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RFaxis Offers Bare Die Solution for its Entire Portfolio of Pure-CMOS Single-Chip, Single-Die RFeICs
|By Business Wire
|August 27, 2014 06:00 AM EDT
Inc., a leading fabless semiconductor company focused on developing
innovative, next-generation RF solutions for the wireless connectivity
and cellular mobility markets, today announced that it will be offering
its entire product line of pure-CMOS, single-chip / single-die RF
Front-end ICs (RFeICs)
in bare die form, enabling its customers to further reduce the size and
bill of materials (BOM) cost of wireless products for both the Wi-Fi and
Internet of Things (IoT) markets.
RFaxis has been in mass production of its RFeICs mostly in
industry-standard Quad Flat No-Lead (QFN) packages that range from 3x3mm
to 1.6x1.6mm in size. These RFeICs serve a wide spectrum of the
fast-growing wireless industry, including IEEE 802.11b/g/a/n/ac WLAN,
802.15.4 / ZigBee, Bluetooth / Bluetooth Low Energy, wireless audio /
video, home automation, smart energy, and many emerging applications for
Based on the company's patented single-chip / single-die RF
architecture, these RFeICs provide state-of-the-art performance to
guarantee robust RF link for wireless devices, at an ultra-low price.
"By offering customers a complete RF front-end in bare die form, we have
set the stage to redefine the landscape of RF for the wireless industry
yet again," said Mike Neshat, RFaxis' chairman and CEO. "RFaxis is the
only company that is shipping pure-CMOS RF front-end solutions with
uncompromised performance at utterly disruptive pricing. By gaining
access to bare die, our ODM/OEM customers, specifically our module
partners, will be able to offer more compact solutions at much lower
costs to their end customers."
"The target markets for our RFeICs continue to grow explosively, with
Wi-Fi shipments projected to exceed three billion units annually by
2017, and the IoT market to reach at least 50 billion units annually by
2020. Some industry experts forecast that the unit cost of IoT sensor
nodes will be nearing the $1 range in order to make them ubiquitous,
leaving little room for costly semiconductor components such as GaAs or
SiGe. With our pure-CMOS bare die solutions, we offer the industry the
much sought-after ultimate solution in terms of size, performance and
cost," Neshat concluded.
Traditionally, the RF front-end, which typically includes the power
amplifier (PA) to increase transmission distance, the low noise
amplifier (LNA) to optimize receive sensitivity, and the antenna switch,
has been implemented by stitching together several discrete ICs onto a
dielectric substrate or package lead-frame, forming the so-called RF
front-end module (FEM). RFaxis took a major departure from this
conventional practice. Using its patented technology, RFaxis provides
the same functionality and performance of traditional FEMs from
competitors, with one single-chip / single-die device, fabricated in
industry-standard CMOS process.
By offering its RFeIC products in bare die form, RFaxis has taken a
quantum leap to redefine the cost-size-performance standards of RF
front-end solutions for the wireless industry. The extremely rugged
designs of the RFaxis RFeICs, including robust ESD and high yield rate,
guarantee successful integration of our bare die with other RF
transceivers / SoCs into SiP (System-in-Package) or other forms of
wireless modules. As an example, the RFX1010,
a sub-GHz ZigBee/ISM RFeIC that integrates a half-watt PA, LNA and
antenna switch on a single die in standard 0.18um CMOS process, is an
integral part of an MCM offered by one of our transceiver partners which
has enabled the industry's highest-performance sub-GHz solution with
+27dBm transmit power. The RFX1010 has passed the most rigorous
qualification process required for industrial-grade applications such as
water and gas meters.
About RFaxis, Inc.
Launched in March 2009, RFaxis, Inc. is an Irvine, CA based company
specializing in the design and development of RF semiconductors. With
its patented technologies, the company leads the way in next-generation
wireless solutions designed for the multibillion dollar WLAN
802.11b/g/a/n/ac, MIMO, IoT / M2M, 802.15.4 / ZigBee, Bluetooth,
Bluetooth Low Energy, ANT, 6LoWPAN, AMR / AMI, and wireless audio/video
streaming markets. Leveraging pure CMOS, in conjunction with its own
innovative approaches, patented technologies and trade secrets, RFaxis
is home to the world's first RF Front-end Integrated Circuit (RFeIC™).
More information can be found at: www.rfaxis.com.
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