Welcome!

News Feed Item

GaN-on-Silicon Substrate Patent Investigation



 

 

 

NEW YORK, Aug. 19, 2014 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:



GaN-on-Silicon Substrate Patent Investigation

http://www.reportlinker.com/p02100611/GaN-on-Silicon-Substrate-Patent-Investigation.html


The report provides essential patent data for GaN on Silicon substrate related to main material issues such as dislocation density reduction and stress management for preventing crack generation and warpage of the wafer.

It identifies more than 50 holders of GaN-on-Si related intellectual property.


It provides in-depth analysis of key technology segments and key players including:

-Time evolution of patent publications and countries of patent filings.
-Current legal status of patents.
-Ranking of main patent applicants.
-Joint developments and IP collaboration network of main patent applicants.
-Key patents.
-Granted patents near expiration.
-Relative strength of main companies IP portfolio.

The report also provides an extensive Excel database with all patents analyzed in the report with technology segmentation.

This database allows multi-criteria searches:

Patent information
- Patent publication number
- Hyperlinks to the original documents
- Priority date
- Title
- Abstract
- Patent Assignees
- Technological segments
- Legal status for each member of the patent family

Technological segments
- Buffer type
- Defect reduction
- Stress management
- Non/Semi polar
- (001)-oriented silicon substrate
- Layer transfer technology
-Overview of patent litigations.
-Matrix applicants/technology issues for more than 20 companies.

A special focus is provided on key issues and approaches:

-Buffer type
-Defect reduction
-Stress management
-Non/Semi polar
-(001)-oriented silicon substrate
-Layer Transfer Technology

The "GaN-on-Si IP" profiles of 15 major companies is presented, with key patents, technological issues, litigations, licenses, partnerships, IP strength and IP strategy.
The authors p6
Scope of the report p7
Key features of the report p9
Objectives of the report p11
Terminologies for patent analysis p13
Methodology p15
Patent search strategy p17
Technological segmentation p18
Executive summary p19

GaN-on-Si technology overview p35
GaN on Si: technological challenges and known solutions p36
> GaN-on-Si: growth technique overview
> GaN on Si template & epiwafer: manufacturing steps
> GaN on Si epitaxy challenges: overview
> Si surface preparation
> Prevention of the melt-back etching
> Different types of buffer layers
> Crack and wafer bow due to TCE mismatch
> Stress managements
> Dislocation in GaN-on-Si system
> Dislocation reduction
> 3D to 2D transition
> SiNx in situ masking for dislocation control

Si and GaN orientations p50
> Silicon substrate orientation
> GaN structure orientation
> Non-polar & semi-polar GaN: main interests
> Semi-polar and non-polar GaN on Si

GaN on Si engineered substrates p55
> Engineered substrate via Smart Cut™
> Engineered substrate players: Soitec (FR)
> Engineered substrate players: AmberWave Inc. (US)
> Engineered substrates: conclusion

GaN-on-Si patent investigation p63
Patent landscape overview p64
> Time evolution of patent publications (epitaxial layer & layer transfer)
> Country of patent filings (epitaxial layer & layer transfer)

Patent landscape overview: Epitaxial Layers p67
> Time evolution by country of filing
> Current legal status of patents
> Main patent applicant ranking
> Time evolution of patent applicants
> Country of filing for patent applicants
> Summary of applicant's patent portfolio
> Leadership of patent applicants
> Mapping of current IP holders
> Current legal status of patent portfolio
> Impact of patent portfolios
> IP Blocking potential of applicants
> Potential future plaintiffs
> Patent applicant IP network
> Main IP collaborations
> Main patent litigations

Patent landscape overview: Layer Transfer p87
> Time evolution by country of filing
> Current legal status of patents
> Main patent applicant ranking
> Time evolution of patent applicants
> Country of filing for patent applicants
> Patent applicant IP network
> Main IP collaborations

Analysis of technology segments p95
> Technology breakdown of patent filings
> Matrix applicants/technology segments
> Patent Differentiation for Defect/stress issues
> Current legal status of patents – Breakdown by technology segment
For all segments: overview, time evolution of patent publications, main patent applicants, time evolution of patent applicants, patent assignee IP network, granted patents near expiration, key patents.
> Buffer type
- Al-containing single layer
- Al-containing superlattices
- Others type of buffer
> Defect reduction
- 3D-2D transition (ELOG, pendeoepitaxy, nanomasking, growth conditions)
- Buffer engineering
- Other techniques
> Stress management
- Stress compensation layer (AlN-based interlayer, buffer engineering)
- Patterned substrate
- Compliant substrate
- Other techniques
> Non-polar GaN
> GaN on (001)-oriented Si

