Welcome!

News Feed Item

Vishay Intertechnology to Showcase Latest Industry-Leading Technologies at 2014 CEF Summer Chengdu Show

Vishay Intertechnology, Inc. (NYSE: VSH) today announced its technology line-up for the 2014 CEF (China Electronics Fair) Summer Chengdu show, taking place July 10-12 at the Chengdu Century City New International Convention and Exhibition Center. In hall 3, booth A21A, the company will be highlighting its latest industry-leading innovations, including passive components, diodes, power MOSFETs, power ICs, and optoelectronics.

At the 2014 CEF, Vishay Siliconix will be showcasing TrenchFET® Gen IV MOSFETs with maximum on-resistance down to 0.00135 Ω at a 4.5 V gate drive; 500 V, 600 V, and 650 V E Series devices for increased efficiency; and low-profile, high-power- density AEC-Q101-qualified SQ Series MOSFETs in the PowerPAK® SO8L package. Highlighted power ICs will include 2.8 V to 5.5 V buck regulators offering over 93 % efficiency in less than 180 mm2; 4.5 V to 15 V microBUCK® regulators with ultrafast transient response; 3 V to 28 V regulators with integrated TrenchFET power MOSFETs; and high-density 70 A DrMOS power stages in 5 mm by 5 mm dual-sided cooled packages.

For automotive, commercial, and telecom applications, Vishay will be highlighting diodes in a variety of low-profile packages, including 45 V to 120 V TMBS® Trench MOS Barrier Schottky rectifiers in the SMPA (DO-221BC) and SMPD (TO-263AC) packages, and FRED Pt® ultrafast recovery rectifiers in the SlimSMA (DO-221AC) and SMF (DO-219AB) packages. In addition, power modules in the EMIPAK-2B package featuring solderless pressfit technology will be on display. Vishay will also be featuring optoelectronics products such as white high-brightness, high-power LED modules; high-brightness 0402 and 0603 ChipLEDs; SMD LEDs in the PLCC2 package; and fully integrated proximity and ambient light sensors.

Passive components from Vishay will consist of a wide variety of the company’s latest capacitors and resistors. Highlighted resistors will include Vishay Dale Power Metal Strip® battery shunt resistors with molded enclosures; Vishay Draloric AEC-Q200-qualified thick film chip resistors with long side terminations and enhanced thermo cycling; the Vishay Sfernice massive electro-pyrotechnic initiator chip (MEPIC) resistor for airbags and fireworks, and AEC-Q200-qualified surface-mount thick film power resistors for DC-link applications; Vishay Dale Thin Film chip resistors and dividers with ratio tolerances as tight as 0.01 %; and Vishay MCB’s water cooled wirewound resistor.

Featured capacitors will include Vishay Vitramon AEC-Q200-qualified multilayer ceramic chip capacitors (MLCCs) with high operating temperatures to +150 °C; Vishay Sprague high-temperature solid tantalum surface-mount capacitors and AEC-Q200-qualified devices in small case sizes down to 0603; Vishay BCcomponents surface-mount aluminum capacitors with useful life up to 6,000 hours and ceramic disc safety capacitors for automotive applications; Vishay ESTA power electronic capacitors; and Vishay Roederstein polypropylene film capacitors for DC-link applications.

In addition, Vishay will be offering two demonstrations in its booth at the 2014 CEF. Vishay Siliconix will be demonstrating its SiHP22N60E 600 V E Series n-channel power MOSFET. Vishay Semiconductors will be providing a demonstration of its gesture control sensor board, which consists of the VCNL4020 proximity sensor and two VSMF2890RGX01 infrared emitters.

CEF is the leading and most comprehensive exhibition of the electronics and information industry in West China. More information is available at http://chengdu.icef.com.cn/ShowBuss.aspx?atrid=6703&listId=2805.

Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world’s largest manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and "one-stop shop" service have made it a global industry leader. Vishay can be found on the Internet at www.vishay.com.

Power Metal Strip, TMBS, and FRED Pt are registered trademarks of Vishay Intertechnology. PowerPAK, microBUCK, and TrenchFET are trademarks of Siliconix incorporated.

