|By Business Wire||
|July 6, 2014 08:00 PM EDT||
USHIO INC. (TOKYO:6925) (President and CEO: Shiro Sugata) today announced that at SEMICON West 2014 (Booth #2105) the company will exhibit a series of its lithography tools for advanced packaging applications, including the UX7-3Di LIS 350 stepper for 3D/2.5D silicon interposers, through a panel display as well as propose solutions for the challenges of next-generation packaging applications. SEMICON West 2014 is being held on July 8 through July 10 at Moscone Center in San Francisco, California.
Today, 3D packaging applications that use through-silicon via (TSV) and 2.5D/2.1D packaging applications have been spotlighted as the emerging technologies for higher integration of semiconductor devices. Maintaining an optimum balance between technologies and cost for volume production has become one of major challenges for these next-generation packaging applications. In order to provide the best solution for this challenge, USHIO’s UX7-3Di LIS 350 stepper for 3D/2.5D silicon interposers achieves significant cost reduction with its unparalleled performance including single-shot exposure of large substrate areas, high throughput, and high resolution of 2 µm L/S (Line and Space).
In addition, USHIO will exhibit the Square 70 panel stepper for organic and glass interposers for further enhancement of productivity with a large shot size of 78 mm x 68 mm; the Align 600 maskless scanner for fan-out WLP enabling alignment at 600 points to achieve high yield; and the UX4 series full-field projection aligners for LED, MEMS device, and power device applications. In addition to these lithography tools, USHIO is introducing its next-generation packaging solution that leverages a large-field precision projection lens (currently under development) which can produce a super-high resolution of 1 µm L/S.
“The next-generation packaging technologies have been spotlighted as the demand for smartphones and tablet PCs has been skyrocketing. To meet such demanding needs, we have leased and installed a projection aligner dedicated to developing 2.5D glass interposers at the Georgia Tech 3D Systems Packaging Research Center (GT-PRC) in Georgia Institute of Technology by dispatching an engineer. We have aimed at achieving large-area patterning with the target resolution of 1 through 5 µm L/S, and will show some good results at SEMICON West 2014,” commented Masayuki Itaba, General Manager of the Exposure Business Unit, USHIO INC.
USHIO believes that it will be able to provide optimum solutions for the challenges faced by users by integrating its lithography technologies specializing in next-generation packaging applications. Please visit USHIO Booth #2105 at SEMICON West 2014 to confirm its solutions.
About USHIO INC.
Established in 1964, USHIO INC. (TOKYO:6925) is a leading manufacturer of light sources such as lamps, lasers, and LEDs, in a broad range from ultraviolet to visible to infrared rays, as well as optical equipment and cinema-related products that incorporate these light sources. It also makes products in the electronics field (such as semiconductors, flat panel displays and electronic components) and in the visual imaging field (including digital projectors and lighting). Many of these products enjoy dominant market shares. In recent years, USHIO has undertaken business in the life science area, such as the medical and the environmental fields. See http://www.ushio.co.jp/en/.
The product data sheet for USHIO’s products can be downloaded from
As data explodes in quantity, importance and from new sources, the need for managing and protecting data residing across physical, virtual, and cloud environments grow with it. Managing data includes protecting it, indexing and classifying it for true, long-term management, compliance and E-Discovery. Commvault can ensure this with a single pane of glass solution – whether in a private cloud, a Service Provider delivered public cloud or a hybrid cloud environment – across the heterogeneous enter...
Dec. 8, 2016 05:00 PM EST Reads: 1,806
You have great SaaS business app ideas. You want to turn your idea quickly into a functional and engaging proof of concept. You need to be able to modify it to meet customers' needs, and you need to deliver a complete and secure SaaS application. How could you achieve all the above and yet avoid unforeseen IT requirements that add unnecessary cost and complexity? You also want your app to be responsive in any device at any time. In his session at 19th Cloud Expo, Mark Allen, General Manager of...
Dec. 8, 2016 04:45 PM EST Reads: 1,832
Financial Technology has become a topic of intense interest throughout the cloud developer and enterprise IT communities. Accordingly, attendees at the upcoming 20th Cloud Expo at the Javits Center in New York, June 6-8, 2017, will find fresh new content in a new track called FinTech.
Dec. 8, 2016 04:45 PM EST Reads: 2,242
@DevOpsSummit taking place June 6-8, 2017 at Javits Center, New York City, is co-located with the 20th International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. @DevOpsSummit at Cloud Expo New York Call for Papers is now open.
