Welcome!

News Feed Item

GaN-on-Silicon Substrate Patent Investigation



 

 

 

NEW YORK, Aug. 19, 2014 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:



GaN-on-Silicon Substrate Patent Investigation

http://www.reportlinker.com/p02100611/GaN-on-Silicon-Substrate-Patent-Investigation.html


The report provides essential patent data for GaN on Silicon substrate related to main material issues such as dislocation density reduction and stress management for preventing crack generation and warpage of the wafer.

It identifies more than 50 holders of GaN-on-Si related intellectual property.


It provides in-depth analysis of key technology segments and key players including:

-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.

The report also provides an extensive Excel database with all patents analyzed in the report with technology segmentation.

This database allows multi-criteria searches:

Patent information
- Patent publication number
- Hyperlinks to the original documents
- Priority date
- Title
- Abstract
- Patent Assignees
- Technological segments
- Legal status for each member of the patent family

Technological segments
- Buffer type
- Defect reduction
- Stress management
- Non/Semi polar
- (001)-oriented silicon substrate
- Layer transfer technology
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 20 companies.

A special focus is provided on key issues and approaches:

-Buffer type
-Defect reduction
-Stress management
-Non/Semi polar
-(001)-oriented silicon substrate
-Layer Transfer Technology

The "GaN-on-Si IP" profiles of 15 major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, IP strength and IP strategy.
The authors p6
Scope of the report p7
Key features of the report p9
Objectives of the report p11
Terminologies for patent analysis p13
Methodology p15
Patent search strategy p17
Technological segmentation p18
Executive summary p19

GaN-on-Si technology overview p35
GaN on Si: technological challenges and known solutions p36
> GaN-on-Si: growth technique overview
> GaN on Si template & epiwafer: manufacturing steps
> GaN on Si epitaxy challenges: overview
> Si surface preparation
> Prevention of the melt-back etching
> Different types of buffer layers
> Crack and wafer bow due to TCE mismatch
> Stress managements
> Dislocation in GaN-on-Si system
> Dislocation reduction
> 3D to 2D transition
> SiNx in situ masking for dislocation control

Si and GaN orientations p50
> Silicon substrate orientation
> GaN structure orientation
> Non-polar & semi-polar GaN: main interests
> Semi-polar and non-polar GaN on Si

GaN on Si engineered substrates p55
> Engineered substrate via Smart Cut™
> Engineered substrate players: Soitec (FR)
> Engineered substrate players: AmberWave Inc. (US)
> Engineered substrates: conclusion

GaN-on-Si patent investigation p63
Patent landscape overview p64
> Time evolution of patent publications (epitaxial layer & layer transfer)
> Country of patent filings (epitaxial layer & layer transfer)

Patent landscape overview: Epitaxial Layers p67
> Time evolution by country of filing
> Current legal status of patents
> Main patent applicant ranking
> Time evolution of patent applicants
> Country of filing for patent applicants
> Summary of applicant's patent portfolio
> Leadership of patent applicants
> Mapping of current IP holders
> Current legal status of patent portfolio
> Impact of patent portfolios
> IP Blocking potential of applicants
> Potential future plaintiffs
> Patent applicant IP network
> Main IP collaborations
> Main patent litigations

Patent landscape overview: Layer Transfer p87
> Time evolution by country of filing
> Current legal status of patents
> Main patent applicant ranking
> Time evolution of patent applicants
> Country of filing for patent applicants
> Patent applicant IP network
> Main IP collaborations

Analysis of technology segments p95
> Technology breakdown of patent filings
> Matrix applicants/technology segments
> Patent Differentiation for Defect/stress issues
> Current legal status of patents – Breakdown by technology segment
For all segments: overview, time evolution of patent publications, main patent applicants, time evolution of patent applicants, patent assignee IP network, granted patents near expiration, key patents.
> Buffer type
- Al-containing single layer
- Al-containing superlattices
- Others type of buffer
> Defect reduction
- 3D-2D transition (ELOG, pendeoepitaxy, nanomasking, growth conditions)
- Buffer engineering
- Other techniques
> Stress management
- Stress compensation layer (AlN-based interlayer, buffer engineering)
- Patterned substrate
- Compliant substrate
- Other techniques
> Non-polar GaN
> GaN on (001)-oriented Si

