Welcome!

News Feed Item

TANAKA and MEMS CORE Conclude Joint Development Agreement and Commit to Technology Alliance



Building a mounting center for MEMS patterning using low-temperature bonding material utilizing gold particles; Contributing to acceleration of development of MEMS technology by building fab functions from prototyping to implementation of MEMS materials

The appearance of AuRoFUSE(TM) sealing frames (200 micrometers wide) printed on an 8-inch wafer
Tokyo, July 29, 2014 - (ACN Newswire) - Tanaka Holdings Co., Ltd. (a company of Tanaka Precious Metals) announced today that Tanaka Kikinzoku Kogyo K.K., which operates the Tanaka Precious Metals Group's manufacturing business, and MEMS CORE Co., Ltd. ("MEMS CORE") have concluded a joint development agreement and committed to a technology alliance for pattern formation technology used in MEMS (microelectromechanical systems) devices using submicron-sized (one ten-thousandth of a millimeter) gold particles developed by Tanaka Kikinzoku Kogyo. Based on this, Tanaka Kikinzoku Kogyo will transfer originally-owned submicron gold particle patterning technology and equipment to MEMS CORE, which will subsequently begin manufacturing pattern prototypes using submicron gold particles and undertaking sealing for MEMS manufacturers on November 1.

By receiving the transfer of gold particle patterning technology from Tanaka Kikinzoku Kogyo, MEMS CORE will obtain process technology forming the basis of gold particle sealing, and make its MEMS device technology and products more competitive by promoting joint development projects with Tanaka Kikinzoku Kogyo in the future. Furthermore, Tanaka Kikinzoku Kogyo aims to provide increased added value to products by choosing the provision of gold particle materials as its area of operations, and concentrating on the modification and development of materials. The two companies' joint development organization will enable the creation of a mounting center for fab (manufacturing facility) functions in MEMS development and the consistent provision of products from material development to device mounting for MEMS manufacturers in the future.

The creation of this business model allows customers to concentrate on the development of their own products as well as improvement of productivity. At the same time, securing outsourcing contractors for prototyping and mounting leads to the reduction of the cost of ownership of new mounting facilities related to MEMS manufacturing for MEMS manufacturers experiencing increased costs of wafer level packaging (WLP) mounting due to increased device functionality. Furthermore, the rate of technological development is expected to increase in the MEMS market, which is expected to expand further in the future.

Transfer of gold particle sealing technology and equipment

In December 2009, Tanaka Kikinzoku Kogyo announced that sealing has been made possible with the application of heat and pressure using patterns of submicron gold particles with the wire width narrowed to 10 micrometers (one millionth of a meter) in patterning using photoresist(*1), and has provided MEMS manufacturers considering gold particle sealing with product samples and material prototypes, in addition to consulting implementation of technology at no cost. As a result, the practicality of gold particle sealing has been recognized, and demand for the material provision materials has increased among MEMS manufacturers. Meanwhile, MEMS utilizes diverse combination patterns and increasing in complexity due to the use of 3D patterns combining microscopic moving parts in addition to semiconductors such as large-scale integrated circuits (LSI) on silicon substrates. Because of this, foundries with development capabilities, equipment, and excellent processing technology unique to MEMS are required in development and the manufacturing of prototypes for supporting small lot production of a diverse range of products.

MEMS CORE, a venture company from Tohoku University (a leader in MEMS research), is a foundry which provides development support specializing in MEMS devices and other services. MEMS CORE conducts a broad range of entrusted design and development, in addition to prototyping and manufacturing through a research organization in conjunction with Tohoku University Professors Masayoshi Esashi and Shuji Tanaka. MEMS CORE has equipment for aspects spanning from the design to manufacturing of MEMS, as well as manufacturing capability supporting a variety of prototyping processes, supporting the individual development of products utilizing gold particle sealing in the future. MEMS CORE's abundant experience in MEMS research and development is what has ultimately led to this joint development and transfer of technology and equipment.

Product overview of submicron gold particle paste

In December 2013, Tanaka Kikinzoku Kogyo began providing technology for the batch formation of complex micropatterns on substrates by employing high definition screen printing using AuRoFUSE(TM) submicron gold particle paste. Vacuum performance, or high airtightness in sealing, affects quality in the manufacturing of MEMS materials. AuRoFUSE(TM) is a paste-type bonding material containing a mixture of gold particles within the particle diameter controlled to be submicron sized and an organic solvent. When the sealing frame is thermo-compressed (200 degrees Celsius, 100MPa), gold particle sintered compacts are strained, densified, and high-vacuum sealed(*2). Vacuum sealing using AuRoFUSE(TM) has the following characteristics.

