occur in the Washington, DC area following MILCOM on 9-10 October 2014. More event details will be announced later this summer.
The Forum’s Coordinating Committee on International SCA Standards has been working as public liaison for the JTNC to provide input on remedying issues with SCA 4.0 through production of SCA 4.1 since the November 2013 kick-off workshop (http://groups.winnforum.org/p/cm/ld/fid=403). Working groups within the Committee have produced several documents currently up for vote including:
SCA 4.1 Scalable Components
- This document has been prepared by the Forum's SCA 4.1 Backwards Compatibility Task group to propose changes to the SCAv4.0.1 specification to add support for component scalability. This will allow component developers to choose whether or not to implement some of the standard sub-component interface. The scalability will also be used to support the different profiles of the specification.
SCA 4.1 Scalable Manager Components
- This document has been prepared by the Forum's SCA 4.1 Backwards Compatibility Task group to propose changes to the SCAv4.0.1 specification to add support for scalability of the manager components. This will allow developers to choose whether or not to implement all of the manager interfaces. The manager scalability will also be used to support the different profiles of the specification.
SCA 4.1 Naming Conventions
- This document has been prepared by the Forum's SCA 4.1 Backwards Compatibility Task group to propose changes to the SCAv4.0.1 specification to use a naming convention for the names of the interfaces and components. The goal is to improve readability of the next release of the specification
SCA 4.1 Application Backwards Compatibility
- This document package has been prepared by the SCAv4.1 Backwards Compatibility Task Group to provide comments to the JTNC on the modifications to SCA v4.0 necessary to support backwards compatibility with SCA v2.2.2.
SCA 4.1 AEP Specification
- This document has been prepared by the SCAv4.1 AEP Improvements Task Group to define POSIX AEPs for interaction between SDR Applications and OE in resource constrained environments. Two Base AEPs functions groups, the Lightweight (Lw) and the Ultra-Lightweight (ULw), are defined, with functions Groups A and B being possibly added as support features. The documents contains normative content for Base AEPs functions groups and the additional functions groups, plus support sections giving SCA-like contents overview tables and detailed rationale for the design choices. The specification is a converged solution elaborated between developers who worked to generate a unified content leveraging previous achievements in this area from JTNC Standards and ESSOR.
SCA 4.1 Application Mixture Backwards Compatibility
- This document proposes changes to the next SCA specification to increase the level of backwards compatibility via an optional unit of functionality (UOF) to support applications composed of a mixture of SCA 4 and SCA 2.2.2 components. This will allow developers to perform a more incremental transition from SCA 2.2.2 to SCA 4.
Additional project ballots coming up for vote in the near future, include: SCA 4.1 Platform Component Late Registration Committee Ballot and SCA 4.1 IDL Profile Specification Committee Ballot. These documents will be delivered by the WInnForum to the JTNC once all comments received during balloting are resolved and balloting completes.
More information about the Coordinating Committee on International SCA Standards can be found here: http://groups.winnforum.org/SCA_Committee.
Wireless Innovation Forum member representatives have initiated and led multiple work efforts that promote their organization’s specific objectives through the creation of reports, recommendations and specifications that are widely used by the advanced wireless community. The importance of these "work products" is reflected in the fact that over 22,000 individual documents were downloaded from the Forum’s Work Products document library in 2013 alone.
Supported by platinum Sponsor Selex ES, and Media Sponsor Thales, WInnForum has several working groups focusing on projects related to SCA and Spectrum Innovation. Visit http://www.WirelessInnovation.org to learn more. Individuals or organizations wishing to participate in WInnForum Working Groups should contact Lee Pucker at [email protected].
About the Wireless Innovation Forum
Established in 1996, The Wireless Innovation Forum (SDR Forum Version 2.0) is a non-profit mutual benefit corporation dedicated to advocating for spectrum innovation, and advancing radio technologies that support essential or critical communications worldwide. Members bring a broad base of experience in Software Defined Radio (SDR), Cognitive Radio(CR) and Dynamic Spectrum Access (DSA) technologies in diverse markets and at all levels of the wireless value chain to address emerging wireless communications requirements. To learn more about The Wireless Innovation Forum, its meetings and membership benefits, visit www.WirelessInnovation.org.
Mar. 23, 2017 07:15 PM EDT Reads: 4,236
Mar. 23, 2017 06:00 PM EDT Reads: 1,250
Mar. 23, 2017 04:15 PM EDT Reads: 2,416
Mar. 23, 2017 03:45 PM EDT Reads: 582
Mar. 23, 2017 03:45 PM EDT Reads: 1,724
Mar. 23, 2017 03:30 PM EDT Reads: 1,676
Mar. 23, 2017 03:30 PM EDT Reads: 1,569
Mar. 23, 2017 03:00 PM EDT Reads: 6,169
Mar. 23, 2017 02:30 PM EDT Reads: 2,349
Mar. 23, 2017 02:30 PM EDT Reads: 4,056
Mar. 23, 2017 02:30 PM EDT Reads: 1,421
Mar. 23, 2017 02:15 PM EDT Reads: 1,160
Mar. 23, 2017 01:00 PM EDT Reads: 2,096
Mar. 23, 2017 12:45 PM EDT Reads: 1,662
SYS-CON Events announced today that SoftLayer, an IBM Company, has been named “Gold Sponsor” of SYS-CON's 18th Cloud Expo, which will take place on June 7-9, 2016, at the Javits Center in New York, New York. SoftLayer, an IBM Company, provides cloud infrastructure as a service from a growing number of data centers and network points of presence around the world. SoftLayer’s customers range from Web startups to global enterprises.
Mar. 23, 2017 12:30 PM EDT Reads: 1,044