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Maxscend Partners with CEVA to Offer Complete Wi-Fi and Bluetooth Solutions for Mobile Platforms, Wearables and IoT Devices
Connectivity RF provider joins CEVAnet partner program; Multiple joint customers already leveraging Maxscend radio technology on SMIC and UMC processes with CEVA's Wi-Fi and Bluetooth IP Platforms
|By PR Newswire
|August 26, 2014 07:00 AM EDT
MOUNTAIN VIEW, Calif., Aug. 26, 2014 /PRNewswire/ -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP-based IP platforms for vision, audio, communications and connectivity, today announced that Maxscend Technologies Inc., a leading provider of highly integrated Radio Frequency (RF) IP for Wi-Fi® and Bluetooth®, has joined the CEVAnet partner program. Together the companies will offer complete solutions for Wi-Fi, Bluetooth and Bluetooth Low Energy, consisting of Maxscend RF IPs and CEVA's connectivity platforms, targeting the growing markets of mobile devices, wearables and the Internet of Things (IoT). The combined product offering has already been licensed and deployed by multiple customers, including Spreadtrum Communications, one of China's leading semiconductor companies.
In the highly competitive markets of mobile platforms, wearables and other IoT devices, designers increasingly need to create optimized solutions to satisfy the power and cost requirements. Integration of the wireless connectivity functionality is a key design goal for these designers. CEVA's market-leading Wi-Fi and Bluetooth IP platforms, combined with Maxscend's silicon-proven RF IPs, offer customers a low-risk, cost efficient solution to meet this goal.
Aviv Malinovitch, vice president and general manager of CEVA's Connectivity business unit, stated: "I am very pleased to announce Maxscend as the newest member of the CEVAnet partner program, expanding the RF partner options for our wireless connectivity customers. Maxscend has a strong track record in developing quality RF IP and has managed to achieve excellent market traction, especially in China, a key market for CEVA."
"We are delighted to partner with CEVA to address the Bluetooth and Wi-Fi connectivity markets," said Zhihan Xu, CEO of Maxscend. "Our Bluetooth Smart, Smart-Ready and Wi-Fi/Bluetooth combo RF IPs are an excellent complementary fit with CEVA's Wireless Connectivity IP platforms and we look forward to further expanding our joint customer base."
About CEVA Wireless Connectivity Platform IP
CEVA's Wireless Connectivity platform IP provides comprehensive software and hardware IP packages for Wi-Fi and Bluetooth. For Wi-Fi, CEVA offers solutions spanning 802.11a/b/g/n/ac for IoT and mobile devices up to leading-edge 802.11ac 4x4 MIMO for wireless Small Cells and Access Points.. For Bluetooth, both Smart (Low Energy BLE single mode) and Smart Ready (Classic EDR & BLE dual mode) solutions are available. Visit www.ceva-dsp.com for further details.
About Maxscend Connectivity RF IP
Maxscend's Connectivity RF IP portfolio includes optimized, very low power Bluetooth Smart radio, Bluetooth Smart Ready radio and combo Bluetooth / Wi-Fi (802.11 802.11b/g/n) radio. The radio IPs are available on a number of process nodes including SMIC 55nm and UMC 55nm and 110nm and may be ported to alternatives based on customer requirements.
About CEVA, Inc.
CEVA is the world's leading licensor of DSP-based IP platforms for vision, audio, communications and connectivity. CEVA's IP portfolio includes comprehensive technologies for computer vision and computational photography, advanced audio and voice processing, wireless baseband (2G, 3G & 4G LTE/LTE-A), connectivity (Wi-Fi & Bluetooth) and serial storage (SATA & SAS). In 2013, CEVA's IP was shipped in more than one billion devices, including 40% of handsets shipped worldwide, powering smartphones from many of the world's leading OEMs such as Coolpad, HTC, Huawei, Lenovo, LG, Nokia, Samsung, TCL, Xiaomi and ZTE. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp .
Maxscend Technologies Inc.
Maxscend Technologies is an award-wining company headquartered in JiangSu, with R&D centers located in Zhang Jiang High-tech Park, Shanghai and in Shenzhen. With a strong pedigree in RF CMOS design, its focus is on developing and marketing DTV and mobile DTV chipsets and in designing and licensing Bluetooth/Wi-Fi Connectivity RF IP. For further information please visit www.maxscend.com.
SOURCE CEVA, Inc.
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