Welcome!

News Feed Item

eSurface® Granted Multiple Patents on Its Proprietary Technology

eSurface® Technologies, the developer of the eSurface proprietary process for printed circuit boards, today announced it has been granted two patents by the United States Patent and Trademark Office.

The eSurface® Technologies patented process significantly increases the ability to manufacture print ...

The eSurface® Technologies patented process significantly increases the ability to manufacture printed circuit boards with ultra-fine capabilities < 1/1 L/S, through selective metallization and controlled fine feature build-up, dramatically improving production yields for printed circuit board manufacturers. (Photo: Business Wire)

The granted patents, #’s 8,784,952 and 8,784,953 respectively, cover the areas of surface activation and metallization. The patents relate to the proprietary method for the metallization of a non-conductive surface.

The eSurface Proprietary Process:

The eSurface patented process is available to license for the manufacture of printed circuit boards and other electronic components. The patented technology allows for significant process cost savings vs. current manufacturing technology, almost completely eliminating the toxic waste generated by conventional manufacturing methods, and allows conductive material to be embedded in virtually any surface that can receive an image. While the primary addressable market of eSurface Technologies is circuit fabrication, the non-circuit applications are significant when the bonding of a metal in a surface is required or advantageous.

“Securing patent rights on such a critical market advancement places eSurface Technologies in an exceptional market position,” stated David Martin, Ph.D., eSurface Technologies Advisory Board Member and founding CEO of M•CAM™. “The introduction of these pioneering patents will affect a multitude of industries and business sectors. However, with the initial commercial industry launch within the electronics business sector, eSurface is making a tremendous impact. As the world increasingly depends on printed circuit board technology, eSurface Technologies’ patented innovation represents a radical step forward in manufacturing versatility, device functionality, and product innovation. While there’s been a proliferation of production process efficiency, miniaturization, and substrate improvements in the industry, these patent claims and the underlying technology represent a paradigm shift in the science of PCB form and function which will be indispensable to the success of licensed manufacturers’ products.”

“We are pleased with the recent grants of these two patent applications and look forward to many others as our company continues to mature and grow into a leader within the technology sector,” stated Dr. William Wismann, D.Sc. TECH, eSurface Executive Vice President and Chief Technology Officer. “Receiving a patent encompassing your core technology is validation you are taking an approach unique to the market.”

“We are fortunate to have Dr. William Wismann, as part of our leadership team, whose talent and insight to resolve such key industry issues has resulted in this game changer,” stated Dave Benson, eSurface Technologies, President. “This milestone is also a tribute to the diligence and tenacity of Dr. Wismann’s technical team and our dedicated and talented management team from which we continue to grow our intellectual property portfolio and shareholder value. This is where we want to be as a company – solving technological challenges that others have not.”

About eSurface Technologies:

eSurface® Technologies is the creator of the eSurface process, a proprietary patented process that can dramatically impact the manufacturing and design segment of multiple industries. The initial adoption of the eSurface proprietary process by the global circuit board manufacturing industry is leading to the innovation of products previously not thought possible. The disruptive nature of the technology allows for new possibilities across almost all manufacturing markets. The company is currently looking into entering the wearable electronics, automotive, solar and space product manufacturing sectors. eSurface Technologies (DBA of EarthOne Circuit Technologies Corporation, a privately-held corporation) is based in Carlsbad, California.

About M•CAM International:

M•CAM International is the global leader in intellectual property based financial risk management. M•CAM has forged a globally unique business model that aligns innovation with ethical value exchanges. This means that banks can actually use intangible assets as regulatory capital qualified collateral reducing the cost of finance, clearing the way for companies to use intangible assets as financeable assets in credit and commercial markets.