Vishay on Facebook: http://www.facebook.com/VishayIntertechnology
Vishay Twitter feed: http://twitter.com/vishayindust

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
Everything run by electricity will eventually be connected to the Internet. Get ahead of the Internet of Things revolution. In his session at @ThingsExpo, Akvelon expert and IoT industry leader Sergey Grebnov provided an educational dive into the world of managing your home, workplace and all the devices they contain with the power of machine-based AI and intelligent Bot services for a completely streamlined experience.
"This week we're really focusing on scalability, asset preservation and how do you back up to the cloud and in the cloud with object storage, which is really a new way of attacking dealing with your file, your blocked data, where you put it and how you access it," stated Jeff Greenwald, Senior Director of Market Development at HGST, in this SYS-CON.tv interview at 18th Cloud Expo, held June 7-9, 2016, at the Javits Center in New York City, NY.
"Venafi has a platform that allows you to manage, centralize and automate the complete life cycle of keys and certificates within the organization," explained Gina Osmond, Sr. Field Marketing Manager at Venafi, in this SYS-CON.tv interview at DevOps at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
Creating replica copies to tolerate a certain number of failures is easy, but very expensive at cloud-scale. Conventional RAID has lower overhead, but it is limited in the number of failures it can tolerate. And the management is like herding cats (overseeing capacity, rebuilds, migrations, and degraded performance). In his general session at 18th Cloud Expo, Scott Cleland, Senior Director of Product Marketing for the HGST Cloud Infrastructure Business Unit, discussed how a new approach is neces...
Cloud-enabled transformation has evolved from cost saving measure to business innovation strategy -- one that combines the cloud with cognitive capabilities to drive market disruption. Learn how you can achieve the insight and agility you need to gain a competitive advantage. Industry-acclaimed CTO and cloud expert, Shankar Kalyana presents. Only the most exceptional IBMers are appointed with the rare distinction of IBM Fellow, the highest technical honor in the company. Shankar has also receive...
"We're developing a software that is based on the cloud environment and we are providing those services to corporations and the general public," explained Seungmin Kim, CEO/CTO of SM Systems Inc., in this SYS-CON.tv interview at 21st Cloud Expo, held Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA.
Business professionals no longer wonder if they'll migrate to the cloud; it's now a matter of when. The cloud environment has proved to be a major force in transitioning to an agile business model that enables quick decisions and fast implementation that solidify customer relationships. And when the cloud is combined with the power of cognitive computing, it drives innovation and transformation that achieves astounding competitive advantage.
Leading companies, from the Global Fortune 500 to the smallest companies, are adopting hybrid cloud as the path to business advantage. Hybrid cloud depends on cloud services and on-premises infrastructure working in unison. Successful implementations require new levels of data mobility, enabled by an automated and seamless flow across on-premises and cloud resources. In his general session at 21st Cloud Expo, Greg Tevis, an IBM Storage Software Technical Strategist and Customer Solution Architec...
Personalization has long been the holy grail of marketing. Simply stated, communicate the most relevant offer to the right person and you will increase sales. To achieve this, you must understand the individual. Consequently, digital marketers developed many ways to gather and leverage customer information to deliver targeted experiences. In his session at @ThingsExpo, Lou Casal, Founder and Principal Consultant at Practicala, discussed how the Internet of Things (IoT) has accelerated our abilit...
In his session at Cloud Expo, Alan Winters, U.S. Head of Business Development at MobiDev, presented a success story of an entrepreneur who has both suffered through and benefited from offshore development across multiple businesses: The smart choice, or how to select the right offshore development partner Warning signs, or how to minimize chances of making the wrong choice Collaboration, or how to establish the most effective work processes Budget control, or how to maximize project result...
Five years ago development was seen as a dead-end career, now it’s anything but – with an explosion in mobile and IoT initiatives increasing the demand for skilled engineers. But apart from having a ready supply of great coders, what constitutes true ‘DevOps Royalty’? It’ll be the ability to craft resilient architectures, supportability, security everywhere across the software lifecycle. In his keynote at @DevOpsSummit at 20th Cloud Expo, Jeffrey Scheaffer, GM and SVP, Continuous Delivery Busine...
To get the most out of their data, successful companies are not focusing on queries and data lakes, they are actively integrating analytics into their operations with a data-first application development approach. Real-time adjustments to improve revenues, reduce costs, or mitigate risk rely on applications that minimize latency on a variety of data sources. In his session at @BigDataExpo, Jack Norris, Senior Vice President, Data and Applications at MapR Technologies, reviewed best practices to ...
"Software-defined storage is a big problem in this industry because so many people have different definitions as they see fit to use it," stated Peter McCallum, VP of Datacenter Solutions at FalconStor Software, in this SYS-CON.tv interview at 18th Cloud Expo, held June 7-9, 2016, at the Javits Center in New York City, NY.
Data is the fuel that drives the machine learning algorithmic engines and ultimately provides the business value. In his session at Cloud Expo, Ed Featherston, a director and senior enterprise architect at Collaborative Consulting, discussed the key considerations around quality, volume, timeliness, and pedigree that must be dealt with in order to properly fuel that engine.
"Our strategy is to focus on the hyperscale providers - AWS, Azure, and Google. Over the last year we saw that a lot of developers need to learn how to do their job in the cloud and we see this DevOps movement that we are catering to with our content," stated Alessandro Fasan, Head of Global Sales at Cloud Academy, in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.