Summary of key players p150
For all of them: patenting activity, patented technologies,
key patents, granted patents near expiration, partnerships,
IP strength.
> Azzurro (p151), Dowa (p152), International Rectifier
(p153), LG (p154), Mitsubishi (p155), NGK Insulators (p156),
Nitronex (p157), Panasonic (p158), Samsung Electronics
(p159), Sharp (p160), Soitec (p161), Sumitomo (p163),
Toshiba (p164), Toyoda Gosei (p165), Toyota (p166)

Conclusion p167

GaN-on-Si market overview p169
> Comparison between different GaN-based technologies
> GaN-on-Si industry context
> Overview of the GaN-on-Si industry: from lighting to power electronics
> Possible competing technologies for GaN- on-Si
> LED qualified die surface: forecast by application
> GaN LED on Si penetration forecast
> GaN devices in power application: 2010-2020 market size, split by application
> GaN could reach 7% of the overall power device market by 2020 in the best case
> GaN-on-Si epiwafers will reach 1.6% of the overall power
substrate volume by 2020…
> 6" GaN-on-Si epiwafer: suggested price evolution on the open market
> 2013-2020 6" GaN-on-Si epiwafer volumes: open + captive market
> Mapping of open market players
> LED makers positioning
> GaN power device manufacturers
> The pro/cons of various GaN-on-Si substrate procurement
as perceived by device makers
> Buying or making GaN-on-Si epiwafer?: LED applications
> Buying or making GaN-on-Si epiwafer?: Power applications
> Buying or making GaN-on-Si epiwafer?: RF applications

Latest news 188

 


Companies Mentioned

Academic Sinica, Advanced Optoelectronic Technology (AOT), Advanced Technology Materials (ATMI), Amberwave Systems, Aonex Technologies, Applied Materials, Arizona University, ASAHI, Azzurro, Bosh, Bridgelux, CEA, CNRS, Corenergy, Corning, Covalent Materials, Cree, Dowa, EpiGaN, Epistar, Formosa Epitaxy, Freescale, Fuji Electric, Furukawa, Hitachi, Honeywell, IMEC, Institute of Semiconductors (Chinese Academy of Sciences), IQE, International Rectifier, Industrial Technology Research Institute (ITRI), Japan Radio, Korea Electronics Technology Institute (KETI), Korea Photonics Technology Institute (KOPTI), Lattice Power, LG, Macom, Micron, Mitsubishi, Nagoya Institute of Technology, Nanchang University, NanoCrystal, NanoGaN, National Institute of Advanced Industrial Science and Technolgy (AIST), NEC, NGK Insulators, National Institute for Materials Science (NIMS), Nitronex, North Carolina State University, Nippon Telegraph and Telephone (NTT), OMMIC, OSRAM, Panasonic, Philips Lumileds, Plessey, Power Integrations, Research Foundation of SUNY, Samsung Corning, Samsung Electronics, Samsung Electro-Mechanics (SEMCO), Sanken Electric, Sanyo, Shanghai Institute, Sharp, Showa Denko, Silicon Genesis (SiGen), Silicon Technology, Soitec, Sony, SUMCO, Sumitomo, Sun Yat Sen University, TDK, Tohoku Techno Arch, Toshiba, Toyoda Gosei, Toyota, Transphorm, Translucent, TriQuint, TSMC, University of Bath, University of California, University of Changchun, University of Electronic Science and Technology of China (UESTC), University of Florida, University of Magdeburg, US Air Force, US Army, US Department of Energy, US Navy

 




To order this report: GaN-on-Silicon Substrate Patent Investigation
http://www.reportlinker.com/p02100611/GaN-on-Silicon-Substrate-Patent-Investigation.html

 




__________________________
Contact Clare: [email protected]
US: (339)-368-6001
Intl: +1 339-368-6001

 