©2014 eSurface Technologies. All rights reserved. eSurface, the eSurface logo and eSurface Covaler are trademarks of EarthOne Circuit Technologies Corporation. Other company and product names may be trademarks of their respective owners.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today that SourceForge has been named “Media Sponsor” of SYS-CON's 21st International Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. SourceForge is the largest, most trusted destination for Open Source Software development, collaboration, discovery and download on the web serving over 32 million viewers, 150 million downloads and over 460,000 active development projects each and every month.
SYS-CON Events announced today that Nihon Micron will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Nihon Micron Co., Ltd. strives for technological innovation to establish high-density, high-precision processing technology for providing printed circuit board and metal mount RFID tags used for communication devices. For more inf...
Enterprises have taken advantage of IoT to achieve important revenue and cost advantages. What is less apparent is how incumbent enterprises operating at scale have, following success with IoT, built analytic, operations management and software development capabilities – ranging from autonomous vehicles to manageable robotics installations. They have embraced these capabilities as if they were Silicon Valley startups. As a result, many firms employ new business models that place enormous impor...
SYS-CON Events announced today that MIRAI Inc. will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MIRAI Inc. are IT consultants from the public sector whose mission is to solve social issues by technology and innovation and to create a meaningful future for people.
Widespread fragmentation is stalling the growth of the IIoT and making it difficult for partners to work together. The number of software platforms, apps, hardware and connectivity standards is creating paralysis among businesses that are afraid of being locked into a solution. EdgeX Foundry is unifying the community around a common IoT edge framework and an ecosystem of interoperable components.
SYS-CON Events announced today that Dasher Technologies will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Dasher Technologies, Inc. ® is a premier IT solution provider that delivers expert technical resources along with trusted account executives to architect and deliver complete IT solutions and services to help our clients execute their goals, plans and objectives. Since 1999, we'v...
SYS-CON Events announced today that TidalScale, a leading provider of systems and services, will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. TidalScale has been involved in shaping the computing landscape. They've designed, developed and deployed some of the most important and successful systems and services in the history of the computing industry - internet, Ethernet, operating s...
SYS-CON Events announced today that Massive Networks, that helps your business operate seamlessly with fast, reliable, and secure internet and network solutions, has been named "Exhibitor" of SYS-CON's 21st International Cloud Expo ®, which will take place on Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. As a premier telecommunications provider, Massive Networks is headquartered out of Louisville, Colorado. With years of experience under their belt, their team of...
SYS-CON Events announced today that IBM has been named “Diamond Sponsor” of SYS-CON's 21st Cloud Expo, which will take place on October 31 through November 2nd 2017 at the Santa Clara Convention Center in Santa Clara, California.
In his session at 21st Cloud Expo, Michael Burley, a Senior Business Development Executive in IT Services at NetApp, will describe how NetApp designed a three-year program of work to migrate 25PB of a major telco's enterprise data to a new STaaS platform, and then secured a long-term contract to manage and operate the platform. This significant program blended the best of NetApp’s solutions and services capabilities to enable this telco’s successful adoption of private cloud storage and launchi...
Infoblox delivers Actionable Network Intelligence to enterprise, government, and service provider customers around the world. They are the industry leader in DNS, DHCP, and IP address management, the category known as DDI. We empower thousands of organizations to control and secure their networks from the core-enabling them to increase efficiency and visibility, improve customer service, and meet compliance requirements.
SYS-CON Events announced today that TidalScale will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. TidalScale is the leading provider of Software-Defined Servers that bring flexibility to modern data centers by right-sizing servers on the fly to fit any data set or workload. TidalScale’s award-winning inverse hypervisor technology combines multiple commodity servers (including their ass...
As hybrid cloud becomes the de-facto standard mode of operation for most enterprises, new challenges arise on how to efficiently and economically share data across environments. In his session at 21st Cloud Expo, Dr. Allon Cohen, VP of Product at Elastifile, will explore new techniques and best practices that help enterprise IT benefit from the advantages of hybrid cloud environments by enabling data availability for both legacy enterprise and cloud-native mission critical applications. By rev...
Join IBM November 1 at 21st Cloud Expo at the Santa Clara Convention Center in Santa Clara, CA, and learn how IBM Watson can bring cognitive services and AI to intelligent, unmanned systems. Cognitive analysis impacts today’s systems with unparalleled ability that were previously available only to manned, back-end operations. Thanks to cloud processing, IBM Watson can bring cognitive services and AI to intelligent, unmanned systems. Imagine a robot vacuum that becomes your personal assistant tha...
As popularity of the smart home is growing and continues to go mainstream, technological factors play a greater role. The IoT protocol houses the interoperability battery consumption, security, and configuration of a smart home device, and it can be difficult for companies to choose the right kind for their product. For both DIY and professionally installed smart homes, developers need to consider each of these elements for their product to be successful in the market and current smart homes.