Welcome!

News Feed Item

ASE Collaborates on Leading MEMS Device With Bosch Sensortec GmbH

Advanced Semiconductor Engineering, Inc. (TAIEX:2311) (NYSE:ASX), the world's largest semiconductor assembly and test service provider, today announced that it has been selected by Bosch Sensortec GmbH as a key manufacturing and technology partner for production of a leading edge sensor device. Through utilizing advanced wafer level packaging technologies developed at ASE, Bosch Sensortec has successfully brought to market the industry's smallest 3-axis MEMS accelerometer available today. Geared towards highly integrated low-power consumer electronics applications, this leading edge sensor device features digital interfaces in an advanced wafer level chip scale package.

With sensor technologies playing an integral role in emerging applications within the Internet of Things and the smart world evolving around us, there is high demand for innovative IC packaging solutions to meet stringent performance, efficiency, and footprint requirements. As an industry leader, ASE was one of the world’s first providers of wafer level packaging, which enables the smallest package size possible, that being the same size as the die itself. ASE’s proven WLCSP portfolio includes an expanding scope of highly customizable options, encompassing technologies such as high density routing, very thin WLCSPs, low temperature processing, enhanced WLCSP Structures and materials, Wafer Level integrated passives, 3D WLPs, WL MEMS, and embedded die packaging.

“As Bosch Sensortec moved forward with our latest sensor technology, it was clear that we needed a solid and reliable partner that could effectively deliver both the technology and manufacturing capabilities required to bring our product to a dynamic market in a timely fashion,” said Wolfgang Lohner, Chief Financial Officer, Bosch Sensortec GmbH.

Lohner added, “ASE successfully delivered on both fronts, and this is testament to their demonstrated expertise and dedicated focus in evolving their technologies so we could deliver ours to our customers, and ultimately to the world beyond.”

“Semiconductor industry trends towards smaller and thinner form factors is providing major impetus for ASE to explore and develop unique packaging techniques using innovative material and process technologies,” said Fuyu Shih, Vice President of Sales and Marketing, ASE Europe. “ASE is continuously aligning the evolution of our packaging portfolio with the highly intricate technology requirements of our customer base, and our partnership with Bosch Sensortec encompassed key strategic collaboration on advanced technologies involving both WLCSP and TSV.”

Shih elaborated, “Driven by mutual desire to innovate and create, while addressing new demands related to product integration, mobility, and reliability, ASE is pleased that our deep technology integration with Bosch Sensortec produced a milestone sensor device, hence positioning them well within the market.”

About Bosch Sensortec GmbH

Bosch Sensortec GmbH is a fully owned subsidiary of Robert Bosch GmbH, dedicated to the consumer electronics world offering a complete portfolio of micro-electro mechanical systems (MEMS) sensors and solutions that enable mobile devices to feel and sense the world around them. Bosch Sensortec develops and markets a wide portfolio of MEMS sensors and solutions for smart phones, tablets, wearable devices and IoTS (Internet of Things & Services) applications.

The product portfolio includes 3-axis acceleration, gyroscope and geomagnetic sensors, integrated 6- and 9-axis as well as environmental sensors and a comprehensive software portfolio. Since its foundation in 2005 Bosch Sensortec emerged as the technology leader in the addressed markets. The Bosch Group has been the global market leader for MEMS sensors since 1998 and has to date sold more than 4 billion MEMS sensors.

For more information, go to www.bosch-sensortec.com.

About The ASE Group

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, the Group develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services through Universal Scientific Industrial Co Ltd, a member of the ASE Group. The Group generated sales revenues of US$7.4 billion in 2013 and currently employs 67,000 people worldwide.

For more information about the ASE Group, visit www.aseglobal.com.

More Stories By Business Wire

Copyright © 2009 Business Wire. All rights reserved. Republication or redistribution of Business Wire content is expressly prohibited without the prior written consent of Business Wire. Business Wire shall not be liable for any errors or delays in the content, or for any actions taken in reliance thereon.

