Welcome!

News Feed Item

GaN-on-Silicon Substrate Patent Investigation



 

 

 

NEW YORK, Aug. 19, 2014 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:



GaN-on-Silicon Substrate Patent Investigation

http://www.reportlinker.com/p02100611/GaN-on-Silicon-Substrate-Patent-Investigation.html


The report provides essential patent data for GaN on Silicon substrate related to main material issues such as dislocation density reduction and stress management for preventing crack generation and warpage of the wafer.

It identifies more than 50 holders of GaN-on-Si related intellectual property.


It provides in-depth analysis of key technology segments and key players including:

-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.

The report also provides an extensive Excel database with all patents analyzed in the report with technology segmentation.

This database allows multi-criteria searches:

Patent information
- Patent publication number
- Hyperlinks to the original documents
- Priority date
- Title
- Abstract
- Patent Assignees
- Technological segments
- Legal status for each member of the patent family

Technological segments
- Buffer type
- Defect reduction
- Stress management
- Non/Semi polar
- (001)-oriented silicon substrate
- Layer transfer technology
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 20 companies.

A special focus is provided on key issues and approaches:

-Buffer type
-Defect reduction
-Stress management
-Non/Semi polar
-(001)-oriented silicon substrate
-Layer Transfer Technology

The "GaN-on-Si IP" profiles of 15 major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, IP strength and IP strategy.
The authors p6
Scope of the report p7
Key features of the report p9
Objectives of the report p11
Terminologies for patent analysis p13
Methodology p15
Patent search strategy p17
Technological segmentation p18
Executive summary p19

GaN-on-Si technology overview p35
GaN on Si: technological challenges and known solutions p36
> GaN-on-Si: growth technique overview
> GaN on Si template & epiwafer: manufacturing steps
> GaN on Si epitaxy challenges: overview
> Si surface preparation
> Prevention of the melt-back etching
> Different types of buffer layers
> Crack and wafer bow due to TCE mismatch
> Stress managements
> Dislocation in GaN-on-Si system
> Dislocation reduction
> 3D to 2D transition
> SiNx in situ masking for dislocation control

Si and GaN orientations p50
> Silicon substrate orientation
> GaN structure orientation
> Non-polar & semi-polar GaN: main interests
> Semi-polar and non-polar GaN on Si

GaN on Si engineered substrates p55
> Engineered substrate via Smart Cut™
> Engineered substrate players: Soitec (FR)
> Engineered substrate players: AmberWave Inc. (US)
> Engineered substrates: conclusion

GaN-on-Si patent investigation p63
Patent landscape overview p64
> Time evolution of patent publications (epitaxial layer & layer transfer)
> Country of patent filings (epitaxial layer & layer transfer)

Patent landscape overview: Epitaxial Layers p67
> Time evolution by country of filing
> Current legal status of patents
> Main patent applicant ranking
> Time evolution of patent applicants
> Country of filing for patent applicants
> Summary of applicant's patent portfolio
> Leadership of patent applicants
> Mapping of current IP holders
> Current legal status of patent portfolio
> Impact of patent portfolios
> IP Blocking potential of applicants
> Potential future plaintiffs
> Patent applicant IP network
> Main IP collaborations
> Main patent litigations

Patent landscape overview: Layer Transfer p87
> Time evolution by country of filing
> Current legal status of patents
> Main patent applicant ranking
> Time evolution of patent applicants
> Country of filing for patent applicants
> Patent applicant IP network
> Main IP collaborations

Analysis of technology segments p95
> Technology breakdown of patent filings
> Matrix applicants/technology segments
> Patent Differentiation for Defect/stress issues
> Current legal status of patents – Breakdown by technology segment
For all segments: overview, time evolution of patent publications, main patent applicants, time evolution of patent applicants, patent assignee IP network, granted patents near expiration, key patents.
> Buffer type
- Al-containing single layer
- Al-containing superlattices
- Others type of buffer
> Defect reduction
- 3D-2D transition (ELOG, pendeoepitaxy, nanomasking, growth conditions)
- Buffer engineering
- Other techniques
> Stress management
- Stress compensation layer (AlN-based interlayer, buffer engineering)
- Patterned substrate
- Compliant substrate
- Other techniques
> Non-polar GaN
> GaN on (001)-oriented Si

Summary of key players p150
For all of them: patenting activity, patented technologies,
key patents, granted patents near expiration, partnerships,
IP strength.
> Azzurro (p151), Dowa (p152), International Rectifier
(p153), LG (p154), Mitsubishi (p155), NGK Insulators (p156),
Nitronex (p157), Panasonic (p158), Samsung Electronics
(p159), Sharp (p160), Soitec (p161), Sumitomo (p163),
Toshiba (p164), Toyoda Gosei (p165), Toyota (p166)