-- It is possible to form prints of micropatterns on gold (Au) film of silicon wafers and substrates for high heat-resistant and low-resistivity electrode bonding and sealing frames with excellent level difference absorption.
-- The printed sealing frames can create airtight seals by densifying the structure with thermocompression bonding at 200 degrees Celsius.
-- Patterns can be formed using high-definition screen printing, and processing can be reduced because there is no need to combine multiple processes such as plating, deposition and sputtering as required in the past.
-- 8-inch wafer size patterns can be formed.
-- AuRoFUSE(TM) enables work to be performed with minimal material loss because it can withstand repeated printing. It is believed that this will enable the effective lowering of the cost of key processes.

Furthermore, AuRoFUSE(TM) is expected to be useful in die bonding (a flip chip bonding method(*3)) for high output LEDs, laser diodes, etc. because it is possible to bond at 200 degrees Celsius with no load after chip mounting in the paste form, and because it has high heat dissipation properties after bonding.

(*1) A technique for implementing etching on printed circuit boards and processing micropatterns by using a photosensitive solvent that changes chemical resistance when irradiated with light.
(*2) Achieved a helium leakage of 1.0-13 Pa m3/s. That means the leakage was such that the pressure of 1 m3 rose by 0.0000000000001 Pascal per second.
(*3) Flip chip bonding method
A bonding method for directly mounting semiconductor chips on printed circuit boards without using wire by using protruding terminals (bumps) to bond electrodes. High luminance efficiency can be realized by mounting high-output LEDs and ultraviolet LEDs with this method.

Press release: http://www.acnnewswire.com/clientreports/598/0729_EN.pdf


Tanaka Holdings Co., Ltd. (Holding company of Tanaka Precious Metals)

Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Akira Tanae, President & CEO
Founded: 1885
Incorporated: 1918
Capital: 500 million yen
Employees in consolidated group: 3,895 (FY2012)
Net sales of consolidated group: 839.2 billion yen (FY2012)
Main businesses of the group: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
Website: http://www.tanaka.co.jp/english (Tanaka Precious Metals), http://pro.tanaka.co.jp/en (Industrial products)

Tanaka Kikinzoku Kogyo K.K.

Headquarters: 22F, Tokyo Building, 2-7-3 Marunouchi, Chiyoda-ku, Tokyo
Representative: Akira Tanae, President & CEO
Founded: 1885
Incorporated: 1918
Capital: 500 million yen
Employees: 1,455 (FY2012)
Sales: 808.6 billion yen (FY2012)
Main businesses: Manufacture, sales, import and export of precious metals (platinum, gold, silver, and others) and various types of industrial precious metals products. Recycling and refining of precious metals.
Website: http://pro.tanaka.co.jp/en

About the Tanaka Precious Metals

Established in 1885, the Tanaka Precious Metals has built a diversified range of business activities focused on the use of precious metals. On April 1, 2010, the group was reorganized with Tanaka Holdings Co., Ltd. as the holding company (parent company) of the Tanaka Precious Metals. In addition to strengthening corporate governance, the company aims to improve overall service to customers by ensuring efficient management and dynamic execution of operations. Tanaka Precious Metals is committed, as a specialist corporate entity, to providing a diverse range of products through cooperation among group companies.

Tanaka Precious Metals is in the top class in Japan in terms of the volume of precious metal handled, and for many years the group has developed and stably supplied industrial precious metals, in addition to providing accessories and savings commodities utilizing precious metals. As precious metal professionals, the Group will continue to contribute to enriching people's lives in the future.

The eight core companies in the Tanaka Precious Metals are as follows.

- Tanaka Holdings Co., Ltd. (pure holding company)
- Tanaka Kikinzoku Kogyo K.K.
- Tanaka Kikinzoku Hanbai K.K.
- Tanaka Kikinzoku International K.K.
- Tanaka Denshi Kogyo K.K.
- Electroplating Engineers of Japan, Limited
- Tanaka Kikinzoku Jewelry K.K.
- Tanaka Kikinzoku Business Service K.K.
.
MEMS CORE Co., Ltd.

Head office: 3-11-1 Akedori, Izumi-ku, Sendai-shi, Miyagi
Representative: Koji Homma, President
Established: 2001
Capital: 60 million yen
Employees: 25 (As of March 2013)
Sales: 300 million yen (2012)
Business lines: MEMS design, development, prototyping and manufacture, MEMS entrusted development services
Website: http://www.mems-core.com

Press inquiries
Global Sales Dept., Tanaka Kikinzoku International K.K. (TKI)
https://www.tanaka.co.jp/support/req/ks_contact_e/index.html

Source: Tanaka Holdings Co., Ltd.

Copyright 2014 ACN Newswire. All rights reserved.