Latest Stories
Extreme Computing is the ability to leverage highly performant infrastructure and software to accelerate Big Data, machine learning, HPC, and Enterprise applications. High IOPS Storage, low-latency networks, in-memory databases, GPUs and other parallel accelerators are being used to achieve faster results and help businesses make better decisions. In his session at 18th Cloud Expo, Michael O'Neill, Strategic Business Development at NVIDIA, focused on some of the unique ways extreme computing is...
Who are you? How do you introduce yourself? Do you use a name, or do you greet a friend by the last four digits of his social security number? Assuming you don’t, why are we content to associate our identity with 10 random digits assigned by our phone company? Identity is an issue that affects everyone, but as individuals we don’t spend a lot of time thinking about it. In his session at @ThingsExpo, Ben Klang, Founder & President of Mojo Lingo, discussed the impact of technology on identity. Sho...
The explosion of new web/cloud/IoT-based applications and the data they generate are transforming our world right before our eyes. In this rush to adopt these new technologies, organizations are often ignoring fundamental questions concerning who owns the data and failing to ask for permission to conduct invasive surveillance of their customers. Organizations that are not transparent about how their systems gather data telemetry without offering shared data ownership risk product rejection, regu...
SYS-CON Media announced today that @WebRTCSummit Blog, the largest WebRTC resource in the world, has been launched. @WebRTCSummit Blog offers top articles, news stories, and blog posts from the world's well-known experts and guarantees better exposure for its authors than any other publication. @WebRTCSummit Blog can be bookmarked ▸ Here @WebRTCSummit conference site can be bookmarked ▸ Here
SYS-CON Events announced today that CA Technologies has been named "Platinum Sponsor" of SYS-CON's 20th International Cloud Expo®, which will take place on June 6-8, 2017, at the Javits Center in New York City, New York, and 21st International Cloud Expo, which will take place in November in Silicon Valley, California.
You think you know what’s in your data. But do you? Most organizations are now aware of the business intelligence represented by their data. Data science stands to take this to a level you never thought of – literally. The techniques of data science, when used with the capabilities of Big Data technologies, can make connections you had not yet imagined, helping you discover new insights and ask new questions of your data. In his session at @ThingsExpo, Sarbjit Sarkaria, data science team lead ...
Bert Loomis was a visionary. This general session will highlight how Bert Loomis and people like him inspire us to build great things with small inventions. In their general session at 19th Cloud Expo, Harold Hannon, Architect at IBM Bluemix, and Michael O'Neill, Strategic Business Development at Nvidia, discussed the accelerating pace of AI development and how IBM Cloud and NVIDIA are partnering to bring AI capabilities to "every day," on-demand. They also reviewed two "free infrastructure" pr...
In his keynote at @ThingsExpo, Chris Matthieu, Director of IoT Engineering at Citrix and co-founder and CTO of Octoblu, focused on building an IoT platform and company. He provided a behind-the-scenes look at Octoblu’s platform, business, and pivots along the way (including the Citrix acquisition of Octoblu).
SYS-CON Events announced today that Hitrons Solutions will exhibit at the 19th International Cloud Expo, which will take place on November 1–3, 2016, at the Santa Clara Convention Center in Santa Clara, CA. Hitrons Solutions Inc. is distributor in the North American market for unique products and services of small and medium-size businesses, including cloud services and solutions, SEO marketing platforms, and mobile applications.
WebRTC is about the data channel as much as about video and audio conferencing. However, basically all commercial WebRTC applications have been built with a focus on audio and video. The handling of “data” has been limited to text chat and file download – all other data sharing seems to end with screensharing. What is holding back a more intensive use of peer-to-peer data? In her session at @ThingsExpo, Dr Silvia Pfeiffer, WebRTC Applications Team Lead at National ICT Australia, looked at differ...
With major technology companies and startups seriously embracing IoT strategies, now is the perfect time to attend @ThingsExpo 2016 in New York. Learn what is going on, contribute to the discussions, and ensure that your enterprise is as "IoT-Ready" as it can be! Internet of @ThingsExpo, taking place June 6-8, 2017, at the Javits Center in New York City, New York, is co-located with 20th Cloud Expo and will feature technical sessions from a rock star conference faculty and the leading industry p...
In his session at 20th Cloud Expo, Chris Carter, CEO of Approyo, will discuss the basic set up and solution for an SAP solution in the cloud and what it means to the viability of your company. Chris Carter is CEO of Approyo. He works with business around the globe, to assist them in their journey to the usage of Big Data in the forms of Hadoop (Cloudera and Hortonwork's) and SAP HANA. At Approyo, we support firms who are looking for knowledge to grow through current business process, where even ...
The Internet of Things can drive efficiency for airlines and airports. In their session at @ThingsExpo, Shyam Varan Nath, Principal Architect with GE, and Sudip Majumder, senior director of development at Oracle, discussed the technical details of the connected airline baggage and related social media solutions. These IoT applications will enhance travelers' journey experience and drive efficiency for the airlines and the airports.
Addteq is one of the top 10 Platinum Atlassian Experts who specialize in DevOps, custom and continuous integration, automation, plugin development, and consulting for midsize and global firms. Addteq firmly believes that automation is essential for successful software releases. Addteq centers its products and services around this fundamentally unique approach to delivering complete software release management solutions. With a combination of Addteq's services and our extensive list of partners,...
DevOps is being widely accepted (if not fully adopted) as essential in enterprise IT. But as Enterprise DevOps gains maturity, expands scope, and increases velocity, the need for data-driven decisions across teams becomes more acute. DevOps teams in any modern business must wrangle the ‘digital exhaust’ from the delivery toolchain, "pervasive" and "cognitive" computing, APIs and services, mobile devices and applications, the Internet of Things, and now even blockchain.