Welcome!

News Feed Item

Research and Markets: Global System in Package (SIP) Market Report 2014-2020: Technology, Type, Interconnection Technology & Applications Analysis

Research and Markets (http://www.researchandmarkets.com/research/5pz2j7/system_in_package) has announced the addition of the "System in Package (SIP) Market by Technology, Type, Interconnection Technology, Applications and Geography - Global Trends & Forecasts to - 2014 - 2020" report to their offering.

The rapid expansion of the System in Package (SiP) market has inspired research and development in System in Package (SiP) associated technology by Integrated Device Manufacturers (IDM) as well as Electronic Manufacturing Services (EMS) providers and Semiconductor Assembly Services (SAS). With this evolution of System in Package (SiP) technology during the last few decades, the future trend for System in Package (SiP) technology in the next decade or two will be clearer if we look at the future electronics market sectors such as mobile products, high-end computers, automobiles, flat-panel High-Definition TVs (HDTVs), and sensors for security, health care, and environment. The consumer mobile products will advance to more multi functionality, thus, realizing the digital convergent dream with flexible displays with LED as a light source, thin film, or nano batteries.

System on Package (SOP) is an emerging trend in the system miniaturization technology in divergence to System-on-Chip (SOC) at IC level and System in Package (SiP) at module level. System in Package (SiP) is obtained by thinning ICs from its original 800 micron thick wafer dimensions to 50 microns and stacking as many as 10 of these, one on top of the other, in 3D form. These are then interconnected by either wire bond or flip-chip technology. The current Through Silicon via (TSV) developments have further condensed System in Package (SiP) by replacing flip chip with pad to pad bonding.

The capability to integrate different technologies and to reduce total production cost and time to market are the prime drivers for System in Package (SiP) packaging. System in Package (SiP) has enabled the rapid integration of active and passive devices into single package solutions. This approach has also reduced product costs, allowing systems to be partitioned into the most cost-effective blocks. The stacked System in Package (SiP) alignments reduce the system size and eliminate the cost of individual packages for each die. They also improve signal transmission times and reduced power by minimizing capacitive loads between ICs.

Report Scope

  • Technology (2D, 2.5D & 3D)
  • Type (BGA, SMT, QFP, SOP)
  • Interconnection Technology (Flip-Chip & Wire-bond)
  • Applications (Communications, Consumer, Automotive, Medical)

Market Overview

  • Soc (System on Chip)
  • Mcm (Multi Chip Module)
  • SIP (System in Package)
  • Soc Vs. SIP
  • System on Package (SOP)
  • Photonics Convergence for Interchip Interconnects

Market Analysis

  • Increasing Demand for Miniaturized & High Performance Electronic Devices
  • Strong Penetration in Consumer Electronics Sector to Drive the SIP Market
  • Faster Time-to-Market and Lower Development Costs Acts As An Attractive Prospect for the Electronic Manufacturers
  • Known Good Die'- Big Challenge for SIP (System in Package)
  • Reliability Challenges
  • Rapid Adoption of Smartphone & Tablets in Emerging Countries
  • Lack of Industry Infrastructure
  • Need of thermal Management for Packaged Chips
  • Porter's Five forces Model

For more information visit http://www.researchandmarkets.com/research/5pz2j7/system_in_package