Summary of key players p150
For all of them: patenting activity, patented technologies,
key patents, granted patents near expiration, partnerships,
IP strength.
> Azzurro (p151), Dowa (p152), International Rectifier
(p153), LG (p154), Mitsubishi (p155), NGK Insulators (p156),
Nitronex (p157), Panasonic (p158), Samsung Electronics
(p159), Sharp (p160), Soitec (p161), Sumitomo (p163),
Toshiba (p164), Toyoda Gosei (p165), Toyota (p166)

Conclusion p167

GaN-on-Si market overview p169
> Comparison between different GaN-based technologies
> GaN-on-Si industry context
> Overview of the GaN-on-Si industry: from lighting to power electronics
> Possible competing technologies for GaN- on-Si
> LED qualified die surface: forecast by application
> GaN LED on Si penetration forecast
> GaN devices in power application: 2010-2020 market size, split by application
> GaN could reach 7% of the overall power device market by 2020 in the best case
> GaN-on-Si epiwafers will reach 1.6% of the overall power
substrate volume by 2020…
> 6" GaN-on-Si epiwafer: suggested price evolution on the open market
> 2013-2020 6" GaN-on-Si epiwafer volumes: open + captive market
> Mapping of open market players
> LED makers positioning
> GaN power device manufacturers
> The pro/cons of various GaN-on-Si substrate procurement
as perceived by device makers
> Buying or making GaN-on-Si epiwafer?: LED applications
> Buying or making GaN-on-Si epiwafer?: Power applications
> Buying or making GaN-on-Si epiwafer?: RF applications

Latest news 188

 


Companies Mentioned

Academic Sinica, Advanced Optoelectronic Technology (AOT), Advanced Technology Materials (ATMI), Amberwave Systems, Aonex Technologies, Applied Materials, Arizona University, ASAHI, Azzurro, Bosh, Bridgelux, CEA, CNRS, Corenergy, Corning, Covalent Materials, Cree, Dowa, EpiGaN, Epistar, Formosa Epitaxy, Freescale, Fuji Electric, Furukawa, Hitachi, Honeywell, IMEC, Institute of Semiconductors (Chinese Academy of Sciences), IQE, International Rectifier, Industrial Technology Research Institute (ITRI), Japan Radio, Korea Electronics Technology Institute (KETI), Korea Photonics Technology Institute (KOPTI), Lattice Power, LG, Macom, Micron, Mitsubishi, Nagoya Institute of Technology, Nanchang University, NanoCrystal, NanoGaN, National Institute of Advanced Industrial Science and Technolgy (AIST), NEC, NGK Insulators, National Institute for Materials Science (NIMS), Nitronex, North Carolina State University, Nippon Telegraph and Telephone (NTT), OMMIC, OSRAM, Panasonic, Philips Lumileds, Plessey, Power Integrations, Research Foundation of SUNY, Samsung Corning, Samsung Electronics, Samsung Electro-Mechanics (SEMCO), Sanken Electric, Sanyo, Shanghai Institute, Sharp, Showa Denko, Silicon Genesis (SiGen), Silicon Technology, Soitec, Sony, SUMCO, Sumitomo, Sun Yat Sen University, TDK, Tohoku Techno Arch, Toshiba, Toyoda Gosei, Toyota, Transphorm, Translucent, TriQuint, TSMC, University of Bath, University of California, University of Changchun, University of Electronic Science and Technology of China (UESTC), University of Florida, University of Magdeburg, US Air Force, US Army, US Department of Energy, US Navy

 




To order this report: GaN-on-Silicon Substrate Patent Investigation
http://www.reportlinker.com/p02100611/GaN-on-Silicon-Substrate-Patent-Investigation.html

 




__________________________
Contact Clare: [email protected]
US: (339)-368-6001
Intl: +1 339-368-6001

 

