|By Business Wire||
|August 31, 2014 08:00 PM EDT||
CyberOptics® Corporation (NASDAQ:CYBE), a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will demonstrate its wireless measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration and airborne particle measurement, at SEMICON Taiwan in Booth #426 and #672 at the TWC in Nangang District, Taipei City, Sept. 3-5, 2014.
To address the market demand for airborne particle measurement in 150mm semiconductor, gallium arsenide (GaAs), LED and flat panel display fabs, CyberOptics will also highlight the new WaferSense Airborne Particle Sensor APS2 150C, its most recent extension of its APS line in a 150mm wafer form factor. The new APS2 150C incorporates advanced technology with a 60% increase in particle sensitivity at <10 false counts per hour.
“CyberOptics continues to help customers exceed manufacturing quality and productivity standards while improving equipment set-up, uptime and long term yields,” said Ferris Chen, Director of Sales, CyberOptics. “Semiconductor fabs and OEMs value the accuracy, efficiency and precision of the industry-leading wireless airborne particle sensor. Further increasing the particle sensitivity by 60% demonstrates our commitment to technology advancements that deliver even more value for our customers in terms of time and expense savings.”
With APS technology, equipment engineers can quickly and wirelessly monitor, identify and troubleshoot airborne particles in real-time within semiconductor process equipment and automated material handling systems. WaferSense® and ReticleSense™ Airborne Particle Sensors enable equipment engineers to shorten equipment qualification, release to production and maintenance cycles all while reducing expenses. Customers have experienced up to 88% time savings, up to 95% reduction in costs, and up to 20X the through-put with half the manpower resource requirements using the WaferSense APS relative to legacy surface scan wafer methods. The advanced technology capabilities result in increased particle sensitivity further maximizing these key customer benefits.
CyberOptics will showcase the full suite of industry-leading wireless WaferSense measurement devices including the Airborne Particle Sensor (APS), Auto Vibration System (AVS), Auto Leveling System (ALS), Auto Teaching System (ATS) and the Auto Gapping System (AGS). The recently announced ReticleSense Airborne Particle Sensor (APSR) measurement device will also be featured.
About the WaferSense Line
The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS) and the Airborne Particle Sensor (APS) are available now in 200mm, 300mm and 450mm wafer sizes. Additionally, both APS and ALS are available in 150mm sizes. The ReticleSense Airborne Particle Sensor (APSR) and ReticleSense Auto Leveling System (ALSR) products are available in a reticle shaped form factor.
For more information about the entire line of CyberOptics solutions please visit the company’s website at www.cyberoptics.com. The company has also launched a Chinese site to focus on needs of the Asia Pacific region at http://zh-cn.cyberoptics.com.
Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and through-put improvement solutions for the global electronic assembly and semiconductor capital equipment markets. Our products are deployed on production lines that manufacture surface mount technology circuit boards and semiconductor process equipment. Through internal development and acquisitions, CyberOptics is strategically repositioning itself to become a global leader in high-precision 3D sensors. Headquartered in Minneapolis, Minnesota, CyberOptics conducts worldwide operations through facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; unanticipated product development challenges; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; the level of revenue and loss we record in 2014; the success of our 3D technology initiatives; expectations regarding LDI and its impact on our operations; integration risks associated with LDI and other factors set forth in the Company’s filings with the Securities and Exchange Commission.
All names are trademarks of their respective companies.
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