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
The Internet giants are fully embracing AI. All the services they offer to their customers are aimed at drawing a map of the world with the data they get. The AIs from these companies are used to build disruptive approaches that cannot be used by established enterprises, which are threatened by these disruptions. However, most leaders underestimate the effect this will have on their businesses. In his session at 21st Cloud Expo, Rene Buest, Director Market Research & Technology Evangelism at Ara...
SYS-CON Events announced today that Silicon India has been named “Media Sponsor” of SYS-CON's 21st International Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Published in Silicon Valley, Silicon India magazine is the premiere platform for CIOs to discuss their innovative enterprise solutions and allows IT vendors to learn about new solutions that can help grow their business.
Join us at Cloud Expo June 6-8 to find out how to securely connect your cloud app to any cloud or on-premises data source – without complex firewall changes. More users are demanding access to on-premises data from their cloud applications. It’s no longer a “nice-to-have” but an important differentiator that drives competitive advantages. It’s the new “must have” in the hybrid era. Users want capabilities that give them a unified view of the data to get closer to customers and grow business. The...
Amazon started as an online bookseller 20 years ago. Since then, it has evolved into a technology juggernaut that has disrupted multiple markets and industries and touches many aspects of our lives. It is a relentless technology and business model innovator driving disruption throughout numerous ecosystems. Amazon’s AWS revenues alone are approaching $16B a year making it one of the largest IT companies in the world. With dominant offerings in Cloud, IoT, eCommerce, Big Data, AI, Digital Assista...
The current age of digital transformation means that IT organizations must adapt their toolset to cover all digital experiences, beyond just the end users’. Today’s businesses can no longer focus solely on the digital interactions they manage with employees or customers; they must now contend with non-traditional factors. Whether it's the power of brand to make or break a company, the need to monitor across all locations 24/7, or the ability to proactively resolve issues, companies must adapt to...
"Loom is applying artificial intelligence and machine learning into the entire log analysis process, from start to finish and at the end you will get a human touch,” explained Sabo Taylor Diab, Vice President, Marketing at Loom Systems, in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
@DevOpsSummit at Cloud Expo taking place Oct 31 - Nov 2, 2017, at the Santa Clara Convention Center, Santa Clara, CA, is co-located with the 21st International Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is ...
After more than five years of DevOps, definitions are evolving, boundaries are expanding, ‘unicorns’ are no longer rare, enterprises are on board, and pundits are moving on. Can we now look at an evolution of DevOps? Should we? Is the foundation of DevOps ‘done’, or is there still too much left to do? What is mature, and what is still missing? What does the next 5 years of DevOps look like? In this Power Panel at DevOps Summit, moderated by DevOps Summit Conference Chair Andi Mann, panelists loo...
Cloud applications are seeing a deluge of requests to support the exploding advanced analytics market. “Open analytics” is the emerging strategy to deliver that data through an open data access layer, in the cloud, to be directly consumed by external analytics tools and popular programming languages. An increasing number of data engineers and data scientists use a variety of platforms and advanced analytics languages such as SAS, R, Python and Java, as well as frameworks such as Hadoop and Spark...
"MobiDev is a Ukraine-based software development company. We do mobile development, and we're specialists in that. But we do full stack software development for entrepreneurs, for emerging companies, and for enterprise ventures," explained Alan Winters, U.S. Head of Business Development at MobiDev, in this SYS-CON.tv interview at 20th Cloud Expo, held June 6-8, 2017, at the Javits Center in New York City, NY.
A look across the tech landscape at the disruptive technologies that are increasing in prominence and speculate as to which will be most impactful for communications – namely, AI and Cloud Computing. In his session at 20th Cloud Expo, Curtis Peterson, VP of Operations at RingCentral, highlighted the current challenges of these transformative technologies and shared strategies for preparing your organization for these changes. This “view from the top” outlined the latest trends and developments i...
Automation is enabling enterprises to design, deploy, and manage more complex, hybrid cloud environments. Yet the people who manage these environments must be trained in and understanding these environments better than ever before. A new era of analytics and cognitive computing is adding intelligence, but also more complexity, to these cloud environments. How smart is your cloud? How smart should it be? In this power panel at 20th Cloud Expo, moderated by Conference Chair Roger Strukhoff, paneli...
You know you need the cloud, but you’re hesitant to simply dump everything at Amazon since you know that not all workloads are suitable for cloud. You know that you want the kind of ease of use and scalability that you get with public cloud, but your applications are architected in a way that makes the public cloud a non-starter. You’re looking at private cloud solutions based on hyperconverged infrastructure, but you’re concerned with the limits inherent in those technologies.
For organizations that have amassed large sums of software complexity, taking a microservices approach is the first step toward DevOps and continuous improvement / development. Integrating system-level analysis with microservices makes it easier to change and add functionality to applications at any time without the increase of risk. Before you start big transformation projects or a cloud migration, make sure these changes won’t take down your entire organization.
SYS-CON Events announced today that TMC has been named “Media Sponsor” of SYS-CON's 21st International Cloud Expo and Big Data at Cloud Expo, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. Global buyers rely on TMC’s content-driven marketplaces to make purchase decisions and navigate markets. Learn how we can help you reach your marketing goals.