Conclusion p167

GaN-on-Si market overview p169
> Comparison between different GaN-based technologies
> GaN-on-Si industry context
> Overview of the GaN-on-Si industry: from lighting to power electronics
> Possible competing technologies for GaN- on-Si
> LED qualified die surface: forecast by application
> GaN LED on Si penetration forecast
> GaN devices in power application: 2010-2020 market size, split by application
> GaN could reach 7% of the overall power device market by 2020 in the best case
> GaN-on-Si epiwafers will reach 1.6% of the overall power
substrate volume by 2020…
> 6" GaN-on-Si epiwafer: suggested price evolution on the open market
> 2013-2020 6" GaN-on-Si epiwafer volumes: open + captive market
> Mapping of open market players
> LED makers positioning
> GaN power device manufacturers
> The pro/cons of various GaN-on-Si substrate procurement
as perceived by device makers
> Buying or making GaN-on-Si epiwafer?: LED applications
> Buying or making GaN-on-Si epiwafer?: Power applications
> Buying or making GaN-on-Si epiwafer?: RF applications

Latest news 188

 


Companies Mentioned

Academic Sinica, Advanced Optoelectronic Technology (AOT), Advanced Technology Materials (ATMI), Amberwave Systems, Aonex Technologies, Applied Materials, Arizona University, ASAHI, Azzurro, Bosh, Bridgelux, CEA, CNRS, Corenergy, Corning, Covalent Materials, Cree, Dowa, EpiGaN, Epistar, Formosa Epitaxy, Freescale, Fuji Electric, Furukawa, Hitachi, Honeywell, IMEC, Institute of Semiconductors (Chinese Academy of Sciences), IQE, International Rectifier, Industrial Technology Research Institute (ITRI), Japan Radio, Korea Electronics Technology Institute (KETI), Korea Photonics Technology Institute (KOPTI), Lattice Power, LG, Macom, Micron, Mitsubishi, Nagoya Institute of Technology, Nanchang University, NanoCrystal, NanoGaN, National Institute of Advanced Industrial Science and Technolgy (AIST), NEC, NGK Insulators, National Institute for Materials Science (NIMS), Nitronex, North Carolina State University, Nippon Telegraph and Telephone (NTT), OMMIC, OSRAM, Panasonic, Philips Lumileds, Plessey, Power Integrations, Research Foundation of SUNY, Samsung Corning, Samsung Electronics, Samsung Electro-Mechanics (SEMCO), Sanken Electric, Sanyo, Shanghai Institute, Sharp, Showa Denko, Silicon Genesis (SiGen), Silicon Technology, Soitec, Sony, SUMCO, Sumitomo, Sun Yat Sen University, TDK, Tohoku Techno Arch, Toshiba, Toyoda Gosei, Toyota, Transphorm, Translucent, TriQuint, TSMC, University of Bath, University of California, University of Changchun, University of Electronic Science and Technology of China (UESTC), University of Florida, University of Magdeburg, US Air Force, US Army, US Department of Energy, US Navy

 




To order this report: GaN-on-Silicon Substrate Patent Investigation
http://www.reportlinker.com/p02100611/GaN-on-Silicon-Substrate-Patent-Investigation.html

 




__________________________
Contact Clare: [email protected]
US: (339)-368-6001
Intl: +1 339-368-6001

 