SOURCE Reportlinker

More Stories By PR Newswire

Copyright © 2007 PR Newswire. All rights reserved. Republication or redistribution of PRNewswire content is expressly prohibited without the prior written consent of PRNewswire. PRNewswire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
Artificial Intelligence has the potential to massively disrupt IoT. In his session at 18th Cloud Expo, AJ Abdallat, CEO of Beyond AI, will discuss what the five main drivers are in Artificial Intelligence that could shape the future of the Internet of Things. AJ Abdallat is CEO of Beyond AI. He has over 20 years of management experience in the fields of artificial intelligence, sensors, instruments, devices and software for telecommunications, life sciences, environmental monitoring, process...
In his session at 18th Cloud Expo, Sagi Brody, Chief Technology Officer at Webair Internet Development Inc., will focus on real world deployments of DDoS mitigation strategies in every layer of the network. He will give an overview of methods to prevent these attacks and best practices on how to provide protection in complex cloud platforms. He will also outline what we have found in our experience managing and running thousands of Linux and Unix managed service platforms and what specifically c...
The IETF draft standard for M2M certificates is a security solution specifically designed for the demanding needs of IoT/M2M applications. In his session at @ThingsExpo, Brian Romansky, VP of Strategic Technology at TrustPoint Innovation, will explain how M2M certificates can efficiently enable confidentiality, integrity, and authenticity on highly constrained devices.
You think you know what’s in your data. But do you? Most organizations are now aware of the business intelligence represented by their data. Data science stands to take this to a level you never thought of – literally. The techniques of data science, when used with the capabilities of Big Data technologies, can make connections you had not yet imagined, helping you discover new insights and ask new questions of your data. In his session at @ThingsExpo, Sarbjit Sarkaria, data science team lead ...
There is an ever-growing explosion of new devices that are connected to the Internet using “cloud” solutions. This rapid growth is creating a massive new demand for efficient access to data. And it’s not just about connecting to that data anymore. This new demand is bringing new issues and challenges and it is important for companies to scale for the coming growth. And with that scaling comes the need for greater security, gathering and data analysis, storage, connectivity and, of course, the...
A critical component of any IoT project is the back-end systems that capture data from remote IoT devices and structure it in a way to answer useful questions. Traditional data warehouse and analytical systems are mature technologies that can be used to handle large data sets, but they are not well suited to many IoT-scale products and the need for real-time insights. At Fuze, we have developed a backend platform as part of our mobility-oriented cloud service that uses Big Data-based approache...
The IoTs will challenge the status quo of how IT and development organizations operate. Or will it? Certainly the fog layer of IoT requires special insights about data ontology, security and transactional integrity. But the developmental challenges are the same: People, Process and Platform. In his session at @ThingsExpo, Craig Sproule, CEO of Metavine, will demonstrate how to move beyond today's coding paradigm and share the must-have mindsets for removing complexity from the development proc...
Much of the value of DevOps comes from a (renewed) focus on measurement, sharing, and continuous feedback loops. In increasingly complex DevOps workflows and environments, and especially in larger, regulated, or more crystallized organizations, these core concepts become even more critical. In his session at @DevOpsSummit at 18th Cloud Expo, Andi Mann, Chief Technology Advocate at Splunk, will show how, by focusing on 'metrics that matter,' you can provide objective, transparent, and meaningfu...
Many private cloud projects were built to deliver self-service access to development and test resources. While those clouds delivered faster access to resources, they lacked visibility, control and security needed for production deployments. In their session at 18th Cloud Expo, Steve Anderson, Product Manager at BMC Software, and Rick Lefort, Principal Technical Marketing Consultant at BMC Software, will discuss how a cloud designed for production operations not only helps accelerate developer...
trust and privacy in their ecosystem. Assurance and protection of device identity, secure data encryption and authentication are the key security challenges organizations are trying to address when integrating IoT devices. This holds true for IoT applications in a wide range of industries, for example, healthcare, consumer devices, and manufacturing. In his session at @ThingsExpo, Lancen LaChance, vice president of product management, IoT solutions at GlobalSign, will teach IoT developers how t...
Manufacturers are embracing the Industrial Internet the same way consumers are leveraging Fitbits – to improve overall health and wellness. Both can provide consistent measurement, visibility, and suggest performance improvements customized to help reach goals. Fitbit users can view real-time data and make adjustments to increase their activity. In his session at @ThingsExpo, Mark Bernardo Professional Services Leader, Americas, at GE Digital, will discuss how leveraging the Industrial Interne...
Redis is not only the fastest database, but it has become the most popular among the new wave of applications running in containers. Redis speeds up just about every data interaction between your users or operational systems. In his session at 18th Cloud Expo, Dave Nielsen, Developer Relations at Redis Labs, will shares the functions and data structures used to solve everyday use cases that are driving Redis' popularity.
Increasing IoT connectivity is forcing enterprises to find elegant solutions to organize and visualize all incoming data from these connected devices with re-configurable dashboard widgets to effectively allow rapid decision-making for everything from immediate actions in tactical situations to strategic analysis and reporting. In his session at 18th Cloud Expo, Shikhir Singh, Senior Developer Relations Manager at Sencha, will discuss how to create HTML5 dashboards that interact with IoT devic...
We're entering the post-smartphone era, where wearable gadgets from watches and fitness bands to glasses and health aids will power the next technological revolution. With mass adoption of wearable devices comes a new data ecosystem that must be protected. Wearables open new pathways that facilitate the tracking, sharing and storing of consumers’ personal health, location and daily activity data. Consumers have some idea of the data these devices capture, but most don’t realize how revealing and...
Struggling to keep up with increasing application demand? Learn how Platform as a Service (PaaS) can streamline application development processes and make resource management easy.