Dec. 8, 2016 04:30 PM EST Reads: 1,959
"We are a leader in the market space called network visibility solutions - it enables monitoring tools and Big Data analysis to access the data and be able to see the performance," explained Shay Morag, VP of Sales and Marketing at Niagara Networks, in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
Dec. 8, 2016 04:30 PM EST Reads: 334
The 20th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held June 6-8, 2017, at the Javits Center in New York City, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Containers, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportunity. Submit your speaking proposal ...
Dec. 8, 2016 04:15 PM EST Reads: 2,307
Keeping pace with advancements in software delivery processes and tooling is taxing even for the most proficient organizations. Point tools, platforms, open source and the increasing adoption of private and public cloud services requires strong engineering rigor - all in the face of developer demands to use the tools of choice. As Agile has settled in as a mainstream practice, now DevOps has emerged as the next wave to improve software delivery speed and output. To make DevOps work, organization...
Dec. 8, 2016 04:15 PM EST Reads: 257
"We are a modern development application platform and we have a suite of products that allow you to application release automation, we do version control, and we do application life cycle management," explained Flint Brenton, CEO of CollabNet, in this SYS-CON.tv interview at DevOps at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
Dec. 8, 2016 04:00 PM EST Reads: 1,073
Amazon has gradually rolled out parts of its IoT offerings in the last year, but these are just the tip of the iceberg. In addition to optimizing their back-end AWS offerings, Amazon is laying the ground work to be a major force in IoT – especially in the connected home and office. Amazon is extending its reach by building on its dominant Cloud IoT platform, its Dash Button strategy, recently announced Replenishment Services, the Echo/Alexa voice recognition control platform, the 6-7 strategic...
Dec. 8, 2016 03:48 PM EST Reads: 251
Regulatory requirements exist to promote the controlled sharing of information, while protecting the privacy and/or security of the information. Regulations for each type of information have their own set of rules, policies, and guidelines. Cloud Service Providers (CSP) are faced with increasing demand for services at decreasing prices. Demonstrating and maintaining compliance with regulations is a nontrivial task and doing so against numerous sets of regulatory requirements can be daunting task...
Dec. 8, 2016 03:45 PM EST Reads: 1,075
Bert Loomis was a visionary. This general session will highlight how Bert Loomis and people like him inspire us to build great things with small inventions. In their general session at 19th Cloud Expo, Harold Hannon, Architect at IBM Bluemix, and Michael O'Neill, Strategic Business Development at Nvidia, discussed the accelerating pace of AI development and how IBM Cloud and NVIDIA are partnering to bring AI capabilities to "every day," on-demand. They also reviewed two "free infrastructure" pr...
Dec. 8, 2016 03:30 PM EST Reads: 1,215
"This is specifically designed to accommodate some of the needs for high availability and failover in a network managed system for the major Korean corporations," stated Thomas Masters, Managing Director at InfranicsUSA, in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
Dec. 8, 2016 03:15 PM EST Reads: 295
Unsecured IoT devices were used to launch crippling DDOS attacks in October 2016, targeting services such as Twitter, Spotify, and GitHub. Subsequent testimony to Congress about potential attacks on office buildings, schools, and hospitals raised the possibility for the IoT to harm and even kill people. What should be done? Does the government need to intervene? This panel at @ThingExpo New York brings together leading IoT and security experts to discuss this very serious topic.
Dec. 8, 2016 03:00 PM EST Reads: 513
More and more brands have jumped on the IoT bandwagon. We have an excess of wearables – activity trackers, smartwatches, smart glasses and sneakers, and more that track seemingly endless datapoints. However, most consumers have no idea what “IoT” means. Creating more wearables that track data shouldn't be the aim of brands; delivering meaningful, tangible relevance to their users should be. We're in a period in which the IoT pendulum is still swinging. Initially, it swung toward "smart for smar...
Dec. 8, 2016 02:30 PM EST Reads: 918
CloudJumper, a Workspace as a Service (WaaS) platform innovator for agile business IT, has been recognized with the Customer Value Leadership Award for its nWorkSpace platform by Frost & Sullivan. The company was also featured in a new report(1) by the industry research firm titled, “Desktop-as-a-Service Buyer’s Guide, 2016,” which provides a comprehensive comparison of DaaS providers, including CloudJumper, Amazon, VMware, and Microsoft.
Dec. 8, 2016 02:30 PM EST Reads: 972