SOURCE Reportlinker

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
DevOps at Cloud Expo, taking place Nov 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, is co-located with 19th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry players in the world. The widespread success of cloud computing is driving the DevOps revolution in enterprise IT. Now as never before, development teams must communicate and collaborate in a dynamic, 24/7/365 environment. There is no time to wait for long dev...
The 19th International Cloud Expo has announced that its Call for Papers is open. Cloud Expo, to be held November 1-3, 2016, at the Santa Clara Convention Center in Santa Clara, CA, brings together Cloud Computing, Big Data, Internet of Things, DevOps, Digital Transformation, Microservices and WebRTC to one location. With cloud computing driving a higher percentage of enterprise IT budgets every year, it becomes increasingly important to plant your flag in this fast-expanding business opportuni...
Aspose.Total for .NET is the most complete package of all file format APIs for .NET as offered by Aspose. It empowers developers to create, edit, render, print and convert between a wide range of popular document formats within any .NET, C#, ASP.NET and VB.NET applications. Aspose compiles all .NET APIs on a daily basis to ensure that it contains the most up to date versions of each of Aspose .NET APIs. If a new .NET API or a new version of existing APIs is released during the subscription peri...
Data is the fuel that drives the machine learning algorithmic engines and ultimately provides the business value. In his session at Cloud Expo, Ed Featherston, a director and senior enterprise architect at Collaborative Consulting, will discuss the key considerations around quality, volume, timeliness, and pedigree that must be dealt with in order to properly fuel that engine.
SYS-CON Events announced today that StarNet Communications will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. StarNet Communications’ FastX is the industry first cloud-based remote X Windows emulator. Using standard Web browsers (FireFox, Chrome, Safari, etc.) users from around the world gain highly secure access to applications and data hosted on Linux-based servers in a central data center. ...
SYS-CON Events announced today that Hitrons Solutions will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Hitrons Solutions Inc. is distributor in the North American market for unique products and services of small and medium-size businesses, including cloud services and solutions, SEO marketing platforms, and mobile applications.
As the world moves toward more DevOps and Microservices, application deployment to the cloud ought to become a lot simpler. The Microservices architecture, which is the basis of many new age distributed systems such as OpenStack, NetFlix and so on, is at the heart of Cloud Foundry - a complete developer-oriented Platform as a Service (PaaS) that is IaaS agnostic and supports vCloud, OpenStack and AWS. Serverless computing is revolutionizing computing. In his session at 19th Cloud Expo, Raghav...
Pulzze Systems was happy to participate in such a premier event and thankful to be receiving the winning investment and global network support from G-Startup Worldwide. It is an exciting time for Pulzze to showcase the effectiveness of innovative technologies and enable them to make the world smarter and better. The reputable contest is held to identify promising startups around the globe that are assured to change the world through their innovative products and disruptive technologies. There w...
Today we can collect lots and lots of performance data. We build beautiful dashboards and even have fancy query languages to access and transform the data. Still performance data is a secret language only a couple of people understand. The more business becomes digital the more stakeholders are interested in this data including how it relates to business. Some of these people have never used a monitoring tool before. They have a question on their mind like “How is my application doing” but no id...
Personalization has long been the holy grail of marketing. Simply stated, communicate the most relevant offer to the right person and you will increase sales. To achieve this, you must understand the individual. Consequently, digital marketers developed many ways to gather and leverage customer information to deliver targeted experiences. In his session at @ThingsExpo, Lou Casal, Founder and Principal Consultant at Practicala, discussed how the Internet of Things (IoT) has accelerated our abil...
With so much going on in this space you could be forgiven for thinking you were always working with yesterday’s technologies. So much change, so quickly. What do you do if you have to build a solution from the ground up that is expected to live in the field for at least 5-10 years? This is the challenge we faced when we looked to refresh our existing 10-year-old custom hardware stack to measure the fullness of trash cans and compactors.
Extreme Computing is the ability to leverage highly performant infrastructure and software to accelerate Big Data, machine learning, HPC, and Enterprise applications. High IOPS Storage, low-latency networks, in-memory databases, GPUs and other parallel accelerators are being used to achieve faster results and help businesses make better decisions. In his session at 18th Cloud Expo, Michael O'Neill, Strategic Business Development at NVIDIA, focused on some of the unique ways extreme computing is...
The emerging Internet of Everything creates tremendous new opportunities for customer engagement and business model innovation. However, enterprises must overcome a number of critical challenges to bring these new solutions to market. In his session at @ThingsExpo, Michael Martin, CTO/CIO at nfrastructure, outlined these key challenges and recommended approaches for overcoming them to achieve speed and agility in the design, development and implementation of Internet of Everything solutions wi...
Cloud computing is being adopted in one form or another by 94% of enterprises today. Tens of billions of new devices are being connected to The Internet of Things. And Big Data is driving this bus. An exponential increase is expected in the amount of information being processed, managed, analyzed, and acted upon by enterprise IT. This amazing is not part of some distant future - it is happening today. One report shows a 650% increase in enterprise data by 2020. Other estimates are even higher....
With over 720 million Internet users and 40–50% CAGR, the Chinese Cloud Computing market has been booming. When talking about cloud computing, what are the Chinese users of cloud thinking about? What is the most powerful force that can push them to make the buying decision? How to tap into them? In his session at 18th Cloud Expo, Yu Hao, CEO and co-founder of SpeedyCloud, answered these questions and discussed the results of SpeedyCloud’s survey.