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Research and Markets: Global and Chinese IC Advanced Packaging Industry Report, 2013-2014

Research and Markets (http://www.researchandmarkets.com/research/39jftv/global_and) has announced the addition of the "Global and Chinese IC Advanced Packaging Industry Report, 2013-2014" report to their offering.

Typically, an independent packaging and testing vendor is known as OSAT. In 1997, the OSAT industry scale was no more than USD5.1 billion or so, making up 19.6% of the semiconductor industry, in sharp contrast to the market size of USD23.6 billion in 2011, a figure that occupied 30% of the semiconductor industry. During 2011-2013, the packaging and testing industry saw an AAGR of less than 5% for 3 consecutive years, which mainly resulted from the fact the advanced packaging technologies developed from 2005-2010 period began to be popularized, thus leading to a dramatic decline in unit prices, these packaging technologies including FC-BGA, WLCSP, QFN, SiP, and PoP, etc.

In 2014, the biggest event that happened to the packaging industry was nothing but the attempt of Temasek to sell STATS ChipPAC, the world's fifth largest packaging company. Owned by the Government of Singapore, STATS ChipPAC is less competitive, especially when facing the competition from the Taiwanese rivals. Although it has state-of-the-art technologies, yet the company depends heavily on its key accounts, including Infineon, Apple Inc., Qualcomm, and Broadcom, etc. However, Infineon has gradually withdrawn from mobile phone market while Apple Inc. and Qualcomm have diversified supply chain risks, cutting down on the orders of STATS ChipPAC, which led to a fall in revenue for four consecutive years.

In addition, a second major event was the fact that SPIL had won massive orders from Qualcomm, MTK as well as Huawei's Hisilicon, which would considerably increase SPIL's revenue. In H1 2014, SPIL harvested a substantial growth of 27% in revenue, making it the world's No.1 by operating margin. In 2014, the company is expected to surpass Amkor as the global second.

In terms of technology, 3D (TSV) application is not yet so mature that the market is still confined to such non-mainstream fields as CIS, MEMS, and HB LED. The key Logic+Memory market has not made progress and will not get improvements in the coming 5 years, with PoP packaging still the mainstream. This comes mainly from the following reasons:

Key Topics Covered:

1. Global Semiconductor Industry

  • Supply Chain
  • Semiconductor Packaging Introduction

2. Upstream & Downstream of IC Packaging Industry

  • Semiconductor Industry by Location
  • Semiconductor Industry Capital Spending Trend
  • DRAM Industry
  • NAND Flash
  • Wafer Foundry Industry
  • Wafer Foundry Competition
  • Wafer Foundry Industry Ranking
  • Mobile Phone Market
  • PC Market
  • Tablet PC Market
  • FPGA and CPLD Market

3. Packaging & Testing Technology Trend

  • Wide IO/HMC Memory
  • Embedded Component Substrate
  • Embedded Trace Substrate
  • IC Packaging for Handset
  • SIP Packaging
  • 2.5D Packaging (SI/GLASS/ORGANIC INTERPOSER)
  • TSV (3D) Packaging

4. Packaging & Testing Industry

  • Market Size
  • Middle-end Packaging &Testing Industry
  • OSAT Industry by Region
  • Semiconductor Testing
  • Global Vendor Ranking

5. Packaging & Testing Vendors

  • ASE
  • Amkor
  • SPIL
  • STATS ChipPAC
  • PTI
  • Greatek
  • ChipMOS
  • KYEC
  • Unisem
  • FATC
  • JECT
  • UTAC
  • Lingsen Precision
  • Nantong Fujitsu Microelectronics
  • Walton Advanced Engineering
  • Chipbond
  • J-DEVICES
  • MPI
  • STS Semiconductor
  • Signetics
  • Hana Micron
  • Nepes
  • Tian Shui Hua Tian Technology

For more information visit http://www.researchandmarkets.com/research/39jftv/global_and

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