SOURCE Reportlinker

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
SYS-CON Events announced today that MIRAI Inc. will exhibit at the Japan External Trade Organization (JETRO) Pavilion at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. MIRAI Inc. are IT consultants from the public sector whose mission is to solve social issues by technology and innovation and to create a meaningful future for people.
Transforming cloud-based data into a reportable format can be a very expensive, time-intensive and complex operation. As a SaaS platform with more than 30 million global users, Cornerstone OnDemand’s challenge was to create a scalable solution that would improve the time it took customers to access their user data. Our Real-Time Data Warehouse (RTDW) process vastly reduced data time-to-availability from 24 hours to just 10 minutes. In his session at 21st Cloud Expo, Mark Goldin, Chief Technolo...
SYS-CON Events announced today that IBM has been named “Diamond Sponsor” of SYS-CON's 21st Cloud Expo, which will take place on October 31 through November 2nd 2017 at the Santa Clara Convention Center in Santa Clara, California.
SYS-CON Events announced today that TidalScale will exhibit at SYS-CON's 21st International Cloud Expo®, which will take place on Oct 31 – Nov 2, 2017, at the Santa Clara Convention Center in Santa Clara, CA. TidalScale is the leading provider of Software-Defined Servers that bring flexibility to modern data centers by right-sizing servers on the fly to fit any data set or workload. TidalScale’s award-winning inverse hypervisor technology combines multiple commodity servers (including their ass...
In the fast-paced advances and popularity in cloud technology, one of the most critical factors revolves around concerns for security of your critical data. How to assure both your company and your customers they can confidently trust and utilize your cloud environment is most often top on the list. There is a method to evaluating and providing security that exceeds conventional modes of protecting data both within the cloud as well externally on mobile and other devices. With the public failure...
Join IBM November 1 at 21st Cloud Expo at the Santa Clara Convention Center in Santa Clara, CA, and learn how IBM Watson can bring cognitive services and AI to intelligent, unmanned systems. Cognitive analysis impacts today’s systems with unparalleled ability that were previously available only to manned, back-end operations. Thanks to cloud processing, IBM Watson can bring cognitive services and AI to intelligent, unmanned systems. Imagine a robot vacuum that becomes your personal assistant tha...
Widespread fragmentation is stalling the growth of the IIoT and making it difficult for partners to work together. The number of software platforms, apps, hardware and connectivity standards is creating paralysis among businesses that are afraid of being locked into a solution. EdgeX Foundry is unifying the community around a common IoT edge framework and an ecosystem of interoperable components.
In his session at 21st Cloud Expo, Raju Shreewastava, founder of Big Data Trunk, will provide a fun and simple way to introduce Machine Leaning to anyone and everyone. Together we will solve a machine learning problem and find an easy way to be able to do machine learning without even coding. Raju Shreewastava is the founder of Big Data Trunk (www.BigDataTrunk.com), a Big Data Training and consulting firm with offices in the United States. He previously led the data warehouse/business intellige...
Gemini is Yahoo’s native and search advertising platform. To ensure the quality of a complex distributed system that spans multiple products and components and across various desktop websites and mobile app and web experiences – both Yahoo owned and operated and third-party syndication (supply), with complex interaction with more than a billion users and numerous advertisers globally (demand) – it becomes imperative to automate a set of end-to-end tests 24x7 to detect bugs and regression. In th...
Infoblox delivers Actionable Network Intelligence to enterprise, government, and service provider customers around the world. They are the industry leader in DNS, DHCP, and IP address management, the category known as DDI. We empower thousands of organizations to control and secure their networks from the core-enabling them to increase efficiency and visibility, improve customer service, and meet compliance requirements.
In his session at 21st Cloud Expo, Michael Burley, a Senior Business Development Executive in IT Services at NetApp, will describe how NetApp designed a three-year program of work to migrate 25PB of a major telco's enterprise data to a new STaaS platform, and then secured a long-term contract to manage and operate the platform. This significant program blended the best of NetApp’s solutions and services capabilities to enable this telco’s successful adoption of private cloud storage and launchi...
The session is centered around the tracing of systems on cloud using technologies like ebpf. The goal is to talk about what this technology is all about and what purpose it serves. In his session at 21st Cloud Expo, Shashank Jain, Development Architect at SAP, will touch upon concepts of observability in the cloud and also some of the challenges we have. Generally most cloud-based monitoring tools capture details at a very granular level. To troubleshoot problems this might not be good enough.
As popularity of the smart home is growing and continues to go mainstream, technological factors play a greater role. The IoT protocol houses the interoperability battery consumption, security, and configuration of a smart home device, and it can be difficult for companies to choose the right kind for their product. For both DIY and professionally installed smart homes, developers need to consider each of these elements for their product to be successful in the market and current smart homes.
DevOps is often described as a combination of technology and culture. Without both, DevOps isn't complete. However, applying the culture to outdated technology is a recipe for disaster; as response times grow and connections between teams are delayed by technology, the culture will die. A Nutanix Enterprise Cloud has many benefits that provide the needed base for a true DevOps paradigm. In their Day 3 Keynote at 20th Cloud Expo, Chris Brown, a Solutions Marketing Manager at Nutanix, and Mark Lav...
With major technology companies and startups seriously embracing Cloud strategies, now is the perfect time to attend 21st Cloud Expo October 31 - November 2, 2017, at the Santa Clara Convention Center, CA, and June 12-14, 2018, at the Javits Center in New York City, NY, and learn what is going on, contribute to the discussions, and ensure that your enterprise is on the right path to Digital Transformation.