More Stories By ACN Newswire

Copyright 2008 ACN Newswire. All rights reserved. Republication or redistribution of ACN Newswire content is expressly prohibited without the prior written consent of ACN Newswire. ACN Newswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
"IoT is going to be a huge industry with a lot of value for end users, for industries, for consumers, for manufacturers. How can we use cloud to effectively manage IoT applications," stated Ian Khan, Innovation & Marketing Manager at Solgeniakhela, in this SYS-CON.tv interview at @ThingsExpo, held November 3-5, 2015, at the Santa Clara Convention Center in Santa Clara, CA.
Successful digital transformation requires new organizational competencies and capabilities. Research tells us that the biggest impediment to successful transformation is human; consequently, the biggest enabler is a properly skilled and empowered workforce. In the digital age, new individual and collective competencies are required. In his session at 19th Cloud Expo, Bob Newhouse, CEO and founder of Agilitiv, drew together recent research and lessons learned from emerging and established compa...
Enterprise IT has been in the era of Hybrid Cloud for some time now. But it seems most conversations about Hybrid are focused on integrating AWS, Microsoft Azure, or Google ECM into existing on-premises systems. Where is all the Private Cloud? What do technology providers need to do to make their offerings more compelling? How should enterprise IT executives and buyers define their focus, needs, and roadmap, and communicate that clearly to the providers?
"Coalfire is a cyber-risk, security and compliance assessment and advisory services firm. We do a lot of work with the cloud service provider community," explained Ryan McGowan, Vice President, Sales (West) at Coalfire Systems, Inc., in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
Financial Technology has become a topic of intense interest throughout the cloud developer and enterprise IT communities. Accordingly, attendees at the upcoming 20th Cloud Expo at the Javits Center in New York, June 6-8, 2017, will find fresh new content in a new track called FinTech.
Bert Loomis was a visionary. This general session will highlight how Bert Loomis and people like him inspire us to build great things with small inventions. In their general session at 19th Cloud Expo, Harold Hannon, Architect at IBM Bluemix, and Michael O'Neill, Strategic Business Development at Nvidia, discussed the accelerating pace of AI development and how IBM Cloud and NVIDIA are partnering to bring AI capabilities to "every day," on-demand. They also reviewed two "free infrastructure" pr...
Information technology is an industry that has always experienced change, and the dramatic change sweeping across the industry today could not be truthfully described as the first time we've seen such widespread change impacting customer investments. However, the rate of the change, and the potential outcomes from today's digital transformation has the distinct potential to separate the industry into two camps: Organizations that see the change coming, embrace it, and successful leverage it; and...
"Dice has been around for the last 20 years. We have been helping tech professionals find new jobs and career opportunities," explained Manish Dixit, VP of Product and Engineering at Dice, in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
SYS-CON Events announced today that Dataloop.IO, an innovator in cloud IT-monitoring whose products help organizations save time and money, has been named “Bronze Sponsor” of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, NY. Dataloop.IO is an emerging software company on the cutting edge of major IT-infrastructure trends including cloud computing and microservices. The company, founded in the UK but now based in San Fran...
Get deep visibility into the performance of your databases and expert advice for performance optimization and tuning. You can't get application performance without database performance. Give everyone on the team a comprehensive view of how every aspect of the system affects performance across SQL database operations, host server and OS, virtualization resources and storage I/O. Quickly find bottlenecks and troubleshoot complex problems.
"We are a custom software development, engineering firm. We specialize in cloud applications from helping customers that have on-premise applications migrating to the cloud, to helping customers design brand new apps in the cloud. And we specialize in mobile apps," explained Peter Di Stefano, Vice President of Marketing at Impiger Technologies, in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.
Rapid innovation, changing business landscapes, and new IT demands force businesses to make changes quickly. In the eyes of many, containers are at the brink of becoming a pervasive technology in enterprise IT to accelerate application delivery. In this presentation, attendees learned about the: The transformation of IT to a DevOps, microservices, and container-based architecture What are containers and how DevOps practices can operate in a container-based environment A demonstration of how ...
President Obama recently announced the launch of a new national awareness campaign to "encourage more Americans to move beyond passwords – adding an extra layer of security like a fingerprint or codes sent to your cellphone." The shift from single passwords to multi-factor authentication couldn’t be timelier or more strategic. This session will focus on why passwords alone are no longer effective, and why the time to act is now. In his session at 19th Cloud Expo, Chris Webber, security strateg...
Extracting business value from Internet of Things (IoT) data doesn’t happen overnight. There are several requirements that must be satisfied, including IoT device enablement, data analysis, real-time detection of complex events and automated orchestration of actions. Unfortunately, too many companies fall short in achieving their business goals by implementing incomplete solutions or not focusing on tangible use cases. In his general session at @ThingsExpo, Dave McCarthy, Director of Products...
"At ROHA we develop an app called Catcha. It was developed after we spent a year meeting with, talking to, interacting with senior citizens watching them use their smartphones and talking to them about how they use their smartphones so we could get to know their smartphone behavior," explained Dave Woods, Chief Innovation Officer at ROHA, in this SYS-CON.tv interview at 19th Cloud Expo, held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA.